Datasheet - Diodes Incorporated

DMP2033UVT
P-CHANNEL ENHANCEMENT MODE MOSFET
ADVANCED INFORMATION
Product Summary
Features
V(BR)DSS
RDS(ON) max
-20V
65mΩ @VGS = -4.5V
100mΩ @VGS = -2.5V
ID
TA = +25°C
-4.2A
-3.4A
Description
•
Low On-Resistance
•
Low Input Capacitance
•
Fast Switching Speed
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3) •
Qualified to AEC-Q101 standards for High Reliability
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Mechanical Data
•
Case: TSOT26
Applications
•
•
Backlighting
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Power Management Functions
•
Terminal Connections: See Diagram
•
DC-DC Converters
•
•
Motor Control
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Terminals: Finish – MatteTin annealed over Copper leadframe.
e3
Solderable per MIL-STD-202, Method 208
•
TSOT26
Weight: 0.0013 grams (approximate)
D
1
6
D
D
2
5
D
G
3
4
S
Top View
Pin-Out
Top View
Internal Schematic
Ordering Information (Note 4)
Notes:
Part Number
Case
Packaging
DMP2033UVT-7
TSOT26
3000/Tape & Reel
DMP2033UVT -13
TSOT26
10000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
20X = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
Chengdu A/T Site
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
Shanghai A/T Site
2012
Z
Feb
2
DMP2033UVT
Document number: DS36617 Rev. 2 - 2
Mar
3
2013
A
Apr
4
May
5
2014
B
Jun
6
1 of 5
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2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
March 2014
© Diodes Incorporated
DMP2033UVT
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Value
Drain-Source Voltage
Characteristic
VDSS
-20
V
Gate-Source Voltage
VGSS
±8
V
ID
-4.2
-3.4
A
IDM
-10
A
Steady
State
ADVANCED INFORMATION
Continuous Drain Current (Note 6)
TA = +25°C
TA = +70°C
Pulsed Drain Current (Note 6)
Units
Thermal Characteristics
Characteristic
Symbol
Value
PD
1.2
W
Steady State
RθJA
100
°C/W
PD
1.7
W
Steady State
RθJA
74
°C/W
TJ, TSTG
-55 to 150
°C
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Units
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
TJ = +25°C
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
-20
⎯
⎯
V
VGS = 0V, ID = -250µA
IDSS
⎯
⎯
-1.0
µA
VDS = -20V, VGS = 0V
IGSS
⎯
⎯
±100
nA
VGS = ±8V, VDS = 0V
VGS(th)
-0.5
V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS(ON)
⎯
—
-0.9
45
65
57
100
80
200
mΩ
VGS = -2.5V, ID = -3.4A
VGS = -1.8V, ID = -2A
|Yfs|
⎯
9
⎯
S
Input Capacitance
Ciss
⎯
845
⎯
pF
Output Capacitance
Coss
⎯
72
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
63
⎯
pF
Forward Transfer Admittance
VDS = VGS, ID = -250µA
VGS = -4.5V, ID = -4.2A
VDS = -5V, ID = -4A
DYNAMIC CHARACTERISTICS (Note 8)
VDS = -15V, VGS = 0V
f = 1.0MHz
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge
Qg
⎯
10.4
⎯
nC
Gate-Source Charge
Qgs
⎯
1.5
⎯
nC
Gate-Drain Charge
Qgd
⎯
1.9
⎯
nC
Turn-On Delay Time
tD(on)
⎯
6.5
⎯
ns
Turn-On Rise Time
tr
⎯
13.4
⎯
ns
Turn-Off Delay Time
tD(off)
⎯
51.5
⎯
ns
tf
⎯
21.8
⎯
ns
Turn-Off Fall Time
Notes:
VGS = -4.5V, VDS = -4V,
ID = -3.5A
VDS = -4V, VGS = -4.5V,
RG = 6Ω, ID = -1A
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMP2033UVT
Document number: DS36617 Rev. 2 - 2
2 of 5
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March 2014
© Diodes Incorporated
DMP2033UVT
20
20
18
16
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
18
VGS = -4.5V
16
VGS = -3V
14
VGS = -2.5V
12
VGS = -2V
VGS = -1.8V
10
8
6
VGS = -1.5V
VGS = -1.2V
2
12
10
8
6
T A = 150 °C
1
2
3
4
-VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
2
5
0.12
0.11
0.10
0.09
0.08
0.07
VGS = -2.5V
0.06
0.05
VGS = -4.5V
0.04
0.03
0.02
0.01
0
5
10
15
-ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
20
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
1.8
VGS = -4.5V
ID = -10A
1.6
1.4
VGS = -2.5V
ID = -5A
1.2
1.0
0.8
0.6
-50
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
0
0.00
14
4
4
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
ADVANCED INFORMATION
VDS = -5.0V
VGS = -8V
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMP2033UVT
Document number: DS36617 Rev. 2 - 2
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TA = 125°C
0
TA = 85°C
T A = 25°C
TA = -55°C
0.5
1
1.5
2
2.5
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
3
0.1
VGS = -4.5V
0.09
0.08
0.07
TA = 150°C
0.06
TA = 125°C
TA = 85° C
0.05
0.04
TA = 25° C
0.03
TA = -55° C
0.02
0.01
0
0
1
2
3
4
5
6
7
8
9
-ID, DRAIN SOURCE CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
10
0.1
0.09
0.08
0.07
0.06
0.05
VGS = -4.5V
ID = -10A
0.04
0.03
0.02
0.01
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
March 2014
© Diodes Incorporated
DMP2033UVT
20
VGS(TH), GATE THRESHOLD VOLTAGE (V)
18
-IS, SOURCE CURRENT (A)
1
-ID = 1mA
0.8
-ID = 250µA
0.6
0.4
16
14
T A= 150°C
12
10
0.2
TA= 125°C
T A= 25°C
8
6
TA= 85°C
TA= -55°C
4
2
0
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
0
0.3
0.6
0.9
1.2
1.5
-VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
8
10000
-VGS, GATE-SOURCE VOLTAGE (V)
f = 1MHz
CT, JUNCTION CAPACITANCE (pF)
ADVANCED INFORMATION
1.2
Ciss
1000
Coss
100
Crss
10
0
2
4
6
8 10 12 14 16 18
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
7
6
5
3
2
1
0
20
VDS = -4V
ID = -3.5A
4
0
2
4
6
8 10 12 14 16 18
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate-Charge Characteristics
20
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
D
e1
E
E1
L2
c
4x θ1
e
L
θ
6x b
A
A2
A1
DMP2033UVT
Document number: DS36617 Rev. 2 - 2
4 of 5
www.diodes.com
TSOT26
Dim Min Max Typ
A
1.00
−
−
A1
0.01 0.10
−
A2
0.84 0.90
−
D
2.90
−
−
E
2.80
−
−
E1
1.60
−
−
b
0.30 0.45
−
c
0.12 0.20
−
e
0.95
−
−
e1
1.90
−
−
L
0.30 0.50
L2
0.25
−
−
θ
0°
8°
4°
θ1
4°
12°
−
All Dimensions in mm
March 2014
© Diodes Incorporated
DMP2033UVT
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
ADVANCED INFORMATION
C
C
Dimensions Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
Y (6x)
X (6x)
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMP2033UVT
Document number: DS36617 Rev. 2 - 2
5 of 5
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March 2014
© Diodes Incorporated