Top View Features Directly mounts to target PCB (needs tooling holes) with hardware A 49.225mm [1.938"] Minimum real estate required Compression plate distributes forces evenly Clamshell lid A Materials: 10 42.60mm [1.677"] 1 2 Side View (Section AA) 3 Compression Plate: Black anodized 7075 Aluminum. Thickness = 12 mm. 4 Compression Screw: Clear anodized 7075 Aluminum. Height = 27 mm, Fluted Knob 4 5 1 6 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. Elastomer Guide: Non-clad FR4. Thickness = 0.75mm. 7 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 5/8" long. 8 Backing Plate: Black anodized 7075 Aluminum 9 IC guide: Ultem. 10 Latch: Black anodized 7075 Aluminum. 3 2 6 9 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm. Socket Base: Black anodized 7075 Aluminum. Height = 6 mm. 5 Customer's PCB 8 7 CG-BGA-4006 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: Vinayak R Date: 2/18/10 File: CG-BGA-4006 Dwg Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 5 Recommended PCB Layout Top View 16.00mm *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.00mm typ. Orientation Mark Ø 0.850mm±0.025mm (x2) 32.225mm±0.125mm 22.105mm Ø 0.51mmPAD 7.58mm±0.13mm 6.33mm±0.13mm 5.08mm Socket Size Backing Plate Size 2.7175mm Ø 1.61mm±0.05mm(x4) Mounting Hole 7.2375mm* 1.25mm±0.13mm 2.50mm±0.13mm 29.725mm Sqr. 32.600mm±0.125mm Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish 34.725mm±0.125mm Sqr. Datum DXF DATA WILL BE PROVIDED CG-BGA-4006 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: A Drawing: Vinayak R Date: 2/18/10 File: CG-BGA-4006 Dwg Modified: Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 5 Compatible BGA Spec D DETAIL Y 14.50mm X e 25.00mm 23.50mm E 3 Øb Ø0.25 Z X Y Ø0.10 16.00mm 0.20 TOP VIEW 5 DETAIL A Z 4 DIM 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 0.20 Z A1 BOTTOM VIEW SIDE VIEW 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.2 Z MIN MAX 2.41 A A1 0.4 0.6 b 0.50 0.70 D 18.00 BSC E 27.00 BSC e 1.0 BSC 17x26 Array CG-BGA-4006 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Rev: A Scale: - Drawing: Vinayak R Date: 2/18/10 File: CG-BGA-4006 Dwg Modified: PAGE 3 of 5 Backing Plate Ø 5.00mm (x4) 6.65mm Ø 5.00mm (x4) R 3.17mm (x4) 6.65mm 34.73mm 29.725mm±0.025mm (x4) Top View 4x 0-80 UNF Close Fit Note: Backing plate holes are tapped to accept 0-80 screws. 2.35mm Side View 6.35mm Description: Backing Plate with Insulation Plate CG-BGA-4006 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: Vinayak R Date: 2/18/10 File: CG-BGA-4006 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 5 49.22mm [1.938"] 60.37mm [2.377"] 47.60mm [1.874"] 10.22mm 7.61mm 24.61mm 58.61mm [2.308"] CG-BGA-4006 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 29.56mm Status: Released Scale: 1:1 Rev: A Drawing: Vinayak R Date: 2/18/10 File: CG-BGA-4006 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 5 of 5