STU/D417S

Green
Product
STU/D417S
S a mHop Microelectronics C orp.
Ver 1.3
P-Channel Logic Level Enhancement Mode Field Effect Transistor
PRODUCT SUMMARY
V DSS
R DS(ON) (m Ω) Typ
ID
FEATURES
Super high dense cell design for low R DS(ON).
Rugged and reliable.
14 @ VGS=-10V
-40V
Suface Mount Package.
-43A
23 @ VGS=-4.5V
G
D
G
S
STU SERIES
TO-252AA (D-PAK)
S
STD SERIES
TO-251 (I-PAK)
ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID
IDM
EAS
Drain Current-Continuous
a
a
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
±20
V
-43
V
A
TC=70°C
-34.4
A
-130
A
d
PD
Units
TC=25°C
b
-Pulsed
Sigle Pulse Avalanche Energy
Limit
-40
225
mJ
TC=25°C
42
W
TC=70°C
27
W
-55 to 150
°C
3
50
°C/W
THERMAL CHARACTERISTICS
R JC
Thermal Resistance, Junction-to-Case a
R JA
Thermal Resistance, Junction-to-Ambient
a
Details are subject to change without notice.
°C/W
Jan,26,2015
1
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STU/D417S
Ver 1.3
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage Current
IGSS
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
RDS(ON)
Drain-Source On-State Resistance
gFS
Forward Transconductance
Conditions
Min
VGS=0V , ID=-250uA
-40
Typ
VDS=-32V , VGS=0V
VGS= ±20V , VDS=0V
VDS=VGS , ID=-250uA
VGS=-10V , ID=-21.5A
-1.7
-2
Max
Units
V
uA
1
±100
nA
-3
V
VGS=-4.5V , ID=-16.8A
23
m ohm
m ohm
VDS=-10V , ID=-21.5A
44
S
VDS=-20V,VGS=0V
f=1.0MHz
2620
360
265
pF
pF
pF
VDD=-20V
ID=-1.0A
VGS=-10V
RGEN= 6 ohm
51
91
325
112
ns
ns
ns
ns
65
nC
14
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qgs
Qgd
Gate-Source Charge
c
VDS=-20V,ID=-21.5A,VGS=-10V
Gate-Drain Charge
VDS=-20V,ID=-21.5A,VGS=-4.5V
31
nC
VDS=-20V,ID=-21.5A,
VGS=-10V
6.2
19
nC
nC
VGS=0V,IS= -5A
-0.8
DRAIN-SOURCE DIODE CHARACTERISTICS
VSD
Diode Forward Voltage
b
-1.3
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_
_ 2%.
b.Pulse Test:Pulse Width < 300us, Duty Cycle <
c.Guaranteed by design, not subject to production testing.
d.Starting TJ=25°C,L=0.5mH,VDD = 20V .(See Figure13)
Jan,26,2015
2
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STU/D417S
Ver 1.3
70
35
V G S =-5V
V G S =-4.5V
56
-I D, Drain Current(A)
-ID, Drain Current(A)
V G S =-10V
V G S =-4V
42
28
V G S =-3.5V
14
V G S =-3V
28
21
T j=125 C
14
0
0
0
1.0
0.5
2.0
1.5
2.5
3.0
0
-VDS, Drain-to-Source Voltage(V)
25
1.4
R DS(on), On-Resistance
Normalized
RDS(on)(m Ω)
1.5
V G S =4.5V
15
V G S =10V
5
2.7
3.6
4.5
5.4
V G S =-10V
I D =-21.5A
1.3
1.2
1.1
V G S =-4.5V
I D =-16.8A
1.0
0
1
1
28
14
42
56
0
70
25
50
75
100
150
125
T j( C )
-I D, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Figure 4. On-Resistance Variation with Drain
Current and Temperature
BVDSS, Normalized
Drain-Source Breakdown Voltage
1.6
Vth, Normalized
Gate-Source Threshold Voltage
1.8
Figure 2. Transfer Characteristics
30
10
0.9
-V GS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
20
-55 C
25 C
7
V DS =V G S
I D =-250uA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature( ° C )
1.15
I D =-250uA
1.10
1.05
1.00
0.95
0.90
0.85
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Jan,26,2015
3
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STU/D417S
Ver 1.3
60
36
-Is, Source-drain current(A)
I D =-21.5A
RDS(on)(m Ω)
30
24
125 C
18
75 C
12
25 C
6
0
0
2
4
6
8
125 C
10
75 C
25 C
1
10
0
-VGS, Gate-to-Source Voltage(V)
0.6
0.9
1.2
1.5
-VSD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs.
Gate-Source Voltage
Figure 8. Body Diode Forward Voltage
Variation with Source Current
10
-V GS, Gate to Source Voltage(V)
3600
3000
C, Capacitance(pF)
0.3
C is s
2400
1800
1200
Cos s
600
C rs s
0
0
5
10
15
20
25
30
V DS = -20V
I D =-21.5A
8
6
4
2
0
0
-VDS, Drain-to-Source Voltage(V)
10 20
30
40 50
60
70 80
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
1000
TD(off )
100
-ID, Drain Current(A)
Switching Time(ns)
Tf
100
60
Tr
TD(on)
10
1
VDS=-20V,ID=-1A
VGS=-10V
1
10
R
Rg, Gate Resistance(Ω)
L im
it
1
10
1m
10
10
0.1
0.1
100
(
DS
)
ON
DC
0u
s
s
ms
VGS=-10V
Single Pulse
TA=25 C
1
10
100
-VDS, Drain-Source Voltage(V)
Figure 12. Maximum Safe Operating Area
Figure 11. switching characteristics
Jan,26,2015
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STU/D417S
Ver 1.3
V ( BR )D S S
15V
tp
D R IVE R
L
VDS
D .U .T
RG
+
- VD D
IA S
A
20V
tp
0.0 1
IAS
Unclamped Inductive Test Circuit
Unclamped Inductive Waveforms
F igure 13a.
F igure 13b.
2
1
Normalized Transient
Thermal Resistance
D=0.5
0.2
0.1
P DM
0.1
0.05
t1
t2
0.02
1.
2.
3.
4.
0.01
S ING LE P ULS E
R ɞJ A (t)=r (t) * R ɞJ A
R ɞJ A =S ee Datas heet
T J M-T A = P DM* R ɞJ A (t)
Duty C ycle, D=t1/t2
0.01
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Jan,26,2015
5
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STU/D417S
Ver 1.3
PACKAGE OUTLINE DIMENSIONS
TO-252
E
E1
b3
L3
D1
D
H
3
2
1
L4
b
b2
e
A
SYMBOLS
c2
A
A1
b
b2
b3
c
c2
D
D1
e
E
E1
H
L
L1
L2
L3
L4
DETAIL "A"
c
L2
L
L1
A1
MILLIMETERS
MIN
MAX
2.380
2.200
0.000
0.127
0.635
0.889
0.762
1.143
5.200
5.460
0.450
0.600
0.450
0.580
6.000
6.223
5.380
5.210
2.286 BSC
6.400
6.731
4.318
4.900
9.400
10.400
1.400
1.770
2.743 REF
0.508 BSC
1.270
0.890
0.640
1.010
10 °
0°
DETAIL "A"
Jan,26,2015
6
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STU/D417S
Ver 1.3
TO-251
A
E
b3
c2
D1
E1
D
H
1
2
3
b2
L4
L5
L
b
e
b4
SYMBOL
c
MILLIMETERS
MIN
MAX
E
6.350
6.731
L
3.700
4.400
L4
0.698 REF
L5
0.972
1.226
D
5.970
9.670
6.223
11.450
0.630
0.850
0.760
4.950
1.140
5.460
0.450
0.550
H
b
b2
b3
b4
e
A
c
c2
D1
E1
2.286 BSC
2.390
2.180
0.400
0.400
0.610
0.610
5.100
4.318
Jan,26,2015
7
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STU/D417S
Ver 1.3
TO-251 Tube/TO-252 Tape and Reel Data
TO-251 Tube
0.4
5.25
4.5
1.4
2.25
" A"
1.65
5.5
2~ӿ3.0
7.50
1.25
1.90
540 + 1.5
6.60
19.75
TO-252 Carrier Tape
B0
E
E2
T
E1
P1
P2
D1
K0
FEED DIRECTION
A0
D0
P0
UNIT:р
PACKAGE
TO-252
(16 р*
A0
6.96
²0.1
B0
10.49
²0.1
K0
2.79
²0.1
D0
D1
E
E1
E2
P0
P1
P2
T
ӿ2
ӿ1.5
+ 0.1
- 0
16.0
²0.3
1.75
²0.1
7.5
²0.15
8.0
²0.1
4.0
²0.1
2.0
²0.15
0.3
²0.05
TO-252 Reel
T
S
M
N
K
G
V
R
H
W
UNIT:р
TAPE SIZE
16 р
REEL SIZE
ӿ 330
M
ӿ330
² 0.5
N
W
ӿ97
² 1.0
17.0
+ 1.5
- 0
T
H
2.2
ӿ13.0
+ 0.5
- 0.2
K
S
10.6
2.0
²0.5
G
R
V
Jan,26,2015
8
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SDU/D417S
Ver 1.3
TOP MARKING DEFINITION
TO-252
SamHop Logo
STU417S
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Jan,26,2015
9
www.samhop.com.tw
STU/D417S
Ver 1.3
TOP MARKING DEFINITION
TO-251
SamHop Logo
STD417S
XXXXXX
Product No.
SMC internal code No. (A,B,C...Z)
Wafer Lot No.
Production Date (1,2 ~ 9, A,B.....)
Production Month (1,2 ~ 9, A,B,C)
Production Year (2009 = 9, 2010 = A.....)
Jan,26,2015
10
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