STS6308

STS6308
Green
Product
S a mHop Microelectronics C orp.
Ver 1.0
N-Channel Enhancement Mode Field Effect Transistor
FEATURES
Super high dense cell design for low R DS(ON).
PRODUCT SUMMARY
V DSS
ID
R DS(ON) (m Ω) Max
Rugged and reliable.
83 @ VGS= 10V
60V
Suface Mount Package.
3A
107 @ VGS= 4.5V
D
S OT 23
D
G
S
G
S
ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
Limit
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
±20
V
ID
Drain Current-Continuous
TC=25°C
3
A
TC=70°C
2.4
A
11.4
A
23
mJ
TC=25°C
1.25
W
TC=70°C
0.8
W
-55 to 150
°C
IDM
-Pulsed
a
b
d
EAS
Sigle Pulse Avalanche Energy
PD
Maximum Power Dissipation
TJ, TSTG
Operating Junction and Storage
Temperature Range
a
THERMAL CHARACTERISTICS
R JA
Thermal Resistance, Junction-to-Ambient
a
100
Details are subject to change without notice.
°C/W
Jul,15,2010
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STS6308
Ver 1.0
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol
Parameter
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Body Leakage Current
IGSS
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(th)
RDS(ON)
Drain-Source On-State Resistance
gFS
Forward Transconductance
Conditions
Min
VGS=0V , ID=250uA
60
Typ
Max
Units
1
±100
uA
nA
1.8
66
3
83
V
m ohm
VGS=4.5V , ID=2.6A
79
107
m ohm
VDS=5V , ID=3A
7.5
S
950
pF
pF
pF
V
VDS=48V , VGS=0V
VGS= ±20V , VDS=0V
VDS=VGS , ID=250uA
VGS=10V , ID=3A
1
c
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output
Capacitance
COSS
Reverse Transfer Capacitance
CRSS
SWITCHING CHARACTERISTICS
tD(ON)
Turn-On Delay Time
tr
Rise Time
tD(OFF)
Turn-Off Delay Time
tf
Fall Time
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDS=25V,VGS=0V
f=1.0MHz
52
40
c
VDD=30V
ID=1A
VGS=10V
RGEN= 6 ohm
ns
ns
ns
ns
15.7
12
VDS=30V,ID=3A,VGS=10V
21
18.5
15
nC
VDS=30V,ID=3A,VGS=4.5V
7
nC
1.8
3.5
nC
nC
VDS=30V,ID=3A,
VGS=10V
DRAIN-SOURCE DIODE CHARACTERISTICS
Diode Forward Voltage
VGS=0V,IS= 1A
VSD
0.795
1.2
V
Notes
_ 10sec.
a.Surface Mounted on FR4 Board,t <
_ 2%.
_ 300us, Duty Cycle <
b.Pulse Test:Pulse Width <
c.Guaranteed by design, not subject to production testing.
d.Starting TJ=25°C,L=0.5mH,VDD = 30V.(See Figure13)
Jul,15,2010
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STS6308
Ver 1.0
10
15
ID, Drain Current(A)
I D, Drain Current(A)
VGS=4V
VGS=10V
12
VGS=4.5V
9
VGS=3.5V
6
3
8
Tj=125 C
6
4
25 C
2
VGS=3V
-55 C
0
0
0
2.0
1.5
1.0
0.5
2.5
0
3.0
V DS, Drain-to-Source Voltage(V)
150
1.8
RDS(on), On-Resistance
Normalized
RDS(on)(m Ω)
2.0
120
VG S =4.5V
VG S =10V
30
3
1
6
9
12
3.6
5.4
4.5
V G S =10V
I D =3A
1.6
1.4
V G S =4.5V
I D = 2.6A
1.2
1.0
0
15
0
25
50
75
100
125
15 0
T j ( °C )
ID, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current
and Gate Voltage
Figure 4. On-Resistance Variation with Drain
Current and Temperature
1.6
BVDSS, Normalized
Drain-Source Breakdown Voltage
Vth, Normalized
Gate-Source Threshold Voltage
1
2.7
Figure 2. Transfer Characteristics
180
60
1.8
VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
90
0.9
V DS =V G S
I D =250uA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature(° C )
1.15
I D =250uA
1.10
1.05
1.00
0.95
0.90
0.85
-50
-25
0
25
50
75 100 125 150
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Breakdown Voltage Variation
with Temperature
Jul,15,2010
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STS6308
Ver 1.0
20.0
180
Is, Source-drain current(A)
I D =3A
150
125 C
RDS(on)(m Ω)
120
90
75 C
60
25 C
30
0
0
2
4
6
5.0
25 C
75 C
1.0
8
125 C
10.0
10
0
C, Capacitance(pF)
V GS, Gate to Source Voltage(V)
1200
Ciss
800
600
400
Coss
Crss
1.5
10
V DS = 30V
I D =3A
8
6
4
2
5
10
15
20
25
0
30
3
6
9
12 15
21 24
18
Qg, Total Gate Charge(nC)
V DS, Drain-to-Source Voltage(V)
Figure 9. Capacitance
Figure 10. Gate Charge
100
300
I D, Drain Current(A)
100
Switching Time(ns)
1.2
0
0
0
0.9
Figure 8. Body Diode Forward Voltage
Variation with Source Current
Figure 7. On-Resistance vs.
Gate-Source Voltage
200
0.6
V SD, Body Diode Forward Voltage(V)
V GS, Gate-to-Source Voltage(V)
1000
0.3
TD(off )
TD(on)
Tr
10
Tf
10
R
1
10
(O
N)
L im
it
10
10
1m
1
10
10
s
DC
0.1
0m
0u
us
s
s
s
VGS=10V
Single Pulse
TA=25 C
VDS=30V,ID=1A
VGS=10V
1
DS
0.01
100
0.1
1
10
60
Rg, Gate Resistance(Ω)
VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
Jul,15,2010
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STS6308
Ver 1.0
V ( BR )D S S
tp
L
V DS
D .U .T
RG
+
-
IA S
VDD
20V
tp
0.0 1
IAS
Unclamped Inductive Test Circuit
Unclamped Inductive Waveforms
F igure 13a.
F igure 13b.
Therma l R esis tance
Norm aliz ed Transien t
10
1
0.5
0.2
0. 1
P DM
0.1
t1
0.05
t2
0.02
Single Pulse
0.01
0.01
0.0000 1
1.
2.
3.
4.
0.000 1
0.001
0.01
0. 1
1
R thJ A (t)=r (t) * R thJ A
R thJ A =S ee Datas heet
T J M-T A = P DM* R thJ A (t)
Duty C ycle, D=t1/t2
10
100
1000
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
Jul,15,2010
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STS6308
Ver 1.0
PACKAGE OUTLINE DIMENSIONS
SOT 23
D
E1
1
2
e
b
DETAIL "A"
A1
e1
L
DETAIL "A"
A
E
3
SYMBOLS
D
E
E1
e
e1
b
C
A
A1
L
L1
L1
MILLIMETERS
INCHES
MIN
MAX
2.700
3.100
2.200
3.000
1.200
1.700
0.850
1.150
1.800
2.100
0.350
0.510
0.090
0.200
0.000
0.102
0.887
1.200
0.450 REF.
0.550 REF.
MIN
MAX
0.106
0.122
0.118
0.087
0.047
0.067
0.033
0.045
0.071
0.083
0.020
0.014
0.008
0.004
0.000
0.004
0.035
0.047
0.018 REF.
0.022 REF.
0
O
10
O
0
O
10
O
Jul,15,2010
6
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STS6308
Ver 1.0
SOT-23 Tape and Reel Data
SOT-23 Carrier Tape
TR
FEED DIRECTION
UNIT:р
PACKAGE
SOT-23
A0
3.20
²0.10
B0
3.00
²0.10
K0
D0
D1
E
E1
E2
P0
P1
P2
T
1.75
²0.10
3.50
²0.05
4.00
²0.10
4.00
²0.10
2.00
²0.05
0.20
²0.02
1.33
²0.10
О1.00
+0.25
О1.50
+0.10
8.00
+0.30
-0.10
SOT-23 Reel
UNIT:р
TAPE SIZE
REEL SIZE
M
N
W
W1
H
K
S
G
R
V
8р
О178
О178
²1
О60
²1
9.00
²0.5
12.00
²0.5
О13.5
!!²0.5
10.5
2.00
²0.5
О10.0
5.00
18.00
Jul,15,2010
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