Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 200mA Surface Mount Small Signal Schottky Diodes-40V Package outline SOT-23 0.014 (0.35) 0.034 (0.85) (B) 0.020 (0.51) .084(2.10) .068(1.70) 0.108 (2.70) 0.124 (3.10) • Low current rectification and high speed switching. • S mall surface mount type. • Up to 200mA current capability. • Low forward voltage drop (VF = 1.00V typ. @40mA) • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.042 (1.05) Features (C) (A) standards of MIL-STD-19500 /228 • High speed ( trr < 5 ns ) 0.072 (1.80) 0.024 (0.61) 0.012 (0.30) 0.047 (1.19) 0.120 (3.00) R 0.05 (0.002) 0.059 (1.47) 0.002 (0.05) Mechanical data 0.01 (0.25) 0.084 (2.10) 0.035 (0.88) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.008 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RRM 40 V Reverse voltage Peak forward surge current 40 V tp<10ms VR I FSM 600 mA Repetitive peak forward current tp<1s I FRM 200 mA Forward current IF 200 mA Junction temperature TJ -55 +125 o C Storage temperature T STG -65 +175 o C Forward voltage I F = 1 mA VF 0.38 V I F = 40 mA VF 1.0 V uA Reverse current V R = 30 V IR 1.0 Diode capacitance V R = 0 V, f = 1MH z CT 5.0 pF t rr 5 ns Reverse recovery time http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 I F = 10 mA, V R = 10mA, IRR = 0.1 X I R, RL=100 OHM Page 2 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Rating and characteristic curves for each diode (BAS40 / 04 / 05 / 06) FIG.1-TYPICAL FORWARD FIG.2 - TYPICAL REVERSE CHARACTERISTICS CHARACTERISTICS 100 REVERSE LEAKAGE CURRENT, (uA) FORWARD CURRENT,(mA) 100 O T A = 25 C 10 1 0.1 0 0.4 0.8 FORWARD VOLTAGE,(V) 10 (1) 1 (2) 0.1 0.01 (3) 0 1.2 0 10 20 30 REVERSE VOLTAGE, (V) (1) TA = 125 OC FIG.3-TYPICAL JUNCTION CAPACITANCE (2) TA = 85 OC (3) TA = 25 OC Fig. 4 FORWARD CURRENT DERTING h AVERAGE FORWARD CURRENT, mA JUNCTION CAPACITANCE,(pF) 500 4.0 3.0 2.0 1.0 0 0 10 20 400 300 200 100 30 0 0 REVERSE VOLTAGE,(V) 25 50 75 100 125 150 O AMBIENT TEMPERATURE( C) 820 OHM +10V 2K 100uH 0.1 uF IF tr tp t 0.1 uF t tr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. Notes: Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. » t Recovery Time Equivalent Test Circuit http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 Pinning information Type number Symbol Marking code A BAS40 B 40, B1 C A BAS40-06 B 46, L2 C A BAS40-05 B 45 C A BAS40-04 B 44, CB C Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 Reel packing PACKAGE REEL SIZE SOT-23 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 15,000 185*180*65 178 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 405*375*405 12.4 300,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7 Formosa MS SMD Small Signal Schottky Barrier Diode BAS40 / 04 / 05 / 06 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 7 Document ID Issued Date DS-221666 2008/02/10 Revised Date - Revision Page. A 7