Formosa MS Small Signal Schottky Diode RB521S List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7 Formosa MS Small Signal Schottky Diode RB521S 200mA Surface Mount Small Signal Schottky Diodes-30V Package outline Features 0.035(0.90) 0.028(0.70) • Low current rectification and high speed switching. • Extremely small surface mount type. • Up to 200mA current capability. • Low forward voltage drop (V F = 0.5V typ. @200mA) • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet exceeds environmental 0.014(0.35) 0.009(0.25) SOD-523FL 0.051(1.30) 0.043(1.10) standards of MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free parts, ex. RB521S-H. 0.007(0.20) 0.002(0.05) 0.028(0.70) 0.020(0.50) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOD-523FL • Terminals : Solder plated, solderable per 0.067(1.70) 0.059(1.50) MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.002 gram Maximum ratings and Electrical Characteristics (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT Repetitive peak reverse voltage V RM 30 V Continuous reverse voltage VR 30 V Mean rectifying current IO 200 mA I FSM 1000 mA Forward surge current 60Hz for 1cycle Operating temperature Storage temperature TJ -40 +125 o C T STG -40 +125 o C Forward voltage I F = 200 mA Reverse current V R = 10 V IR Diode capacitance V R = 10 V, f = 1MHz CT http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 VF Document ID Page 2 DS-221662 0.50 30 4.0 Issued Date 2008/02/10 V uA pF Revised Date Revision 2010/05/10 B Page. 7 FIG.1-TYPICAL FORWARD FIG.2 - TYPICAL REVERSE CHARACTERISTICS CHARACTERISTICS 1000mA 1mA o Ta=125 C 100mA Ta = 12 5 o C REVERSE CURRENT 100uA 10mA Ta = -2 25 o Ta = 7 100uA C 5 oC 5 oC 1mA 1uA o Ta=75 C 10uA o Ta=25 C 1uA o Ta=-25 C 100nA Ta = 10uA 0 0.1 0.2 0.3 0.4 0.5 0.6 10nA 0.7 0 FORWARD VOLTAGE,(V) 5 10 15 20 25 30 REVERSE VOLTAGE,(V) 35 FIG.4- DERATING CURVE FIG.3-TYPICAL TERMINALS CAPACITANCE 100 f=1MHz Io CURRENT, (%) CAPACITANCE BETWEEN TERMINALS ,(pF) INSTANTANEOUS FORWARD CURRENT Rating and characteristic curves (RB521S) 10 1 0 5 10 15 20 25 30 35 REVERSE VOLTAGE,(V) AMBIENT TEMPERATURE,(°C) (mounting on glass epoxy PCBs) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7 Formosa MS Small Signal Schottky Diode RB521S Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code RB521S C Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SOD-523FL 0.032 (0.80) 0.024 (0.60) 0.044 (1.10) Document ID Page 4 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7 Formosa MS Small Signal Schottky Diode RB521S Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 0.90 1.94 0.76 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 178.00 50.00 13.00 1.75 3.50 2.00 4.00 2.00 0.23 8.00 9.50 Item SOD-523FL Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7 Formosa MS Small Signal Schottky Diode RB521S Reel packing PACKAGE SOD-523FL REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) 7" 3,000 4.0 BOX (pcs) INNER BOX (m/m) 30,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7 Formosa MS Small Signal Schottky Diode RB521S High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 60Hz for 1cycle MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 Document ID Page 7 DS-221662 Issued Date 2008/02/10 Revised Date Revision 2010/05/10 B Page. 7