Datenblatt

5051
Kompakter SMT-Board-to-Board Verbinder - RM 0,50mm
Compact SMT-Board to Board Connector - 0,50mm Pitch
Series
Type *
5051
1
1 Stift; H=2.40mm
Male; H=2.40mm
2 Stift; H=2,90mm
Male; H=2,90mm
3 Stift; H=3,90mm
Male; H=´3,90mm
4 Stift; H=4,40mm
Male, H=4,40mm
TEL +49 5223 98507-0
FAX +49 5223 98507-50
Contacts *
040
10-50 60 80 90 100 120
© W+P PRODUCTS
Technische Daten /Technical Data
Isolierkörper
Thermoplastischer Kunststoff, nach UL94 V-0
Insulator
Thermoplastic, rated UL94 V-0
Kontaktmaterial
Phosphorbronze
Contact Material
Phosphor bronze
Kontaktoberfläche
Gold über Nickel
Contact Surface
Gold over nickel
Lötbarkeit
IEC512-12A
Solderability
IEC512-12A
Durchgangswiderstand
< 50mΩ
Contact Resistance
< 50mΩ
Isolationswiderstand
> 100MΩ
Insulation Resistance
> 100MΩ
Spannungsfestigkeit
100VDC
Test Voltage
100VDC
Nennspannung
50V AC/DC
Voltage Rating
50V AC/DC
Nennstrom
0,5A
Current Rating
0,5A
Temperaturbereich
-20°C ... +125°C
Temperature Range
-20°C ... +125°C
Verarbeitung
Reflow-Lötverfahren; weitere Informationen in Kapitel T
Processing
Reflow soldering, detailed information in ch. T
Plating
00
00 Vergoldet
Gold plated
Packing *
PPTR
PPST
PPTR
E-MAIL [email protected]
WEBSITE www.wppro.com
1
5051
Kompakter SMT-Board-to-Board Verbinder - RM 0,50mm
Compact SMT-Board to Board Connector - 0,50mm Pitch
Series
5051
Type *
5
5 Buchse; H=2,20mm
Female; H=2,20mm
6 Buchse; H=2,70mm
Female, H=2,70mm
7 Buchse; H=3,20mm
Female; H=3,20mm
8 Buchse; H=3,00mm
Female, H=3,00mm
9 Buchse; H=3,50mm
Female, H=3,50mm
* Dies ist ein Bestellbeispiel bitte durch Ihre Spezifikationen ersetzen.
* This is an order example please replace by your specifications.
TEL +49 5223 98507-0
FAX +49 5223 98507-50
2
Contacts *
040
Plating
Packaging *
00
PPTR
10-50 60 80 90 100 00 Vergoldet
120
Gold plated
PPST In Stangen mit PP-Pad
In tubes w/ PP-Pad
PPTR Tape & Reel Verpackung mit PP-Pad
Tape & Reel packing w/ PP-Pad
Lieferformen / Packing Options:
PPST In Stangen mit PP-Pad / In tubes w/ PP-Pad
PPTR Tape & Reel Verpackung mit PP-Pad / Tape & Reel packing w/ PP-Pad
E-MAIL [email protected]
WEBSITE www.wppro.com
Informationen zum Reflow-Lötverfahren
Reflow-Soldering Information
Reflow-Lötempfehlung
Reflow Soldering Recommendation
Die Bauteile sollten gemäß folgendem TemperaturProfil in Anlehnung an die IPC/JEDEC J_STD-020C für
bleifreies Löten im Reflow-Verfahren verarbeitet werden
(Maximalwerte).
Items should be solderes according to IPC/JEDEC
J-STD-020C temperature profile for leadfree reflow
soldering (maximum values).
TEL +49 5223 98507-0
FAX +49 5223 98507-50
Profileigenschaft
Kennwert
Temperatur Minimum TSmin
150°C
Temperatur Maximum TSmax
200°C
Dauer TSmin - TSmax
60-180s
Temperatur Lötbereich TL
217°C
Verweildauer oberhalb TL
60-180s
Ramp-Up Rate TSmax - TP
max. 3°C / s
Höchsttemperatur TP
260°C ±5
Dauer Höchsttemperatur
20-40s
Ramp-Down Rate TPmax - TSmin
6°C
Dauer 25°C - Höchsttemperatur TP
Max. 8 min
Profile Feature
Key Values
Minimum Temperature TSmin
150°C
Maximum Temperatur TSmax
200°C
Duration TSmin - TSmax
60-180s
Soldering Range Temperature TL
217°C
Duration above TL
60-180s
Ramp-Up Rate TSmax - TP
max. 3°C / s
Peak Temperature TP
260°C ±5
Duration Peak Temperature
20-40s
Ramp-Down Rate TPmax - TSmin
6°C
Duration 25°C - Peak Temp. TP
Max. 8 min
E-MAIL [email protected]
WEBSITE www.wppro.com
3
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