Datasheet

SSF7504
Feathers:
ID=220A
„
Advanced trench process technology
„
Special designed for Convertors and power controls
„
High density cell design for ultra low Rdson
„
Fully characterized Avalanche voltage and current
„
Avalanche Energy 100% test
BV=75V
Rdson=2.7mΩ(typ.)
Description:
The SSF7504 is a new generation of middle voltage and
high current N–Channel enhancement mode trench power
MOSFET. This new technology increases the cell density
and reduces the on-resistance; its typical Rdson can reduce
to 2.7mohm.
Application:
„
Power switching application
SSF7504 TOP View (TO220)
Absolute Maximum Ratings
Parameter
Max.
[email protected]=25ْ C
Continuous drain current,[email protected]
220
[email protected]=100ْC
Continuous drain current,[email protected]
170
IDM
Pulsed drain current ①
880
[email protected]=25ْC
Power dissipation
370
W
Linear derating factor
2.0
W/ْ C
VGS
Gate-to-Source voltage
±20
V
dv/dt
Peak diode recovery voltage
20
v/ns
EAS
Single pulse avalanche energy
960
mJ
EAR
Repetitive avalanche energy
TJ
Operating Junction and
TSTG
Storage Temperature Range
②
Units
A
TBD
–55 to +175
ْC
Thermal Resistance
Parameter
Min.
Typ.
Max.
RθJC
Junction-to-case
—
0.41
—
RθJA
Junction-to-ambient
—
—
62
Units
ْC/W
Electrical Characteristics @TJ=25ْ C(unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Test Conditions
BVDSS
Drain-to-Source breakdown voltage
75
—
—
V
VGS=0V,ID=250μA
RDS(on)
Static Drain-to-Source on-resistance
—
2.7
4
mΩ
VGS=10V,ID=40A
VGS(th)
Gate threshold voltage
2.0
3.1
4.0
V
VDS=VGS,ID=250μA
gfs
Forward transconductance
—
65
—
S
VDS=5V,ID=30A
—
—
10
IDSS
Drain-to-Source leakage current
©Silikron Semiconductor CO.,LTD.
2010.5.2
—
—
50
VDS=80V,VGS=0V
μA
Version : 1.0
VDS=80V,
VGS=0V,TJ=150ْC
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SSF7504
Gate-to-Source forward leakage
—
—
100
Gate-to-Source reverse leakage
—
—
-100
Qg
Total gate charge
—
140
—
Qgs
Gate-to-Source charge
—
30
—
Qgd
Gate-to-Drain("Miller") charge
—
36
—
VGS=10V
td(on)
Turn-on delay time
—
22
—
VDD=30V
tr
Rise time
—
35
—
td(off)
Turn-Off delay time
—
77.8
—
tf
Fall time
—
19.8
—
VGS=10V
Ciss
Input capacitance
—
7005
—
VGS=0V
Coss
Output capacitance
—
600
—
Crss
Reverse transfer capacitance
—
280
—
IGSS
VGS=20V
nA
VGS=-20V
ID=30A
VDD=30V
nC
ID=2A ,RL=15Ω
nS
RG=2.5Ω
VDS=25V
pF
f=1.0MHZ
Source-Drain Ratings and Characteristics
Parameter
Continuous Source Current
IS
.
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) ①
.
Min.
Typ.
Max.
—
—
220
Units
MOSFET symbol
A
—
—
880
Test Conditions
showing the
integral reverse
p-n junction diode.
VSD
Diode Forward Voltage
—
—
1.3
V
TJ=25ْC,IS=40A,VGS=0V ③
trr
Reverse Recovery Time
-
80
—
nS
TJ=25ْC,IF=75A
Qrr
Reverse Recovery Charge
-
270
—
nC
di/dt=100A/μs ③
ton
Forward Turn-on Time
Intrinsic turn-on time is negligible (turn-on is dominated by Ls + LD)
Notes:
① Repetitive rating; pulse width limited by max junction temperature.
② Test condition: L =0.3mH, ID = 80A, VDD = 37.5V
③ Pulse width≤300μS; duty cycle≤1.5% RG = 25ΩStarting TJ = 25°C
EAS test circuits:
Gate charge test circuit:
BV dss
©Silikron Semiconductor CO.,LTD.
2010.5.2
Version : 1.0
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SSF7504
Switch Waveforms:
Switch Time Test Circuit:
Figure1:Transfer Characteristic
Figure2:Capacitance
Figure3:On Resistance vs Junction Temperature
Figure4:Breakdown Voltage vs Junction
Temperature
©Silikron Semiconductor CO.,LTD.
2010.5.2
Version : 1.0
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SSF7504
Figure5:Gate Charge
Figure6:Source-Drain Diode Forward Voltage
Figure7:Safe Operation Area
Figure8:Max Drain Current vs Junction Temperature
Figure9:Transient Thermal Impedance Curve
©Silikron Semiconductor CO.,LTD.
2010.5.2
Version : 1.0
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SSF7504
TO220 MECHANICAL DATA:
©Silikron Semiconductor CO.,LTD.
2010.5.2
Version : 1.0
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