LGA Package 66-Lead (15mm × 9mm × 2.32mm) aaa Z (Reference LTC DWG # 05-08-1807 Rev B) 15.00 BSC X 12.70 BSC 2.19 – 2.45 Y SEE NOTES 7 0.864 – 0.914 G F 0.864 – 0.914 MOLD CAP 9.00 BSC SUBSTRATE D C Z bbb Z 4 7.620 BSC 0.29 – 0.35 1.90 – 2.10 PAD “A1” CORNER E DETAIL A B 1.27 BSC A aaa Z PACKAGE TOP VIEW 6.350 5.080 3.810 2.540 1.270 0.4445 0.000 0.4445 1.270 2.540 3.810 5.080 6.350 DETAIL A PACKAGE SIDE VIEW PADS SEE NOTES 11 10 9 8 7 6 4 5 3 PACKAGE BOTTOM VIEW 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3.810 2.540 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 1.270 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.4445 0.000 0.4445 6. THE TOTAL NUMBER OF PADS: 66 7 1.270 2.540 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 3.810 SUGGESTED PCB LAYOUT TOP VIEW LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 66 0113 REV B 2 1 PAD 1