05-08-1807

LGA Package
66-Lead (15mm × 9mm × 2.32mm)
aaa Z
(Reference LTC DWG # 05-08-1807 Rev B)
15.00
BSC
X
12.70
BSC
2.19 – 2.45
Y
SEE NOTES
7
0.864 – 0.914
G
F
0.864 – 0.914
MOLD
CAP
9.00
BSC
SUBSTRATE
D
C
Z
bbb Z
4
7.620
BSC
0.29 – 0.35
1.90 – 2.10
PAD “A1”
CORNER
E
DETAIL A
B
1.27
BSC
A
aaa Z
PACKAGE TOP VIEW
6.350
5.080
3.810
2.540
1.270
0.4445
0.000
0.4445
1.270
2.540
3.810
5.080
6.350
DETAIL A
PACKAGE SIDE VIEW
PADS
SEE NOTES
11
10
9
8
7
6
4
5
3
PACKAGE BOTTOM VIEW
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.810
2.540
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
1.270
5. PRIMARY DATUM -Z- IS SEATING PLANE
0.4445
0.000
0.4445
6. THE TOTAL NUMBER OF PADS: 66
7
1.270
2.540
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
3.810
SUGGESTED PCB LAYOUT
TOP VIEW
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 66 0113 REV B
2
1
PAD 1
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