ESD205-B1-02EL Data Sheet (970 KB, EN)

Protection Device
TVS (Transient Voltage Suppressor)
ESD205-B1 Series
Bi-directional, 5.5 V, 5 pF, 0201, 0402, RoHS and Halogen Free compliant
ESD205-B1-02ELS
ESD205-B1-02EL
Data Sheet
Revision 1.4, 2014-05-14
Final
Power Management & Multimarket
Edition 2014-05-14
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com)
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
ESD205-B1 Series
Product Overview
1
Product Overview
1.1
Features
•
•
•
•
•
•
ESD / transient protection of signal lines in low voltage applications according to:
– IEC61000-4-2 (ESD): ±20 kV (air / contact)
– IEC61000-4-4 (EFT): ±2.5 kV / ±50 A (5/50 ns)
– IEC61000-4-5 (Surge): ±2.5 A (8/20 μs)
Bi-directional, working voltage up to VRWM = ±5.5 V
Low capacitance: CL = 5 pF (typical)
Low clamping voltage: VCL = +10 / -12 V (typical) at ITLP = 16 A
Very low reverse current: IR < 1 nA (typical)
Pb-free (RoHS compliant) and halogen free package
1.2
•
•
•
Application Examples
Keypad, touchpad, buttons, convenience keys
LCD displays, Camera, audio lines, mobile communication, Consumer products (E-Book, MP3, DVD, DSC...)
Notebooks tablets and desktop computers and their peripherals
1.3
Product Description
Pin 1 marking
(lasered)
Pin 1
Pin 1
Pin 2
Pin 2
PinConf_and_SchematicDiag.vsd
Figure 1-1 Pin Configuration and Schematic Diagram
Table 1-1
Ordering Information
Type
Package
Configuration
Marking code
ESD205-B1-02ELS
TSSLP-2-3
1 line, bi-directional
I
ESD205-B1-02EL
TSLP-2-19
1 line, bi-directional
I
Final Data Sheet
3
Revision 1.4, 2014-05-14
ESD205-B1 Series
Maximum Ratings
2
Maximum Ratings
Table 2-1
Maximum Ratings at TA = 25 °C, unless otherwise specified
Parameter
Symbol
1)
Values
Unit
ESD air discharge
ESD contact discharge1)
VESD
±20
±20
kV
Peak pulse power2)
PPK
30
W
Peak pulse current2)
IPP
±2.5
A
Operating temperature range
TOP
-55 to 125
°C
Storage temperature
1) VESD according to IEC61000-4-2
Tstg
-65 to 150
°C
2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
3
Electrical Characteristics at TA = 25 °C, unless otherwise specified
( )!! %! )*
!
+! )#! % ##%# !"!!""!" #$%"&!'!! Figure 3-1 Definitions of electrical characteristics
Final Data Sheet
4
Revision 1.4, 2014-05-14
ESD205-B1 Series
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Table 3-1
DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Reverse working voltage VRWM
-5.5
–
5.5
V
Trigger voltage
Vt1
6
–
–
V
Holding voltage
Vh
6
8
10
V
IT = 1 mA
Reverse current
IR
–
<1
100
nA
VR = 5.5 V
Unit
Note / Test Condition
Table 3-2
AC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Min.
Typ.
Max.
Line capacitance
CL
4
–
5
5
7
–
pF
VR = 0 V, f = 1 MHz
VR = 0 V, f = 1 GHz
Series inductance
LS
–
–
0.2
0.4
–
–
nH
ESD205-B1-02ELS
ESD205-B1-02EL
Table 3-3
ESD and SurgeCharacteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Clamping voltage
1)
VCL
Values
Min.
Typ.
Max.
–
10
–
Unit
Note / Test Condition
V
ITLP = 16 A, tp = 100 ns
from Pin 1 to Pin 2
–
13
–
ITLP = 30 A, tp = 100 ns
from Pin 1 to Pin 2
–
12
–
ITLP = 16 A, tp = 100 ns
from Pin 2 to Pin 1
–
17
–
ITLP = 30 A, tp = 100 ns
from Pin 2 to Pin 1
2)
Clamping voltage
–
8
–
IPP = 1 A, tp = 8/20 µs
from Pin 1 to Pin 2
–
8.5
–
IPP = 2.5 A, tp = 8/20 µs
from Pin 1 to Pin 2
–
8
–
IPP = 1 A, tp = 8/20 µs
from Pin 2 to Pin 1
–
9
–
IPP = 2.5 A,tp = 8/20 µs
from Pin 2 to Pin 1
Dynamic resistance
1)
RDYN
–
0.2
–
Ω
Pin 1 to Pin 2
–
0.3
–
Ω
Pin 2 to Pin 1
1) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps.
2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5
Final Data Sheet
5
Revision 1.4, 2014-05-14
ESD205-B1 Series
Typical Characteristics Diagrams
4
Typical Characteristics Diagrams
Typical characteristics diagrams at TA = 25°C, unless otherwise specified
10-6
10-7
-8
IR [A]
10
-9
10
10-10
-11
10
10-12
-6
-5
-4
-3
-2
-1
0
1
VR [V]
2
3
4
5
6
5
6
Figure 4-1 Reverse leakage current: IR = f (VR)
7
6
1 GHz
CL [pF]
5
4
3
1 MHz
2
1
0
-6
-5
-4
-3
-2
-1
0
VR [V]
1
2
3
4
Figure 4-2 Line capacitance: CL = f (VR)
Final Data Sheet
6
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ESD205-B1 Series
Typical Characteristics Diagrams
70
60
VCL [V]
50
VCL-max-peak = 45.0 [V]
40
VCL-30ns-peak = 10.7 [V]
30
20
10
0
-10
-100
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 4-3 Clamping voltage (ESD): VCL = f(t), 8 kV positive pulse from pin 1 to pin 2
10
0
VCL [V]
-10
-20
-30
VCL-max-peak = -66.7 [V]
-40
VCL-30ns-peak = -9.7 [V]
-50
-60
-70
-100
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 4-4 Clamping voltage (ESD) VCL = f(t), 8 kV negative pulse from pin 1 to pin 2
Final Data Sheet
7
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ESD205-B1 Series
VCL [V]
Typical Characteristics Diagrams
110
100
90
80
70
60
50
40
30
20
10
0
-10
-20
-100
VCL-max-peak = 74.5 [V]
VCL-30ns-peak = 12.0 [V]
0
100
200
300
400 500
tp [ns]
600
700
800
900
VCL [V]
Figure 4-5 Clamping voltage (ESD) VCL = f(t), 15 kV positive pulse from pin 1 to pin 2
20
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-100
VCL-max-peak = -96.9 [V]
VCL-30ns-peak = -15.6 [V]
0
100
200
300
400 500
tp [ns]
600
700
800
900
Figure 4-6 Clamping voltage (ESD) VCL = f(t), 15 kV negative pulse from pin 1 to pin 2
Final Data Sheet
8
Revision 1.4, 2014-05-14
ESD205-B1 Series
Typical Characteristics Diagrams
40
20
ESD205-B1 Series
RDYN
30
15
20
10
10
5
0
0
-10
-5
-20
-10
Equivalent VIEC [kV]
ITLP [A]
RDYN = 0.2 Ω
RDYN = 0.3 Ω
-30
-40
-20
-15
-15
-10
-5
0
5
10
15
-20
20
VTLP [V]
Figure 4-7 Clamping voltage (TLP): ITLP = f(VTLP)[1], pin 1 to pin 2
Final Data Sheet
9
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ESD205-B1 Series
Typical Characteristics Diagrams
4
ESD205-B1 Series
3
2
IPP [A]
1
0
-1
-2
-3
-4
-15
-10
-5
0
VCL [V]
5
10
15
Figure 4-8 Clamping voltage (Surge): IPP = f(VCL)[1], pin 1 to pin 2
Final Data Sheet
10
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ESD205-B1 Series
Typical Characteristics Diagrams
Figure 4-9 Insertion loss vs. frequency in a 50 Ω system
Final Data Sheet
11
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ESD205-B1 Series
Package Information
5
Package Information
5.1
TSSLP-2-3
Top view
Bottom view
0.31 +0.01
-0.02
0.32 ±0.05
0.355
0.62 ±0.05
2
0.05 MAX.
Pin 1
marking
0.26 ±0.035
0.2 ±0.035 1)
1
1)
1) Dimension applies to plated terminals
TSSLP-2-3, -4-PO V01
Figure 5-1 TSSLP-2-3 Package outline
0.19
0.24
Solder mask
0.19
0.57
0.14
0.62
Copper
0.19
0.27
0.24
0.32
Stencil apertures
TSSLP-2-3, -4-FP V02
Figure 5-2 TSSLP-2-3 Footprint
0.35
Tape type
Ex Ey
Punched Tape
0.43 0.73
Embossed Tape 0.37 0.67
8
Ey
4
Pin 1
marking
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
Ex
TSSLP-2-3, -4-TP V03
Figure 5-3 TSSLP-2-3 Packing
Figure 5-4 TSSLP-2-3 Marking example, Type code see: Table 1-1 “Ordering Information” on Page 3
Final Data Sheet
12
Revision 1.4, 2014-05-14
ESD205-B1 Series
Package Information
5.2
TSLP-2-19
Top view
Bottom view
0.31 +0.01
-0.02
0.6 ±0.05
0.05 MAX.
1±0.05
0.65 ±0.05
2
0.25 ±0.035 1)
1
0.5 ±0.035 1)
Pin 1
marking
1) Dimension applies to plated terminals
TSLP-2-19, -20-PO V01
Figure 5-5 TSLP-2-19 Package outline
0.28
0.35
Solder mask
0.38
0.93
0.3
1
Copper
0.28
0.45
0.35
0.6
Stencil apertures
TSLP-2-19, -20-FP V01
Figure 5-6 TSLP-2-19 Footprint
0.4
1.16
Pin 1
marking
8
4
0.76
TSLP-2-19, -20-TP V02
Figure 5-7 TSLP-2-19 Packing
Type code
12
Pin 1 marking
Figure 5-8 TSLP-2-19 Marking example, Type code see: Table 1-1 “Ordering Information” on Page 3
Final Data Sheet
13
Revision 1.4, 2014-05-14
ESD205-B1 Series
References
References
[1]
Infineon AG - Application Note AN210: Effective ESD Protection design at System Level Using VF-TLP
Characterization Methodology
[2]
Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Packages
Final Data Sheet
14
Revision 1.4, 2014-05-14
ESD205-B1 Series
Revision History: Revision 1.3,.2013-03-08
Page or Item
Subjects (major changes since previous revision)
Revision 1.4, 2014-05-14
All
New type ESD205-B1-02EL inserted
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Final Data Sheet
15
Revision 1.4, 2014-05-14
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Published by Infineon Technologies AG
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