PHILIPS TDA8761M

INTEGRATED CIRCUITS
DATA SHEET
TDA8761
9-bit analog-to-digital converter for
digital video
Preliminary specification
File under Integrated Circuits, IC02
Philips Semiconductors
1995 Mar 20
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
FEATURES
APPLICATIONS
• 9-bit resolution
Analog-to-digital conversion for:
• Sampling rate up to 30 MHz
• Video data digitizing
• DC sampling allowed
• Digital Video Broadcasting (DVB)
• One clock cycle conversion only
• Cable TV.
• High signal-to-noise ratio over a large analog input
frequency range (8.5 effective bits at 10 MHz full-scale
input at fclk = 30 MHz)
GENERAL DESCRIPTION
The TDA8761 is a 9-bit analog-to-digital converter (ADC)
for professional video and digital video set box
applications. It converts the analog input signal into 9-bit
binary-coded digital words at a maximum sampling rate of
30 MHz. Its linearity performance ensures the required
conversion accuracy in case of 256QAM demodulator
concept and for all symbol frequencies. All digital inputs
and outputs are TTL compatible, although a low-level sine
wave clock input signal is allowed.
• No missing codes guaranteed
• In range (IR) 3-state TTL output
• TTL compatible digital inputs and outputs
• Low-level AC clock input signal allowed
• External reference voltage regulator
• Power dissipation only 360 mW (typical)
• Low analog input capacitance, no buffer amplifier
required
• No sample-and-hold circuit required.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCCA
analog supply voltage
4.75
5.0
5.25
V
VCCD
digital supply voltage
4.75
5.0
5.25
V
VCCO
output stages supply voltage
4.4
5.0
5.25
V
ICCA
analog supply current
−
30
tbf
mA
ICCD
digital supply current
−
22
tbf
mA
ICCO
output stages supply current
−
22
tbf
mA
AINL
AC integral non-linearity
note 1; full scale input sine wave
−
±0.75
tbf
LSB
note 1; 50% full scale input sine wave
−
±0.5
tbf
LSB
ADNL
AC differential non-linearity
note 1; full scale input sine wave
−
±0.5
tbf
LSB
note 1; 50% full scale input sine wave
−
±0.3
tbf
LSB
fclk(max)
maximum clock frequency
30
−
−
MHz
Ptot
total power dissipation
−
360
tbf
mW
Note
1. fi = 11 MHz and fclk = 30 MHz; fi = 8 MHz and fclk = 20 MHz.
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA8761M
SSOP28
1995 Mar 20
DESCRIPTION
plastic shrink small outline package; 28 leads; body width 5.3 mm
2
VERSION
SOT341-1
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
BLOCK DIAGRAM
handbook, full pagewidth
V CCA
CLK
VCCD
CE
3
1
11
10
2
CLOCK DRIVER
VRT
TC
TDA8761
9
25 D8
24 D7
MSB
23 D6
22 D5
analog
voltage input
VI
VRM
8
ANALOG -TO - DIGITAL
CONVERTER
LATCHES
TTL OUTPUTS
21 D4
data outputs
20 D3
19 D2
7
18 D1
17 D0
13
VRB 6
LSB
VCCO1
28 VCCO2
IN RANGE LATCH
4
AGND1
5
AGND2
analog grounds
12
14
OGND1
digital ground
output grounds
3
26
27
DGND
Fig.1 Block diagram.
1995 Mar 20
TTL OUTPUT
OGND2
MGC355
IR
output
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
PINNING
SYMBOL
PIN
DESCRIPTION
CLK
1
clock input
TC
2
two’s complement input (active LOW)
VCCA
3
analog supply voltage (+5 V)
AGND1
4
analog ground 1
AGND2
5
analog ground 2
VRB
6
reference voltage BOTTOM input
VRM
7
reference voltage MIDDLE
VI
8
analog input voltage
VRT
9
reference voltage TOP input
CE
10
chip enable input (TTL level input,
active LOW)
VCCD
11
digital supply voltage (+5 V)
DGND
12
digital ground
VCCO1
13
supply voltage for output stages 1
(+5 V)
OGND1
14
output ground 1
n.c.
15
not connected
n.c.
16
not connected
D0
17
data output; bit 0 (LSB)
D1
18
data output; bit 1
D2
19
data output; bit 2
D3
20
data output; bit 3
D4
21
data output; bit 4
D5
22
data output; bit 5
D6
23
data output; bit 6
D7
24
data output; bit 7
D8
25
data output; bit 8 (MSB)
IR
26
in range data output
OGND2
27
output ground 2
VCCO2
28
supply voltage for output stages 2
(+5 V)
1995 Mar 20
handbook, halfpage
CLK
1
28 VCCO2
TC
2
27 OGND2
VCCA
3
26 IR
AGND1
4
25 D8
AGND2
5
24 D7
VRB
6
23 D6
VRM
7
VI
8
21 D4
VRT
9
20 D3
CE 10
19 D2
VCCD 11
18 D1
DGND 12
17 D0
V CCO1 13
16 n.c.
OGND1 14
15 n.c.
22 D5
TDA8761
MGC356
Fig.2 Pin configuration.
4
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCCA
analog supply voltage
note 1
−0.3
+7.0
V
VCCD
digital supply voltage
note 1
−0.3
+7.0
V
VCCO
output stages supply voltage
note 1
−0.3
+7.0
V
∆VCC
supply voltage differences between
VCCA and VCCD
−1.0
+1.0
V
VCCO and VCCD
−1.0
+1.0
V
−1.0
+1.0
V
VI
input voltage
referenced to AGND
−0.3
+7.0
V
Vi(p-p)
AC input voltage for switching
(peak-to-peak value)
referenced to DGND
−
VCCD
V
VCCA and VCCO
IO
output current
−
10
mA
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
0
+70
°C
Tj
junction temperature
−
+150
°C
Note
1. The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 V and +7.0 V provided the difference
between VCCA, VCCD and VCCO is between −1 and +1 V.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
1995 Mar 20
PARAMETER
thermal resistance from junction to ambient in free air
5
VALUE
UNIT
110
K/W
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
CHARACTERISTICS
VCCA = V3 to V4 and V5 = 4.75 to 5.25 V; VCCD = V11 to V12 = 4.75 to 5.25 V; VCCO = V13 and V28 to V14 and
V27 = 4.4 to 5.25 V; AGND and DGND shorted together; Tamb = 0 to +70 °C; typical values measured at
VCCA = VCCD = VCCO = 5 V; Vi(p-p) = 1.5 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VCCA
analog supply voltage
4.75
5.0
5.25
V
VCCD
digital supply voltage
4.75
5.0
5.25
V
VCCO
output stages supply voltage
4.4
5.0
5.25
V
∆VCC
supply voltage differences between
VCCA and VCCD
−0.25
−
+0.25
V
VCCA and VCCO
−0.4
−
+0.4
V
VCCD and VCCO
−0.4
−
+0.4
V
ICCA
analog supply current
−
30
tbf
mA
ICCD
digital supply current
−
22
tbf
mA
ICCO
output stages supply current
−
22
tbf
mA
0
−
0.8
V
Inputs
CLOCK INPUT CLK (REFERENCED TO DGND); note 1
VIL
LOW level input voltage
VIH
HIGH level input voltage
2.0
−
VCCD
V
IIL
LOW level input current
Vclk = 0.4 V
−1
0
+1
µA
IIH
HIGH level input current
Vclk = 2.7 V
−
−
20
µA
ZI
input impedance
fclk = 30 MHz
−
2
−
kΩ
CI
input capacitance
fclk = 30 MHz
−
2
−
pF
INPUT CE (REFERENCED TO DGND); see Table 2
VIL
LOW level input voltage
0
−
0.8
V
VIH
HIGH level input voltage
2.0
−
VCCD
V
IIL
LOW level input current
VIL = 0.4 V
−400
−
−
µA
IIH
HIGH level input current
VIH = 2.7 V
−
−
20
µA
−
0
−
µA
VI (ANALOG INPUT VOLTAGE REFERENCED TO AGND)
IIL
LOW level input current
VI = 1.3 V
IIH
HIGH level input current
VI = 3.8 V
−
70
−
µA
ZI
input impedance
fi = 10 MHz
−
5
−
kΩ
CI
input capacitance
fi = 10 MHz
−
8
−
pF
1995 Mar 20
6
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
SYMBOL
PARAMETER
TDA8761
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Reference voltages for the resistor ladder; see Table 1
VRB
reference voltage BOTTOM
1.2
1.3
−
VRT
reference voltage TOP
−
3.3
VCCA − 0.8 V V
Vdiff
differential reference voltage
VRT − VRB
1.8
2.0
3.0
V
V
Iref
reference current
−
30
−
mA
RLAD
resistor ladder
−
85
−
Ω
TCRLAD
temperature coefficient of the resistor
ladder
−
1.86
−
ppm
−
158
−
mΩ/K
VosB
offset voltage BOTTOM
note 2
−
250
−
mV
VosT
offset voltage TOP
note 2
−
250
−
mV
Vi(p-p)
analog input voltage
(peak-to-peak value)
note 3
1.3
1.5
2.5
V
Outputs
DIGITAL OUTPUTS D8 TO D0 AND IR (REFERENCED TO OGND)
VOL
LOW level output voltage
IO = 1 mA
0
−
0.4
V
VOH
HIGH level output voltage
IO = 0 mA
2.7
−
VCCO − 0.5
V
IO = −0.4 mA
2.7
−
VCCO − 1.3
V
IOZ
output current in 3-state mode
IO = −1 mA
2.4
−
VCCO − 1.4
V
0.4 V < VO < VCCO
−20
−
+20
µA
Switching characteristics
CLOCK INPUT CLK; see Fig.3; note 1
fclk(max)
maximum clock frequency
30
−
−
MHz
tCPH
clock pulse width HIGH
10
−
−
ns
tCPL
clock pulse width LOW
10
−
−
ns
note 5; full scale input
sine wave
−
±0.75
tbf
LSB
note 5; 50% full scale
input sine wave
−
±0.5
tbf
LSB
note 5; full scale input
sine wave
−
±0.5
tbf
LSB
note 5; 50% full scale
input sine wave
−
±0.3
tbf
LSB
±1
−
LSB
±0.1
−
%
Analog signal processing
LINEARITY
AINL
ADNL
AC integral non-linearity
AC differential non-linearity
OFER
offset error
−
middle code;
VRB = 1.3 V; VRT = 3.3 V
GER
gain error (from device to device)
VRB = 1.3 V;
VRT = 3.3 V; note 4
1995 Mar 20
7
−
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
SYMBOL
PARAMETER
TDA8761
CONDITIONS
MIN.
TYP.
MAX.
UNIT
BANDWIDTH (fclk = 30 MHz)
B
analog bandwidth
full-scale sine wave;
note 6
−
40
−
MHz
75% full-scale sine
wave; note 6
−
55
−
MHz
small signal at
mid-scale;
VI = ±10 LSB at
code 256; note 6
−
700
−
MHz
tSTLH
analog input settling time
LOW-to-HIGH
full-scale square wave;
Fig.5; note 7
−
2.0
tbf
ns
tSTHL
analog input settling time
HIGH-to-LOW
full-scale square wave;
Fig.5; note 7
−
2.5
tbf
ns
fi = 10 MHz
−
−64
−
dB
without harmonics;
fclk = 30 MHz;
fi = 10 MHz
53
55
−
dB
fclk = 30 MHz;
fi = 10 MHz
−
8.5
−
bits
fclk = 30 MHz
−
−64
−
dB
fclk = 30 MHz;
fi = 10 MHz;
VI = ±16 LSB at
code 256
−
10−13
−
times/
sample
fclk = 30 MHz;
PAL modulated ramp
−
tbf
−
%
fclk = 30 MHz;
PAL modulated ramp
−
tbf
−
deg
HARMONICS (fclk = 30 MHZ)
THD
total harmonic distortion
SIGNAL-TO-NOISE RATIO; see Fig.7; note 8
S/N
signal-to-noise ratio (full scale)
EFFECTIVE BITS; see Fig 6; note 8
EB
effective bits
TWO-TONE; note 9
TTIR
two-tone intermodulation rejection
BIT ERROR RATE
BER
bit error rate
DIFFERENTIAL GAIN; note 10
Gdiff
differential gain
DIFFERENTIAL PHASE; note 10
ϕdiff
differential phase
Timing (fclk = 30 MHz; CL = 15 pF); see Fig.3; note 11
tds
sampling delay time
−
−
2
ns
th
output hold time
5
−
−
ns
td
output delay time
−
10
14
ns
CL
digital output load
−
15
40
pF
1995 Mar 20
8
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
SYMBOL
PARAMETER
TDA8761
CONDITIONS
MIN.
TYP.
MAX.
UNIT
3-state output delay times; see Fig.4
tdZH
enable HIGH
−
tbf
tbf
ns
tdZL
enable LOW
−
tbf
tbf
ns
tdHZ
disable HIGH
−
tbf
tbf
ns
tdLZ
disable LOW
−
tbf
tbf
ns
Notes
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 0.5 ns.
2. Analog input voltages producing code 0 up to and including code 511:
a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and
the reference voltage BOTTOM (VRB) at Tamb = 25 °C.
b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which
produces data outputs equal to code 511 at Tamb = 25 °C.
( V RT – V RB ) × 8
3. Analog input voltage range can be derived from VRT − VRB difference. It is ------------------------------------------9
4.
( V 511 – V 0 ) – 1.5 V
GER = --------------------------------------------------- × 100
1.5 V
5. fi = 11 MHz and fclk = 30 MHz; fi = 8 MHz and fclk = 20 MHz.
6. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No
glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.
8. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
9. Intermodulation measured relative to either tone with analog input frequencies of 10.0 MHz and 10.10 MHz. The two
input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.
10. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.
11. Output data acquisition: the output data is available after the maximum delay time of td.
1995 Mar 20
9
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
Table 1
TDA8761
Output coding and input voltage (typical values; referenced to AGND, VRB = 1.3 V, VRT = 3.3 V)
BINARY OUTPUT BITS
STEP
VI(p-p)
IR
U/F
<1.55
0
TWO’S COMPLEMENT OUTPUT BITS
D8
D7
D6
D5
D4
D3
D2
D1
D0
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1.55
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
.
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
510
.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
511
3.05
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
O/F
>3.05
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Table 2
Mode selection
TC
CE
D8 TO D0
IR
X
1
high impedance
0
0
active; two’s complement
active
1
0
active; binary
active
high impedance
t CPL
handbook, full pagewidth
t CPH
1.4 V
CLK
sample N
sample N + 1
sample N + 2
Vl
t ds
th
2.4 V
DATA
D0 to D8
DATA
N-2
DATA
N-1
DATA
N
DATA
N+1
1.4 V
0.4 V
td
Fig.3 Timing diagram.
1995 Mar 20
10
MGC357
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
handbook, full pagewidth
TDA8761
V CCD
50 %
CE
t dHZ
t dZH
HIGH
90 %
output
data
50 %
t dLZ
LOW
t dZL
HIGH
output
data
50 %
LOW
10 %
V CCD
3.3 kΩ
S1
TDA8761
15 pF
TEST
S1
t dLZ
t dZL
VCCD
VCCD
t dHZ
GND
t dZH
GND
CE
MGC358
f CE = 100 kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
1995 Mar 20
11
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
t STHL
t STLH
handbook, full pagewidth
code 511
VI
50 %
50 %
code 0
2 ns
2 ns
CLK
50 %
50 %
0.5 ns
MGC359
0.5 ns
Fig.5 Analog input settling-time diagram.
MGC360
0
handbook, full pagewidth
amplitude
(dB)
20
40
60
80
100
120
0
1.88
3.75
5.63
7.50
9.37
11.3
Effective bits: 8.58; THD = −61.80 dB.
Harmonic levels (dB): 2nd = −64.77; 3rd = −79.30; 4th = −71.90; 5th = −66.12; 6th = −82.29.
Fig.6 Fast Fourier Transform (fclk = 30 MHz; fi = 10 MHz).
1995 Mar 20
12
13.1
f (MHz)
15.0
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
INTERNAL PIN CONFIGURATIONS
handbook, halfpage
VCCO2
handbook, halfpage
VCCO1
V CCA
D8 to D0
O/UF
VI
OGND1
AGND
MGC040
MGC361
Fig.7 TTL data and in-range outputs.
Fig.8 Analog inputs.
ndbook, halfpage
VCCO1
VCCA
handbook, halfpage
VRT
VRM
CE
(TC)
R LAD
VRB
AGND
OGND2
MGC041
Fig.9 CE (TC) 3-state input.
1995 Mar 20
Fig.10 VRB, VRM and VRT.
13
MEA050
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
handbook, full pagewidth
TDA8761
VCCD
V ref (1.3 V)
CLK
DGND
MGC042
Fig.11 CLK input.
1995 Mar 20
14
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
APPLICATION INFORMATION
handbook, halfpage
CLK
TC
VCCA
AGND1
AGND2
V CCO2
1
28
2
27
3
26
4
25
5
24
6
23 D6
7
22
OGND2
IR
D8
D7
(1)
V RB
100 nF
(1)
V RM
AGND
VI
100 nF
D5
TDA8761
8
21
9
20
10
19
11
18
12
17
13
16
14
15
D4
(1)
V RT
AGND
D3
100 nF
CE
D2
AGND
V CCD
DGND
V CCO1
D1
D0
(2)
n.c.
(2)
OGND1
n.c.
MGC362
The analog and digital supplies should be separated and decoupled.
The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. Eventually, the
reference ladder voltages can be derived from a well regulated VCCA supply through a resistor bridge and a decoupled capacitor.
For applications where the input signal must remain well centred around middle scale, VRM must be decoupled and connected to analog input signal
(pin 8) through a resistor. The values must be defined in accordance with the input signal frequency in order to avoid direct coupling into the ADC ladder
(e.g. R = 5 kΩ and C = 100 nF).
(1) VRB, VRM and VRT are decoupled to AGND.
(2) Pins 15 and 16 should be connected to DGND in order to prevent noise influence.
Fig.12 Application diagram.
1995 Mar 20
15
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
SOT341-1
E
A
X
c
HE
y
v M A
Z
28
15
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
w M
bp
e
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.1
0.7
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT341-1
1995 Mar 20
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
MO-150AH
16
o
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
SOLDERING
Plastic small outline packages
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Mar 20
17
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
NOTES
1995 Mar 20
18
Philips Semiconductors
Preliminary specification
9-bit analog-to-digital converter for
digital video
TDA8761
NOTES
1995 Mar 20
19
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SCD39
© Philips Electronics N.V. 1995
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
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use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/01/pp20
Document order number:
Date of release: 1995 Mar 20
9397 750 00112