34L – WLCSP (2.495X2.44X0.55 MM) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FN 6.5573 mg Body Size (mm) 2.495x2.44x0.55 mm SUMMARY The 35ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Deca Technologies Inc. Philippines (Decatech) Package Qualification Report # 150602 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-FN34Decatech As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-97487 Rev. *B Page 1 of 4 34L – WLCSP (2.495X2.44X0.55 MM) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose Substance Composition Polybenzoxazole1 Dielectric Trade Secret Polybenzoxazole2 Dielectric Trade Secret CAS Number Seed Layer Ti Trade Secret Trade Secret 7440-32-6 RDL Seed Layer Seed Layer W 7440-33-7 Seed Layer Cu 7440-50-8 Copper Interconnect Cu 7440-50-8 Seed Layer Ti 7440-32-6 Seed Layer W 7440-33-7 Seed Layer Cu 7440-50-8 UBM Cu 7440-50-8 Interconnect Sn 7440-31-5 Interconnect Ag 7440-22-4 Weight by mg 7016 0.7016 100.0000 5964 45 404 692 13839 22 195 335 15075 302223 12659 1582 606025 0.5964 0.0045 0.0404 0.0692 1.3839 0.0022 0.0195 0.0335 1.5075 30.2223 1.2659 0.1582 60.6025 100.0000 33924 % Total: 3.3924 100.0000 Interconnect Cu 7440-50-8 Circuit Si 7440-21-3 Top Surface Laminate Mark Surface Trade Secret Trade Secret 0.2223 Package Weight (mg): % weight of substance per package 100.0000 Die Solder Ball PPM 0.0496 0.0391 0.0003 0.0026 0.0045 0.0907 0.0001 0.0013 0.0022 0.0988 1.9807 0.0830 0.0104 3.9717 Under Bump Metallization % weight of substance per Homogenous material 6.5573 3.9334 35.4008 60.6658 100.0000 0.1390 1.2509 2.1437 96.4664 95.5000 4.0000 0.5000 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-97487 Rev. *B Page 2 of 4 34L – WLCSP (2.495X2.44X0.55 MM) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Others Material Cover tape Carrier tape Plastic Reel Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM Analysis Report (Note2) <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-97487 Rev. *B Page 3 of 4 34L – WLCSP (2.495X2.44X0.55 MM) Pb-Free Package Document History Page Document Title: Document Number: Rev. ECN No. ** *A 4757267 5285407 34L WLCSP (2.495X2.44X0.55 MM) - PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-97487 Orig. of Change JSO HLR MEL *B 5288603 YUM Description of Change New Release Changed Cypress Logo. Changed the substances with “------------- “ to “Trade Secret". Removed distribution and posting from the document history page. Change the body size from 3.23x2.10x0.55 mm to 2.495x2.44x0.55 mm. Change the “Proprietary” to “Trade Secret” in B under column Substance Composition. Added value on section II for the “PBB and PBDE” column from “-“ to “<5.0”. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-97487 Rev. *B Page 4 of 4