8L DFN (4x4.5x0.8mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LH 42.7000 mg Body Size (mil/mm) 4x4.5x0.8mm SUMMARY The 8L DFN (4x4.5x0.8mm) Pb-Free package is qualified at one manufacturing site. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: UTAC (UTL Bangkok) Package Qualification Report # 142503 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 <5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LH08- UTL Bangkok As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-95459 Rev. ** Page 1 of 4 8L DFN (4x4.5x0.8mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneo us Material % Weight of Substance per Package PPM Cu Cr Sn Zn Ag Sn 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 7440-22-4 18.1800 0.0500 0.0500 0.0400 0.3700 0.9143 97.2900% 0.2600% 0.2500% 0.2000% 2.0000% 100.0000% 425261 1157 1071 857 9144 21392 42.5300% 0.1200% 0.1100% 0.0900% 0.9100% 2.1400% Silver 7440-22-4 0.4800 73.0000% 11341 3107 1.1300% Exo-1,7,7 trimethylbicyclo [2.2.1] he pt-2 7534-94-3 0.1300 20.0000% 1,1-(1,3phenylene)bis1H-pyrrole-2.5dione Acrylic acid, 2[methyl] Silicon Copper Palladium Silica Fused Epoxy resin Phenol resin Carbon Black 0.3100% 1010 3006-93-7 0.0400 6.5000% 1017237-78-3 0.0010 0.5000% 7440-21-3 7440-57-6 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 1.5407 0.2500 0.0010 17.9863 1.2404 0.4133 1.0130 100.0000% 98.2500% 1.7500% 90.5000% 4.7000% 4.7000% 0.1000% Package Weight (mg): 42.7000 0.1000% 78 36252 5910 105 420,834 29,039 9740 23702 3.6300% 0.5900% 0.0100% 42.0800% 2.9000% 0.9700% 2.3700% % Total: 100.0000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-95459 Rev. ** 0.0100% Page 2 of 4 8L DFN (4x4.5x0.8mm) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R CoA-TRAY-R CoA-SBAG –R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-95459 Rev. ** Page 3 of 4 8L DFN (4x4.5x0.8mm) Pb-Free Package Document History Page Document Title: 8L DFN (4x4.5x0.8mm) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-95459 Rev. ** ECN No. Orig. of Change 4584654 PRCH Description of Change New document Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-95459 Rev. ** Page 4 of 4