56L - SSOP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 SP B1: 748.1800 mg B2: 717.9400 mg B1: 717.9400 mg B2: 606.5351 mg Body Size (mil/mm) Package Weight – Site 2 300 mil B1: 778.5500 mg B2: 760.8056 mg SUMMARY The 56L-SSOP Pb-Free package is qualified at three assembly sites. Packages from different assembly sites may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report #s 023606/063103/043005 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP56CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev.*O Page 1 of 14 56L - SSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: NiPdAu with Standard Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 143.7700 1.5300 0.9900 4.5800 0.1930 0.0035 0.0035 0.8400 % weight of substance per Homogenous material 95.2940% 1.0141% 0.6562% 3.0357% 96.5200 1.7300 1.7500 79.2453% Trade Secret 0.0900 8.4906% Trade Secret 0.0700 6.6038% Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret 1309-64-4 0.0200 0.0200 0.0200 14.9300 1.6100 46.3600 46.3600 5.8000 1.8868% 1.8868% 1.8868% 100.0000% 100.0000% 8.0000% 8.0000% 1.0000% 5.8000 463.6000 11.5900 1.0000% 80.0000% 2.0000% CAS Number Cu Si Mg Ni Ni Pd Au Ag 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Solid Epoxy Resin Phenol Resin Antimony Trioxide Carbon Black Fused Silica Crystalline Silica 1333-86-4 60676-86-0 14808-60-7 Package Weight (mg): Weight by mg 748.1800 192,160 2,045 1,323 6,122 258 5 5 % weight of substance per package 19.2160% 0.2045% 0.1323% 0.6122% 0.0258% 0.0005% 0.0005% 1,123 0.1123% 120 0.0120% 94 27 27 27 19,955 2,152 61,964 61,964 0.0094% 0.0027% 0.0027% 0.0027% 1.9955% 0.2152% 6.1964% 6.1964% 7,752 7,752 619,637 15,491 0.7752% 0.7752% 61.9637% 1.5491% PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev.*O Page 2 of 14 56L - SSOP Pb-Free Package B2. NiPdAu with Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au SiO2 Epoxy Resin Phenol resin 7440-50-8 7440-21-3 7439-95-4 7740-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 168.6800 1.1400 0.2600 5.2600 3.5200 0.0600 0.0600 0.8500 0.0900 % weight of substance per Homogenous material 96.2017% 0.6502% 0.1483% 2.9999% 96.5200% 1.7370% 1.7430% 80.00% 9.00% Trade Secret 0.0500 5.00% 70 0.0070% Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 0.0200 0.0200 0.0200 14.9300 1.8100 463.8500 31.2700 26.0500 2.00% 2.00% 2.00% 100.0000% 100.0000% 89.0000% 6.0000% 5.0000% 28 28 28 20,796 2,521 646,085 43,555 36,284 0.0028% 0.0028% 0.0028% 2.0796% 0.2521% 64.6085% 4.3555% 3.6284% CAS Number Package Weight (mg): Weight by mg 717.9400 PPM % weight of substance per package 234,950 1,588 362 7,327 4,903 84 84 1,184 125 23.4950% 0.1588% 0.0362% 0.7327% 0.4903% 0.0084% 0.0084% 0.1184% 0.0125% % Total: 100.0000 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev.*O Page 3 of 14 56L - SSOP Pb-Free Package ASSEMBLY Site 2: Orient Semiconductor ElectronicsTaiwan (OSET) Package Qualification Report # 053502 / 120410 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP56OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev.*O Page 4 of 14 56L - SSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1: USING GOLD WIRE Material Purpose of Use Substance Composition CAS Number Weight by mg % weight of substance per Homogenous % weight of substance per package PPM material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper Iron Phosphorus Zinc Polyimide NBR Bismaleimide Phenol resin Nickel Palladium Gold Acrylic resin Polybutadiene derivative Butadiene copolymer Epoxy Resin Acrylate Peroxide Additive Silver (Metal powder) Silicon Gold Epoxy resin(1) Epoxy resin(2) Phenol resin Aromatic Phosphate Carbon black Silica 7440-50-8 7439-89-6 7723-14-0 7440-66-6 60842-76-4 9003-18-3 Trade Secret Trade Secret 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 171.2600 4.1800 0.1500 0.2200 0.1700 0.0300 0.0300 0.0200 1.5800 0.1400 0.0300 0.0782 0.0506 97.2700 2.3700 0.0900 0.1200 0.1000 0.0200 0.0200 0.0100 90.2900 8.0000 1.7100 8.5000 5.5000 219,973 5,369 193 283 218 39 39 26 2,029 180 39 100 65 21.9973% 0.5369% 0.0193% 0.0283% 0.0218% 0.0039% 0.0039% 0.0026% 0.2029% 0.0180% 0.0039% 0.0100% 0.0065% Trade Secret 0.0092 1.0000 12 0.0012% Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 0.0184 0.0368 0.0046 0.0138 0.7084 2.0000 4.0000 0.5000 1.5000 77.0000 24 47 6 18 910 0.0024% 0.0047% 0.0006% 0.0018% 0.0910% 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 9.8600 1.3200 20.6000 11.7700 20.6000 8.8300 100.0000 100.0000 3.5000 2.0000 3.5000 1.5000 12,665 1,695 26,459 15,118 26,459 11,342 1.2665% 0.1695% 2.6459% 1.5118% 2.6459% 1.1342% 1.1800 525.6600 0.2000 89.3000 1,516 675,178 0.1516% 67.5178% 1333-86-4 60676-86-0 Package Weight (mg): 778.5500 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 5 of 14 56L - SSOP Pb-Free Package B2: USING COPPER WIRE Material Purpose of Use Substance Composition CAS Number Weight by mg % weight of substance per Homogenous % weight of substance per package PPM material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper Iron Phosphorus Zinc Pb Nickel Palladium Gold Silver Epoxy resin A Epoxy resin B Diluent A Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Silicon Copper Epoxy resin A Epoxy,CresolNo volac Phenol resin Metal Hydroxide Carbon Black Silica Fused A Silica Fused B Silica,crystalline 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7439-92-1 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 29690-82-2 Trade Secret Trade Secret 1333-86-4 60676-86-0 7631-86-9 14808-60-7 Package Weight (mg): 107.7600 2.6255 0.0922 0.1397 0.0112 0.9899 0.0894 0.0156 0.4018 0.0217 0.0326 0.0217 0.0326 0.0272 97.4071 2.3733 0.0833 0.1262 0.0101 90.4082 8.1633 1.4286 74.0000 4.0000 6.0000 4.0000 6.0000 5.0000 141,639 3,451 121 184 15 1,301 117 21 528 29 43 29 43 36 14.1639% 0.3451% 0.0121% 0.0184% 0.0015% 0.1301% 0.0117% 0.0021% 0.0528% 0.0029% 0.0043% 0.0029% 0.0043% 0.0036% 0.0027 0.0027 0.5000 0.5000 4 4 0.0004% 0.0004% 11.8084 0.2394 31.8246 31.8246 100.0000 100.0000 5.0000 5.0000 15,521 315 41,830 41,830 1.5521% 0.0315% 4.1830% 4.1830% 31.8246 31.8246 1.9095 441.7248 63.6491 1.9095 5.0000 5.0000 0.3000 69.4000 10.0000 0.3000 41,830 41,830 2,510 580,602 83,660 2,510 4.1830% 4.1830% 0.2510% 58.0602% 8.3660% 0.2510% % Total: 100.0000 760.8056 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 6 of 14 56L - SSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 7 of 14 56L - SSOP Pb-Free Package ASSEMBLY Site 3: JiangsuChangjiang Electronics Technology (JCET) Package Qualification Report #s 104810/ 104802, 143702(Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SP56JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 8 of 14 56L - SSOP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1. Using Gold wire with NiPdAu with Green Molding Compound Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au SiO2 Epoxy Resin Phenol resin 7440-50-8 7440-21-3 7439-95-4 7740-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 168.6800 1.1400 0.2600 5.2600 3.5200 0.0600 0.0600 0.8500 0.0900 96.2017% 0.6502% 0.1483% 2.9999% 96.5200% 1.7370% 1.7430% 80.00% 9.00% 234,950 1,588 362 7,327 4,903 84 84 1,184 125 % weight of substance per package 23.4950% 0.1588% 0.0362% 0.7327% 0.4903% 0.0084% 0.0084% 0.1184% 0.0125% Trade Secret 0.0500 5.00% 70 0.0070% Trade Secret Trade Secret Trade Secret 0.0200 0.0200 0.0200 2.00% 2.00% 2.00% 28 28 28 0.0028% 0.0028% 0.0028% 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 14.9300 1.8100 463.8500 31.2700 26.0500 100.0000% 100.0000% 89.0000% 6.0000% 5.0000% 20,796 2,521 646,085 43,555 36,284 2.0796% 0.2521% 64.6085% 4.3555% 3.6284% % Total: 100.0000 CAS Number Package Weight (mg): Weight by mg 717.9400 % weight of substance per Homogenous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 9 of 14 56L - SSOP Pb-Free Package B2. Using Copper Palladium Wire Purpose of Use Leadframe Lead Finish Die Attach Die Wire Base Material External Plating Adhesive Circuit Interconnect Substance Composition Encapsulation Weight by mg 3.0800 0.0015 1,039 346 0.1039% 0.0346% 3.2200 0.0230 5,309 0.5309% 132.8600 0.9490 219,048 21.9048% 3,108 0.3108% 330 0.0330% 37 0.0037% 0.0021% 0.0008% Magnesium 7439-95-4 0.6300 0.2100 Silver 7440-22-4 Copper 7440-50-8 Tin 7440-31-5 Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate 7440-22-4 Proprietary Proprietary %% Weight of Substance per package PPM 0.5078% 7440-02-0 7440-21-3 Proprietary % weight of substance per Homogeneous 5,078 Nickel Silicon 1.8850 0.0220 0.0045 1.0000 0.2000 0.8000 0.0225 0.0125 0.0900 0.0500 0.0050 0.0200 21 8 0.0050 0.0200 8 0.0008% 0.0008% Acrylate Ester Proprietary Organic Peroxide Proprietary 0.0050 0.0200 8 Silicon 7440-21-3 3.3000 1.0808 1.0000 5,441 0.5441% 0.9825 1,782 0.1782% 0.0193 0.0175 32 0.0032% 22,752 2.2752% 22,752 2.2752% 37,920 3.7920% 672,706 2,275 67.2706% 0.2275% % Total: 100.0000 Copper 7440-50-8 Palladium Phenol Resin 7440-05-3 Trade Secret Trade Secret Trade Secret Silica(Amorphous) Carbon Black 60676-86-0 1333-86-4 408.0200 1.3800 Package Weight (mg): 606.5351 Epoxy Resin A Mold Compound CAS Number Epoxy Resin B 13.8000 13.8000 23.0000 0.0300 0.0300 0.0500 0.8870 0.0030 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 10 of 14 56L - SSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Tape and Reel Others Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 11 of 14 56L - SSOP Pb-Free Package Document History Page Document Title: Document Number: 56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03010 Rev. ECN No. Orig. of Change Description of Change ** *A 385294 408693 EML YXP *B 596982 QAD/ MRB New document Edited header table for the package weight, and Summary section to reflect assembly site 2. Added “(PMDD)” on title page. Added PMDD data for assembly site 2. Edited Note 3 on footer section. Added Note 4 on footer section. Updated Cypress Logo Added CoA-SP56-R1 on Analysis Report Table Divided B into two (2) categories, B: For NiPdAu using Std Mold Compound, and B2: NiPdAu using a Green Molding Compound. Added Table B2 in B for Green Mold Compound using new format (with % weight of substance per homogenous material). Deleted QTP 022102 and replaced QTP 043005 on Assembly site 1. Deleted Declaration of Packaging materials on Assembly site 1. Added on the material composition the percent weight per homogeneous material and weight of substance per package on Assembly site 1 standard molding compound and Assembly site 2. Updated and added Lead, CrIV, PBB and PBDE on the Declaration of Packaging/Indirect Materials. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 12 of 14 56L - SSOP Pb-Free Package Document History Page Document Title: Document Number: 56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03010 Rev. ECN No. Orig. of Change Description of Change *C 2610934 MAHA *D 2727411 MAHA *E 2819640 MAHA *F 3007049 HLR Changed the %composition of Leadframe for Assembly site 2. *G 3097560 MAHA *H 3218992 REYD Deleted Fe and Zn from the lead frame composition of Table B1 of Assembly Site 1. Recalculated the % weight of substance per Homogenous material of the lead frame of Table B1 of Assembly Site 1. Recalculated the PPM and % weight of substance per package of Table B1 of Assembly Site 1. Added Assembly Site 3 – JCET Changed the CAS numbers of the following for assembly site 1 – Table B1. NiPdAu with Standard Molding Compound: 1. Copper 2. Antimony trioxide 3. Carbon black 4. Fused Silica 5. Crystalline silica Changed the CAS numbers of the following for assembly site 1 – Table B2. NiPdAu with Green Molding Compound: 1. Silica 2. Epoxy resin 3. Phenol resin Changed the CAS number of Copper for assembly site 2. Added Declaration of Packaging Indirect Materials Table to assembly site 1. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on the Declaration of Packaging Indirect Materials table for assembly site 2. Corrected the CAS number of Copper in the material composition table of assembly site 2. Corrected the CAS number of Magnesium on table B1 of assembly site 1. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 13 of 14 56L - SSOP Pb-Free Package Document History Page Document Title: Document Number: Rev. *O ECN No. 56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-03010 Orig. of Change MAHA Description of Change *J 3603915 COPI *K 4032217 YUM *L 4498431 REYD *M 4522363 LPG *N 4644633 HLR Changed “two to “three” under the Summary on page 1. Deleted Lead from the lead frame composition of assembly site 2. Deleted Silver, Palladium, Copper, and Iron from the gold wire composition of assembly site 2. Recalculated PMM values of assembly site 2. Deleted Table B1: NiPdAu with Standard Molding Compound from assembly site 3.Deleted CoA-SP56-JT1 from Table A of assembly site 3.Expressed the weight by mg, package weight, % weight of substance per Homogeneous material, and % weight of substance per package in four decimal places for assembly sites 1, 2, and 3. Added PMDD for Assembly Site 2-B2 – OSE Taiwan Copper Qualification under QTP # 120410. Added the Assembly Site Name in the Assembly heading in site 1, 2 and 3. Changed the Assembly Code to Assembly Site Name in site 1,2 and 3. Added B2 in Package Weight and QTP# 143702 under Site 3. Updated Material Composition Table under Assembly Site 3-B2. Minor Change: Incorrect footer revision in page 5 & 6 from *K to *L of ECN# 4498431. Sunset due – No Change *O 5123002 HLR Changed the substances with “------------- “to “Trade Secret SLLO Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03010 Rev. *O Page 14 of 14