56L-SSOP PB-FREE Package Material Declaration Datasheet.pdf

56L - SSOP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
SP
B1: 748.1800 mg
B2: 717.9400 mg
B1: 717.9400 mg
B2: 606.5351 mg
Body Size (mil/mm)
Package Weight – Site 2
300 mil
B1: 778.5500 mg
B2: 760.8056 mg
SUMMARY
The 56L-SSOP Pb-Free package is qualified at three assembly sites. Packages from different assembly sites
may have different material composition. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report #s 023606/063103/043005 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP56CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev.*O
Page 1 of 14
56L - SSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: NiPdAu with Standard Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
143.7700
1.5300
0.9900
4.5800
0.1930
0.0035
0.0035
0.8400
% weight of
substance per
Homogenous
material
95.2940%
1.0141%
0.6562%
3.0357%
96.5200
1.7300
1.7500
79.2453%
Trade Secret
0.0900
8.4906%
Trade Secret
0.0700
6.6038%
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
1309-64-4
0.0200
0.0200
0.0200
14.9300
1.6100
46.3600
46.3600
5.8000
1.8868%
1.8868%
1.8868%
100.0000%
100.0000%
8.0000%
8.0000%
1.0000%
5.8000
463.6000
11.5900
1.0000%
80.0000%
2.0000%
CAS Number
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Si
Au
Solid Epoxy Resin
Phenol Resin
Antimony Trioxide
Carbon Black
Fused Silica
Crystalline Silica
1333-86-4
60676-86-0
14808-60-7
Package Weight (mg):
Weight by
mg
748.1800
192,160
2,045
1,323
6,122
258
5
5
% weight of
substance
per
package
19.2160%
0.2045%
0.1323%
0.6122%
0.0258%
0.0005%
0.0005%
1,123
0.1123%
120
0.0120%
94
27
27
27
19,955
2,152
61,964
61,964
0.0094%
0.0027%
0.0027%
0.0027%
1.9955%
0.2152%
6.1964%
6.1964%
7,752
7,752
619,637
15,491
0.7752%
0.7752%
61.9637%
1.5491%
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev.*O
Page 2 of 14
56L - SSOP
Pb-Free Package
B2. NiPdAu with Green Molding Compound
Material
Purpose of Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic peroxide
Si
Au
SiO2
Epoxy Resin
Phenol resin
7440-50-8
7440-21-3
7439-95-4
7740-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
168.6800
1.1400
0.2600
5.2600
3.5200
0.0600
0.0600
0.8500
0.0900
% weight of
substance
per
Homogenous
material
96.2017%
0.6502%
0.1483%
2.9999%
96.5200%
1.7370%
1.7430%
80.00%
9.00%
Trade Secret
0.0500
5.00%
70
0.0070%
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
0.0200
0.0200
0.0200
14.9300
1.8100
463.8500
31.2700
26.0500
2.00%
2.00%
2.00%
100.0000%
100.0000%
89.0000%
6.0000%
5.0000%
28
28
28
20,796
2,521
646,085
43,555
36,284
0.0028%
0.0028%
0.0028%
2.0796%
0.2521%
64.6085%
4.3555%
3.6284%
CAS Number
Package Weight (mg):
Weight by
mg
717.9400
PPM
% weight of
substance
per package
234,950
1,588
362
7,327
4,903
84
84
1,184
125
23.4950%
0.1588%
0.0362%
0.7327%
0.4903%
0.0084%
0.0084%
0.1184%
0.0125%
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev.*O
Page 3 of 14
56L - SSOP
Pb-Free Package
ASSEMBLY Site 2: Orient Semiconductor ElectronicsTaiwan (OSET)
Package Qualification Report # 053502 / 120410 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP56OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev.*O
Page 4 of 14
56L - SSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1: USING GOLD WIRE
Material
Purpose of Use
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
% weight of
substance
per package
PPM
material
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper
Iron
Phosphorus
Zinc
Polyimide
NBR
Bismaleimide
Phenol resin
Nickel
Palladium
Gold
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Epoxy Resin
Acrylate
Peroxide
Additive
Silver (Metal
powder)
Silicon
Gold
Epoxy resin(1)
Epoxy resin(2)
Phenol resin
Aromatic
Phosphate
Carbon black
Silica
7440-50-8
7439-89-6
7723-14-0
7440-66-6
60842-76-4
9003-18-3
Trade Secret
Trade Secret
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
171.2600
4.1800
0.1500
0.2200
0.1700
0.0300
0.0300
0.0200
1.5800
0.1400
0.0300
0.0782
0.0506
97.2700
2.3700
0.0900
0.1200
0.1000
0.0200
0.0200
0.0100
90.2900
8.0000
1.7100
8.5000
5.5000
219,973
5,369
193
283
218
39
39
26
2,029
180
39
100
65
21.9973%
0.5369%
0.0193%
0.0283%
0.0218%
0.0039%
0.0039%
0.0026%
0.2029%
0.0180%
0.0039%
0.0100%
0.0065%
Trade Secret
0.0092
1.0000
12
0.0012%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-22-4
0.0184
0.0368
0.0046
0.0138
0.7084
2.0000
4.0000
0.5000
1.5000
77.0000
24
47
6
18
910
0.0024%
0.0047%
0.0006%
0.0018%
0.0910%
7440-21-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
9.8600
1.3200
20.6000
11.7700
20.6000
8.8300
100.0000
100.0000
3.5000
2.0000
3.5000
1.5000
12,665
1,695
26,459
15,118
26,459
11,342
1.2665%
0.1695%
2.6459%
1.5118%
2.6459%
1.1342%
1.1800
525.6600
0.2000
89.3000
1,516
675,178
0.1516%
67.5178%
1333-86-4
60676-86-0
Package Weight (mg):
778.5500
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 5 of 14
56L - SSOP
Pb-Free Package
B2: USING COPPER WIRE
Material
Purpose of Use
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
% weight of
substance
per package
PPM
material
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper
Iron
Phosphorus
Zinc
Pb
Nickel
Palladium
Gold
Silver
Epoxy resin A
Epoxy resin B
Diluent A
Diluent B
Phenolic
Hardener
Dicyandiamide
Organic
peroxide
Silicon
Copper
Epoxy resin A
Epoxy,CresolNo
volac
Phenol resin
Metal Hydroxide
Carbon Black
Silica Fused A
Silica Fused B
Silica,crystalline
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7439-92-1
7440-02-0
7440-05-3
7440-57-5
7440-22-4
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
461-58-5
Trade Secret
7440-21-3
7440-50-8
Trade Secret
29690-82-2
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Package Weight (mg):
107.7600
2.6255
0.0922
0.1397
0.0112
0.9899
0.0894
0.0156
0.4018
0.0217
0.0326
0.0217
0.0326
0.0272
97.4071
2.3733
0.0833
0.1262
0.0101
90.4082
8.1633
1.4286
74.0000
4.0000
6.0000
4.0000
6.0000
5.0000
141,639
3,451
121
184
15
1,301
117
21
528
29
43
29
43
36
14.1639%
0.3451%
0.0121%
0.0184%
0.0015%
0.1301%
0.0117%
0.0021%
0.0528%
0.0029%
0.0043%
0.0029%
0.0043%
0.0036%
0.0027
0.0027
0.5000
0.5000
4
4
0.0004%
0.0004%
11.8084
0.2394
31.8246
31.8246
100.0000
100.0000
5.0000
5.0000
15,521
315
41,830
41,830
1.5521%
0.0315%
4.1830%
4.1830%
31.8246
31.8246
1.9095
441.7248
63.6491
1.9095
5.0000
5.0000
0.3000
69.4000
10.0000
0.3000
41,830
41,830
2,510
580,602
83,660
2,510
4.1830%
4.1830%
0.2510%
58.0602%
8.3660%
0.2510%
% Total:
100.0000
760.8056
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 6 of 14
56L - SSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 7 of 14
56L - SSOP
Pb-Free Package
ASSEMBLY Site 3: JiangsuChangjiang Electronics
Technology (JCET)
Package Qualification Report #s 104810/ 104802, 143702(Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in
the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-SP56JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 8 of 14
56L - SSOP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. Using Gold wire with NiPdAu with Green Molding Compound
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
SiO2
Epoxy Resin
Phenol resin
7440-50-8
7440-21-3
7439-95-4
7740-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
168.6800
1.1400
0.2600
5.2600
3.5200
0.0600
0.0600
0.8500
0.0900
96.2017%
0.6502%
0.1483%
2.9999%
96.5200%
1.7370%
1.7430%
80.00%
9.00%
234,950
1,588
362
7,327
4,903
84
84
1,184
125
% weight
of
substance
per
package
23.4950%
0.1588%
0.0362%
0.7327%
0.4903%
0.0084%
0.0084%
0.1184%
0.0125%
Trade Secret
0.0500
5.00%
70
0.0070%
Trade Secret
Trade Secret
Trade Secret
0.0200
0.0200
0.0200
2.00%
2.00%
2.00%
28
28
28
0.0028%
0.0028%
0.0028%
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
14.9300
1.8100
463.8500
31.2700
26.0500
100.0000%
100.0000%
89.0000%
6.0000%
5.0000%
20,796
2,521
646,085
43,555
36,284
2.0796%
0.2521%
64.6085%
4.3555%
3.6284%
% Total:
100.0000
CAS Number
Package Weight (mg):
Weight by
mg
717.9400
% weight of
substance per
Homogenous
material
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 9 of 14
56L - SSOP
Pb-Free Package
B2. Using Copper Palladium Wire
Purpose of
Use
Leadframe
Lead
Finish
Die Attach
Die
Wire
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Substance
Composition
Encapsulation
Weight
by mg
3.0800
0.0015
1,039
346
0.1039%
0.0346%
3.2200
0.0230
5,309
0.5309%
132.8600
0.9490
219,048
21.9048%
3,108
0.3108%
330
0.0330%
37
0.0037%
0.0021%
0.0008%
Magnesium
7439-95-4
0.6300
0.2100
Silver
7440-22-4
Copper
7440-50-8
Tin
7440-31-5
Silver
Proprietary
Bismaleimide
Proprietary Polymer
Methacrylate
7440-22-4
Proprietary
Proprietary
%% Weight
of Substance
per package
PPM
0.5078%
7440-02-0
7440-21-3
Proprietary
% weight of
substance per
Homogeneous
5,078
Nickel
Silicon
1.8850
0.0220
0.0045
1.0000
0.2000
0.8000
0.0225
0.0125
0.0900
0.0500
0.0050
0.0200
21
8
0.0050
0.0200
8
0.0008%
0.0008%
Acrylate Ester
Proprietary
Organic Peroxide
Proprietary
0.0050
0.0200
8
Silicon
7440-21-3
3.3000
1.0808
1.0000
5,441
0.5441%
0.9825
1,782
0.1782%
0.0193
0.0175
32
0.0032%
22,752
2.2752%
22,752
2.2752%
37,920
3.7920%
672,706
2,275
67.2706%
0.2275%
% Total:
100.0000
Copper
7440-50-8
Palladium
Phenol Resin
7440-05-3
Trade
Secret
Trade
Secret
Trade
Secret
Silica(Amorphous)
Carbon Black
60676-86-0
1333-86-4
408.0200
1.3800
Package Weight (mg):
606.5351
Epoxy Resin A
Mold
Compound
CAS
Number
Epoxy Resin B
13.8000
13.8000
23.0000
0.0300
0.0300
0.0500
0.8870
0.0030
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 10 of 14
56L - SSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Tape and
Reel
Others
Material
Plastic Tube
End Plug
Carrier Tape
Moisture Barrier
Bag
Dessicant
HIC
Bubble Pack
Carton Label
Inner Label
Shielding Bag
Lead
PPM
<5.0
<5.0
<5.0
Cadmium
PPM
<5.0
<5.0
<5.0
Cr VI
PPM
<5.0
<5.0
<5.0
Mercury
PPM
<5.0
<5.0
<5.0
PBB
PPM
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-EPLG-R
CoA-CART-R
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-MBBG-R
<5.0
<5.0
<5.0
<10.0
<10.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<5.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
<5.0
<5.0
<10.0
<5.0
<5.0
< 5.0
CoA-DESS-R
CoA-HIC-R
CoA-BUBB-R
CoA-CRTN-R
CoA-LBL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 11 of 14
56L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03010
Rev.
ECN No. Orig. of
Change
Description of Change
**
*A
385294
408693
EML
YXP
*B
596982
QAD/
MRB
New document
Edited header table for the package weight, and Summary section
to reflect assembly site 2.
Added “(PMDD)” on title page.
Added PMDD data for assembly site 2.
Edited Note 3 on footer section.
Added Note 4 on footer section.
Updated Cypress Logo
Added CoA-SP56-R1 on Analysis Report Table
Divided B into two (2) categories, B: For NiPdAu using Std Mold
Compound, and B2: NiPdAu using a Green Molding Compound.
Added Table B2 in B for Green Mold Compound using new format
(with % weight of substance per homogenous material).
Deleted QTP 022102 and replaced QTP 043005 on Assembly site
1.
Deleted Declaration of Packaging materials on Assembly site 1.
Added on the material composition the percent weight per
homogeneous material and weight of substance per package on
Assembly site 1 standard molding compound and Assembly site 2.
Updated and added Lead, CrIV, PBB and PBDE on the
Declaration of Packaging/Indirect Materials.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 12 of 14
56L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03010
Rev.
ECN
No.
Orig. of
Change
Description of Change
*C
2610934 MAHA
*D
2727411 MAHA
*E
2819640 MAHA
*F
3007049 HLR
Changed the %composition of Leadframe for Assembly site 2.
*G
3097560 MAHA
*H
3218992 REYD
Deleted Fe and Zn from the lead frame composition of Table B1 of
Assembly Site 1. Recalculated the % weight of substance per
Homogenous material of the lead frame of Table B1 of Assembly
Site 1. Recalculated the PPM and % weight of substance per
package of Table B1 of Assembly Site 1.
Added Assembly Site 3 – JCET
Changed the CAS numbers of the following for assembly site 1 –
Table B1. NiPdAu with Standard Molding Compound:
1. Copper
2. Antimony trioxide
3. Carbon black
4. Fused Silica
5. Crystalline silica
Changed the CAS numbers of the following for assembly site 1 –
Table B2. NiPdAu with Green Molding Compound:
1. Silica
2. Epoxy resin
3. Phenol resin
Changed the CAS number of Copper for assembly site 2.
Added Declaration of Packaging Indirect Materials Table to
assembly site 1.
Completed the RoHS Substances namely: Lead, Cadmium,
Mercury, Chromium VI, PBB and PBDE on the Declaration of
Packaging Indirect Materials table for assembly site 2.
Corrected the CAS number of Copper in the material composition
table of assembly site 2.
Corrected the CAS number of Magnesium on table B1 of
assembly site 1.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 13 of 14
56L - SSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
*O
ECN
No.
56L-SSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03010
Orig. of
Change
MAHA
Description of Change
*J
3603915 COPI
*K
4032217 YUM
*L
4498431 REYD
*M
4522363 LPG
*N
4644633 HLR
Changed “two to “three” under the Summary on page 1. Deleted
Lead from the lead frame composition of assembly site 2. Deleted
Silver, Palladium, Copper, and Iron from the gold wire composition
of assembly site 2. Recalculated PMM values of assembly site 2.
Deleted Table B1: NiPdAu with Standard Molding Compound from
assembly site 3.Deleted CoA-SP56-JT1 from Table A of assembly
site 3.Expressed the weight by mg, package weight, % weight of
substance per Homogeneous material, and % weight of substance
per package in four decimal places for assembly sites 1, 2, and 3.
Added PMDD for Assembly Site 2-B2 – OSE Taiwan Copper
Qualification under QTP # 120410.
Added the Assembly Site Name in the Assembly heading in site 1,
2 and 3.
Changed the Assembly Code to Assembly Site Name in site 1,2
and 3.
Added B2 in Package Weight and QTP# 143702 under Site 3.
Updated Material Composition Table under Assembly Site 3-B2.
Minor Change: Incorrect footer revision in page 5 & 6 from *K to *L
of ECN# 4498431.
Sunset due – No Change
*O
5123002 HLR
Changed the substances with “------------- “to “Trade Secret
SLLO
Removed Distribution and Posting from the document history
page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03010 Rev. *O
Page 14 of 14
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