28L – TSOP I (Reverse Option) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 ZY 228.6300 mg B1: 300.0002 mg B2: 261.8521 mg Body Size (mil/mm) Package Weight – Site 2 8x13.4 mm 229.6700 mg SUMMARY The 28L-TSOP I (Reverse Option) Pb-Free package is qualified at two assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that as long as products are being ordered with a Cypress Part Number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) they meet the requirement of RoHS. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 021903 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZY28-CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 1 of 11 28L – TSOP I (Reverse Option) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au Epoxy resin Phenol resin Brominated epoxy resin Antimony trioxide Silica Others 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 107.4800 1.3800 0.3500 4.6100 0.1930 0.0035 0.0035 0.5000 0.0600 % Weight of Substance per Homogeneous Material 94.4298% 1.2124% 0.3075% 4.0503% 96.5200% 1.7400% 1.7400% 80.6452% 9.6774% Trade Secret 0.0300 4.8387% 131 0.0131% Trade Secret Trade Secret Trade Secret 0.0100 0.0100 0.0100 1.6129% 1.6129% 1.6129% 44 44 44 0.0044% 0.0044% 0.0044% 7440-21-3 7440-57-5 129915-35-1 26834-02-6 Trade Secret 8.7800 0.9600 5.2100 5.2100 1.0400 100.0000% 100.0000% 4.9976% 4.9976% 0.9976% 38,403 4,199 22,788 22,788 4,549 3.8403% 0.4199% 2.2788% 2.2788% 0.4549% 1309-64-4 0.5200 0.4988% 2,274 0.2274% 91.2300 1.0400 87.5108% 0.9976% 399,029 4,549 39.9029% 0.4549% CAS Number 7631-86-9 Trade Secret Package Weight (mg): Weight by mg 228.6300 PPM 470,105 6,036 1,531 20,164 844 15 15 2,187 262 47.0105% 0.6036% 0.1531% 2.0164% 0.0844% 0.0015% 0.0015% 0.2187% 0.0262% % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J % Weight of Substance per Package Page 2 of 11 100.0000 28L – TSOP I (Reverse Option) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 3 of 11 28L – TSOP I (Reverse Option) Pb-Free Package ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 033104 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZY28OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 4 of 11 28L – TSOP I (Reverse Option) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Material Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Ni Mg Si C Fe Sn Epoxy Resin Metal Ag Si Au Epoxy resin Phenol resin Aromatic Phosphate Carbon Black Silica 28.5400 0.3500 1.3900 0.0100 39.3100 2.1300 0.0500 0.0200 0.2900 2.1300 0.4800 6.9700 6.2000 2.0100 % Weight of Substance per Homogeneous Material 41.0057% 0.5029% 1.9971% 0.0144% 56.4799% 100.0000% 13.8889% 5.5556% 80.5556% 100.0000% 100.0000% 4.4976% 4.0008% 1.2970% 124,265 1,524 6,052 44 171,159 9,274 218 87 1,263 9,274 2,090 30,348 26,995 8,752 12.4265% 0.1524% 0.6052% 0.0044% 17.1159% 0.9274% 0.0218% 0.0087% 0.1263% 0.9274% 0.2090% 3.0348% 2.6995% 0.8752% 0.3100 139.4800 0.2000% 90.0045% 1,350 607,306 0.1350% 60.7306% Weight by mg CAS Number 7440-02-0 7439-95-4 7440-21-3 7440-44-0 7439-89-6 7440-31-5 Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 129915-35-1 26834-02-6 Trade Secret 1333-86-4 7631-86-9 Package Weight (mg): 229.6700 % Weight of Substance per Package PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 5 of 11 28L – TSOP I (Reverse Option) Pb-Free Package ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET) Package Qualification Report # 104815 /104816, 141303 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZY28- JCET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 6 of 11 28L – TSOP I (Reverse Option) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) B1.USING GOLD WIRE Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Si Mg Ni Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Methacrylate Acrylate ester Organic peroxide Si Au SiO2 Phenol Resin Epoxy Resin CAS Number 7440-50-8 7440-21-3 7439-95-4 7440-02-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 62.1975 0.4203 0.0970 1.9396 1.2989 0.0234 0.0235 0.1862 % weight of substance per Homogeneous 96.2000% 0.6500% 0.1500% 3.0000% 96.5204% 1.7370% 1.7427% 80.0000% 0.0210 9.0000% Weight by mg Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret Package Weight (mg): PPM 207,325 1,401 323 6,465 4,330 78 78 621 70 %Weight of Substance per package 20.7325% 0.1401% 0.0323% 0.6465% 0.4330% 0.0078% 0.0078% 0.0621% 0.0070% 39 0.0116 0.0047 0.0047 5.0000% 2.0000% 2.0000% 0.0047 3.2592 1.3285 203.9696 11.4590 13.7508 2.0000% 100.0000% 100.0000% 89.0000% 5.0000% 6.0000% 300.0002 0.0039% 0.0016% 0.0016% 16 16 16 0.0016% 1.0864% 0.4428% 67.9899% 3.8197% 4.5836% 10,864 4,428 679,899 38,197 45,836 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 7 of 11 28L – TSOP I (Reverse Option) Pb-Free Package B2.USING COPPER PALLADIUM WIRE Material Leadframe Lead Finish Purpose of Use Base Material External Plating Substance Composition 2.2000% 0.4500% 0.1500% 7440-22-4 7440-50-8 80.6650 Tin 7440-31-5 Silver 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade Secret Trade Secret Trade Secret 60676-86-0 1333-86-4 150.7900 0.5100 Package Weight (mg): 261.8521 7440-02-0 7440-21-3 7439-95-4 Silver Copper Proprietary Polymer Adhesive Methacrylate Acrylate Ester Organic Peroxide Die Circuit Wire Interconnect Silicon Copper Palladium Epoxy Resin A Mold Compound Encapsulation Weight by mg 1.8700 0.3825 0.1275 1.9550 Nickel Silicon Magnesium Proprietary Bismaleimide Die Attach CAS Number % weight of substance per Homogeneo us Epoxy Resin B Phenol Resin Silica(Amorphous) Carbon Black PPM %% Weight of Substance per package 2.3000% 7,141 1,461 487 7,466 0.7141% 0.1461% 0.0487% 0.7466% 94.9000% 308,056 30.8056% 2.1300 100.0000% 8,134 0.8134% 0.1862 80.0000% 711 0.0711% 80 0.0080% 44 0.0044% 18 0.0018% 18 0.0018% 18 0.0018% 12,447 4,615 82 1.2447% 0.4615% 0.0082% 19,477 1.9477% 19,477 1.9477% 32,461 3.2461% 575,859 1,948 57.5859% 0.1948% % Total: 100.0000 0.0210 0.0116 0.0047 0.0047 0.0047 3.2592 1.2085 0.0215 5.1000 5.1000 8.5000 9.0000% 5.0000% 2.0000% 2.0000% 2.0000% 100.0000% 98.2500% 1.7500% 3.0000% 3.0000% 5.0000% 88.7000% 0.3000% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 8 of 11 28L – TSOP I (Reverse Option) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 9 of 11 28L – TSOP I (Reverse Option) Pb-Free Package Document History Page Document Title: 28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-03054 Rev. ** *A ECN No. Orig. of Change 385640 YXP 401165 YXP *B 2579759 MAHA *C DCon 2760409 MAHA *D 3000688 MAHA *E *F 3176689 REYD 3359953 MAHA Description of Change New document Edited Summary section, and added package weight to reflect assembly site 2. Added “(PMDD)” on title page. Added PMDD data for assembly site 2. Edited Note 3 on footer section. Added Note 4 on footer section. 1. Updated Cypress logo. 2. Changed CoA-ZT28-R to CoA-ZY28-R. 3. Added percent weight per homogeneous material and weight of substance per package in the material composition table for Assembly sites 1 and 2. 4. Changed CoA-SP28-T to CoA-ZY28-T. 5. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table for assembly sites 1 and 2. Replaced CML with WEB in distribution list. Corrected package weight for assembly site 2. Recalculated PPM and % Weight of Substance per Package values for assembly site 2. Deleted Fe and Zn from the lead frame material composition of assembly site 1. Recalculated package weight, % Weight of Substance per Homogeneous Material, PPM, and % Weight of Substance per Package values for assembly site 1. Added Assembly Site 3 – JCET Corrected the % weight per homogeneous material of the lead finish of assembly site 1. Expressed the weight, % Weight of Substance per Homogeneous Material, and % Weight of Substance per Package in four decimal places for all assembly sites. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 10 of 11 28L – TSOP I (Reverse Option) Pb-Free Package Document History Page Document Title: 28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-03054 Rev. *G ECN Orig. of No. Change 4032244 YUM *H 4405010 REYD *I *J 4517979 HLR 4950972 HLR DCON Description of Change Added assembly site name in the Assembly heading in site 1, 2 and 3. Changed Assembly Code to Assembly Site Name in site 1, 2 and 3. Removed Tube row in the Indirect Materials Section. Added B2 on Package Weight and QTP # 141303 under Site 3. Added subsections B1.USING GOLD WIRE and B2.USING COPPER PALLADIUM WIRE under Assembly Site 3. Added CAS Number of Carbon Black on Assembly Site 2. Changed the substances with “-------------“to “Trade Secret”. Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-03054 Rev. *J Page 11 of 11