16L – SOIC 300 mils Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 Package Weight – Site 5 SZ / SO3 B1: 437.0084 mg B2: 441.6503 mg B3: 443.9196 mg B1: 444.4001 mg B1: 408.5801 mg Body Size (mil/mm) Package Weight – Site 2 300 mils B1: 432.4737mg Package Weight – Site 4 B1: 489.4798 mg SUMMARY The 16L-SOIC Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT), or “F” (e.g. S25FL256SDPMFIG10) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Amkor Technology Philippines (P1/P2) Package Qualification Report # 044301, 130703, 124706 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ16Amkor Philippines (P1/P2) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 1 of 19 16L – SOIC 300 mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire and Pure Sn Lead Finish Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg % weight of substance per Homogenous material 112.4544 2.7210 0.0349 0.1395 0.9186 2.9600 96.7100% 2.3400% 0.0300% 0.1200% 0.7900% 100.0000% 257,328 6,226 80 319 2,102 6,773 % weight of substance per package 25.7328% 0.6226% 0.0080% 0.0319% 0.2102% 0.6773% PPM Cu Fe P Zn Ag Sn 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Multi-aromatic Resin SiO2 Fused Carbon Black Epoxy Cresol Novolac Phenol Resin Trade Secret 7440-22-4 Trade Secret Trade Secret 96-48-0 0.4000 1.3199 0.0600 0.0600 0.0600 21.0500% 69.4700% 3.1600% 3.1600% 3.1600% 915 3,020 137 137 137 0.0915% 0.3020% 0.0137% 0.0137% 0.0137% 7440-21-3 7440-57-5 Trade Secret 7.9400 0.3900 23.0663 100.0000% 100.0000% 7.5000% 18,169 892 52,782 1.8169% 0.0892% 5.2782% 264.4930 1.5378 6.1510 86.0000% 0.5000% 2.0000% 605,236 3,519 14,075 60.5236% 0.3519% 1.4075% 12.3020 4.0000% 28,150 2.8150% 60676-86-0 1333-86-4 29690-82-2 Trade Secret Package Weight (mg): 437.0084 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 2 of 19 100.0000 16L – SOIC 300 mils Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Gold Wire and NiPdAu Lead Finish Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Cu Fe Zn P Ni Pd Au Epoxy Resin A Epoxy Resin B Ag Lactone Polyoxypropyle nediamine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Au Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin Weight by mg % weight of substance per Homogenous material 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 7440-22-4 Trade Secret Trade Secret 122.0670 3.0069 0.1676 0.0501 1.7808 0.0378 0.0091 0.1356 0.0775 1.4915 0.0775 0.0775 97.4263 2.3999 0.1338 0.0400 97.4339 2.0682 0.4979 7.0000 4.0000 77.0000 4.0000 4.0000 276,388 6,808 380 113 4,032 86 21 307 175 3,377 175 175 % weight of substance per package 27.6388 0.6808 0.0380 0.0113 0.4032 0.0086 0.0021 0.0307 0.0175 0.3377 0.0175 0.0175 Trade Secret 0.0775 4.0000 175 0.0175 7440-21-3 7440-57-5 Trade Secret 10.6722 0.2506 22.6253 100.0000 100.0000 7.5000 24,167 567 51,229 2.4167 0.0567 5.1229 259.4372 1.5084 6.0334 86.0000 0.5000 2.0000 587,427 3,415 13,661 58.7427 0.3415 1.3661 12.0668 4.0000 27,322 2.7322 CAS Number 60676-86-0 1333-86-4 29690-82-2 Trade Secret Package Weight (mg): 441.6503 PPM % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 3 of 19 100.0000 16L – SOIC 300 mils Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Wire and Pure Sn Lead Finish Material Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition 122.0670 3.0069 0.1676 0.0501 1.2755 2.9560 96.4445 2.3757 0.1324 0.0396 1.0077 100.0000 274,975 6,773 378 113 2,873 6,659 % weight of substance per package 27.4975 0.6773 0.0378 0.0113 0.2873 0.6659 Trade Secret Trade Secret 7440-22-4 Trade Secret Trade Secret 0.1356 0.0775 1.4915 0.0775 0.0775 7.0000 4.0000 77.0000 4.0000 4.0000 305 175 3,360 175 175 0.0305 0.0175 0.3360 0.0175 0.0175 Trade Secret 0.0775 4.0000 175 0.0175 7440-21-3 7440-50-8 Trade Secret 10.6722 0.1161 22.6253 100.0000 100.0000 7.5000 24,040 261 50,967 2.4040 0.0261 5.0967 259.4372 1.5084 6.0334 86.0000 0.5000 2.0000 584,424 3,398 13,591 58.4424 0.3398 1.3591 12.0668 4.0000 27,183 2.7183 % Total: 100.0000 CAS Number Cu Fe Zn P Ag Sn 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-22-4 7440-31-5 Epoxy Resin A Epoxy Resin B Ag Lactone Polyoxypropyle nediamine 2,6-Diglycidyl phenyl allyl ether oligomer Silicon Cu Multi-aromatic Resin SiO2 Filler Carbon Black Epoxy Cresol Novolac Phenol Resin 60676-86-0 1333-86-4 29690-82-2 Trade Secret Package Weight (mg): Weight by mg 443.9196 % weight of substance per Homogenous material PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 4 of 19 16L – SOIC 300 mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 5 of 19 16L – SOIC 300 mils Pb-Free Package ASSEMBLY Site 2: UTAC Thailand Limited (UTL) Package Qualification Report # 151502, (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-SZ16UTAC As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 6 of 19 16L – SOIC 300 mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using CuPd Wire, G605 Mold compound, 8200T D/A and Pure Sn Lead Finish Material Leadframe Lead Finish Die Attach Die Wire Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Cu Fe Zn 7440-50-8 7439-89-6 7440-66-6 183.1200 4.3800 0.2300 % weight of substance per Homogenous material 91.3300 2.1900 0.1100 P Sn 7723-14-0 7440-22-4 0.1500 12.6300 Sn 7440-22-4 exo-1,7,7trimethylbicyclo(2.2,1)hept2yl methacrylate 1,1-(1,3 phenylene)bis-1Hpyrrole-2.5-dione Substance Composition Encapsulation % weight of substance per package PPM 423423 10137 522 42.3400 1.0100 0.0500 0.0700 6.3000 338 29208 0.0300 2.9200 17.4166 100.0000 40272 4.0300 7534-94-3 0.8500 20.0000 1975 0.2000 3006-93-7 0.2800 6.5000 642 0.0600 Ag Acrylic acid,2[methyl(1,1,2,2,3,3,4,4,4nonafluorobuty) Silicon Cu 7440-22-4 3.1200 73.0000 7211 0.7200 1017237-78-3 0.0200 0.5000 49 0.0000 7440-21-3 7440-50-8 4.5871 2.2500 100.0000 98.2500 10607 5206 1.0600 0.5200 Pd 7440-05-3 60676-86-0 0.0400 1.7500 93 0.0100 172.8900 85.0000 399770 39.9800 17.2900 0.2000 6.5100 8.5000 0.1000 3.2000 39977 470 15050 4.0000 0.0500 1.5100 6.5100 3.2000 15050 1.5100 Silica Filler Mold Compound CAS Number Weight by mg Epoxy Resin Carbon Black Phenol Resin A Phenol Resin B Trade Secret 1333-86-4 Trade Secret Trade Secret Package Weight (mg): 432.4737 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 7 of 19 100.0000 16L – SOIC 300 mils Pb-Free Package I. Type Tube Tape and Reel Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 8 of 19 16L – SOIC 300 mils Pb-Free Package ASSEMBLY Site 3: Cypress Manufacturing Limited (CML) Package Qualification Report # 154002 I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM Analysis Report Link/s < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 CoA-SZ16CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 9 of 19 16L – SOIC 300 mils Pb-Free Package B1. NiPdAu, Green Molding Compound, Copper-Palladium (Cu-Pd) Material Purpose of Use Lead frame Base Material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Cu Ni Si Mg Nickel Palladium Gold Silver Carbocyclic acrylate Bismaleimide Resin Acrylate Additive Silicon Copper Palladium Silica - SiO2 Epoxy Resin Phenol Resin CAS Number 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Weight by mg 128.4247 4.8096 0.3857 0.0798 1.0533 0.0008 0.0006 0.2842 Trade Secret 0.0429 Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret 0.0166 0.0109 0.0020 6.2900 0.0134 0.0001 273.8677 16.5212 12.5966 Package Weight (mg): 444.4001 % Weight of Substance per Homogeneous Material 96.0544% 3.5973% 0.2885% 0.0597% 99.8938% 0.0664% 0.0398% 79.6882% PPM 288,985 10,823 868 180 2,370 2 1 639 28.8985% 1.0823% 0.0868% 0.0180% 0.2370% 0.0002% 0.0001% 0.0639% 97 0.0097% 37 24 5 14,1534 30 0.02 616,264 37,176 28,345 0.0037% 0.0024% 0.0005% 1.4154% 0.0030% 0.000002% 61.6264% 3.7176% 2.8345% %Total: 100.0000 % 12.0425% 4.6543% 3.0502% 0.5648% 100.0000% 99.2592% 0.7408% 90.3897% 5.4528% 4.1575% % Weight of Substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 10 of 19 16L – SOIC 300 mils Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tube Others Material Cover tape Carrier tape Plastic Reel Plastic Tube End Plug Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 5.0 < 5.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 < 1.0 < 1.0 <5.0 <5.0 <5.0 ----------- < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-PLTB-R CoA-EPLG-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 11 of 19 16L – SOIC 300 mils Pb-Free Package ASSEMBLY Site 6: ASE Chung-Li, Taiwan Package Qualification Report # 160807 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SO3ASECL As per MSDS As per MSdS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 12 of 19 16L – SOIC 300 mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Leadframe Lead Finish Die Attach Die Wire Mold Compound Copper (Cu) Iron(Fe) Phosphorus (P) Zinc (Zn) Silver Plating (Internal) 7440-50-8 7439-89-6 7723-14-0 7440-66-6 155.3288 1.4969 0.0161 0.0966 % Weight of Substance per Homogeneous Material 96.5000% 0.9300% 0.0100% 0.0600% 7440-22-4 4.0241 Matte Sn 7440-31-5 Purpose of Use Base Material External Plating Adhesive Circuit Interconnect Encapsulation Substance Composition Silver flake Acrylic resin Polybutadiene derivative Butadiene copolymer Acrylate Epoxy resin Peroxide Additive Silicon Copper Silica Fused Epoxy Resin-1 Epoxy Resin-2 Epoxy Resin-3 Hardener Carbon Black CAS Number Weight by mg PPM 54057 111 3019 344 5.4057% 0.0111% 0.3019% 0.0344% 2.5000% 162 0.0162% 1.0814 100.0000% 81 0.0081% 7440-22-4 trade secret 1.4779 0.1686 74.5003% 8.5002% 223 101 0.0223% 0.0101% trade secret 0.0794 4.0001% 41 0.0041% trade secret 0.0397 1.9998% 81 0.0081% trade secret trade secret trade secret trade secret 7440-21-3 7440-50-8 60676-86-0 trade secret trade secret trade secret trade secret 1333-86-4 0.1091 0.0496 0.0198 0.0397 26.4600 0.0543 270.5387 4.1851 1.1958 11.9575 10.4628 0.5979 5.4998% 2.4999% 1.0001% 1.9998% 100.0000% 100.0000% 90.5000% 1.4000% 0.4000% 4.0000% 3.5000% 0.2000% 317334 3058 33 197 8221 552707 8550 2443 24429 21375 1221 2209 31.7334% 0.3058% 0.0033% 0.0197% 0.8221% 55.2707% 0.8550% 0.2443% 2.4429% 2.1375% 0.1221% 0.2209% % Total: 100.0000% Package Weight (mg): 489.4798 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J % Weight of Substance per Package Page 13 of 19 16L – SOIC 300 mils Pb-Free Package II. Type Tube Tape and Reel Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 14 of 19 16L – SOIC 300 mils Pb-Free Package ASSEMBLY Site 5: Zhen Kun Technology Limited (ZKT) Package Qualification Report # 160807 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report Link/s CoA-SO3-ZKT As per MSDS As per MSdS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 15 of 19 16L – SOIC 300 mils Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING Cu WIRE Material Leadframe Lead Finish Die Attach Base Material External Plating Adhesive Die Circuit Wire Interconnect Mold Compound CAS Number Weight by mg % Weight of Substance per Homogeneous Material PPM % Weight of Substance per Package Copper (Cu) Iron(Fe) Phosphorus (P) Zinc (Zn) Silver Plating (Internal) 7440-50-8 7439-89-6 7723-14-0 7440-66-6 78.1601 1.9869 0.0698 0.1057 92.4425% 2.3500% 0.0825% 0.1250% 93617 966 35 639 9.3617% 0.0966% 0.0035% 0.0639% 7440-22-4 4.2275 5.0000% 67 0.0067% Matte Sn 7440-31-5 13 0.0013% Purpose of Use Encapsulation Substance Composition Silver flake substituted dimethacrylate substituted polyamine bisphenol F 2-Ethylhexyl glycidyl ether Silicon Copper (Cu) Palladium(Pd) Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-22-4 8.5621 100.0000% 0.2610 76.0000% 63 0.0063% 0.0275 8.0000% 59 0.0059% 0.0052 1.5000% 191297 19.1297% 28064-14-4 0.0258 7.5000% 4863 0.4863% 2461-15-6 0.0240 7.0000% 171 0.0171% 7440-21-3 7440-50-8 7440-05-3 60676-86-0 38.2500 0.3946 0.0141 243.2899 17.4173 14.9292 0.8294 100.0000% 96.5500% 3.4500% 88.0000% 6.3000% 5.4000% 0.3000% 259 10347 595452 42629 36539 2030 20956 0.0259% 1.0347% 59.5452% 4.2629% 3.6539% 0.2030% 2.0956% Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 408.5801 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 16 of 19 100.0000% 16L – SOIC 300 mils Pb-Free Package II. Type Tube Tape and Reel Others DECLARATION OF PACKAGING INDIRECT MATERIALS Material Plastic Tube End Plug Carrier Tape Moisture Barrier Bag Dessicant HIC Bubble Pack Carton Label Inner Label Shielding Bag Lead PPM <5.0 <5.0 <5.0 Cadmium PPM <5.0 <5.0 <5.0 Cr VI PPM <5.0 <5.0 <5.0 Mercury PPM <5.0 <5.0 <5.0 PBB PPM <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-PLTB-R CoA-EPLG-R CoA-CART-R <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 CoA-MBBG-R <5.0 <5.0 <5.0 <10.0 <10.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <5.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 <5.0 <5.0 <10.0 <5.0 <5.0 < 5.0 CoA-DESS-R CoA-HIC-R CoA-BUBB-R CoA-CRTN-R CoA-LBL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 17 of 19 16L – SOIC 300 mils Pb-Free Package Document History Page Document Title: Document Number: Rev. 16L - SOIC 300MILS PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05013 ** *A ECN No. Orig. of Change 410529 YXP 2264970 HLR *B DCon 3242150 HLR *C 3600532 HLR *D 4009716 YUM VFR *E 4158625 HLR *F *G 4764230 HLR 4961657 PRCH *H 5012224 RODP Description of Change New specification. Updated Cypress Logo Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table Replaced CML with WEB in distribution list. Removed Tray Based on Indirect Materials Declaration table. Updated Assembly Site 1 to reflect 4 decimal places on values of material composition table. Added assembly site name in the assembly heading. Changed Assembly code to assembly site name. Added Assy Site 2 B2 – Material Composition with Au wire and NiPdAu Lead finish, reference QTP # 130703 and B3 – Material Composition with Cu wire and Pure Sn Lead finish, reference QTP # 124706. Corrected the % weight for homogenous materials for NiPdAu material for Assembly Site 1.B2 Material Composition. Sunset Due – No Change. Added UTL for Site 2 CuPd wire G605 mold compound and Pure Sn plating Removed “Distribution: WEB” and “Posting: NONE” from the document history page. Added CML as Site 3 B1 Material composition with NiPdAu, Green Molding Compound, Copper-Palladium Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 18 of 19 16L – SOIC 300 mils Pb-Free Package Rev. ECN No. Orig. of Change *I *J 5157936 CHAL 5277649 HLR Description of Change (Cu-Pd), ref. QTP # 154002 Added SOIC 16L (SO3016) ASECL and ZKT assembly. Changed Cypress Logo. Changed the substances with “------------- “ and Proprietary to “Trade Secret". Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05013 Rev. *J Page 19 of 19