68L – QFN 8x8x0.9 mm Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LY 169.9648 mg Body Size (mil/mm) 8x8x0.9 mm SUMMARY The 68L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C24094A-24LFXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 062501 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LY68CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-08151 Rev.*I Page 1 of 4 68L – QFN 8x8x0.9 mm Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Lead Frame Lead Finish Die Attach Die Bond/Au Wire Purpose of Use 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret 94.8092 0.0681 2.3359 0.1168 0.1834 0.0033 0.0033 7.6200 0.4400 % weight of substance per Homogenous material 97.4100% 0.0700% 2.4000% 0.1200% 96.5200% 1.7370% 1.7430% 80.0000% 10.0000% Trade Secret 0.0550 Trade Secret Trade Secret Organic peroxide Si Au Pd Epoxy Resin 1 Epoxy Resin 1 Phenol Resin SiO2 Substance Composition Cu P Base Material Fe Zn Ni External Plating Pd Au Ag Proprietary bismaleimide Adhesive Proprietary polymer Methacrylate Acrylate ester Circuit Interconnect Mold Compound CAS Number Weight by mg PPM % weight of substance per package 557,817 401 13,744 687 1,079 19 19 44,833 2,589 55.7817% 0.0401% 1.3744% 0.0687% 0.1079% 0.0019% 0.0019% 4.4833% 0.2589% 5.0000% 324 0.0324% 0.0275 0.0165 3.0000% 1.0000% 162 97 0.0162% 0.0097% Trade Secret 7440-21-3 7440-57-5 7440-05-3 Trade Secret Trade Secret 0.0055 0.0001 3.8907 0.0393 1.5088 1.2070 1.0000% 100.0000% 99.0000% 1.0000% 2.5000% 2.0000% 32 1 22,891 231 8,877 7,101 0.0032% 0.0001% 2.2891% 0.0231% 0.8877% 0.7101% Trade Secret 60676-86-0 1.5088 53.0477 2.5000% 87.9000% 8,877 312,110 0.8877% 31.2110% 1333-86-4 0.0604 0.1000% 355 0.0355% Metal Hydroxide Trade Secret 1.8105 3.0000% 10,652 1.0652% Others Trade Secret 1.2070 2.0000% 7,101 0.7101% Encapsulation Carbon Black Package Weight (mg): 169.9648 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-08151 Rev.*I Page 2 of 4 68L – QFN 8x8x0.9 mm Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 Shielding bag <2 .0 Cr VI PPM Mercury PPM PBB PPM PBDE PPM <20.0 <5.0 < 5.0 < 5.0 <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 <2.0 <2.0 <2.0 <5.0 <5.0 Cadmium PPM Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-08151 Rev.*I Page 3 of 4 68L – QFN 8x8x0.9 mm Pb-Free Package Document History Page Document Title: Document Number: 68L - QFN 8X8x0.9 MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-08151 Rev ECN No. . ** 478026 *A 596999 Orig. of Change IMZ IMZ/MR B *B 3123971 HLR New Specification - Changed Cypress Logo - Update Epoxy QMI-509,Lead finish composition, and CEL 9220 HF13 composition mold compound - Completed the 6 RoHS substances on Declaration of packaging indirect materials - Updated the declaration of packaging indirect materials Added Note 4 on Footer Section. 3261110 DCON VFR Changed CML to WEB in distribution list. Added LT on the Cypress Package Code portion. *C *D 3477117 VFR *E 3599270 JARG *F 3855220 HLR *G 4050691 YUM *H *I 4644633 5123002 HLR HLR SLLO Description of Change Added Assembly Site 2 – ASE Taiwan (G). Reference QTP # 111816. Added Assembly Site 3 – ASE Taiwan (G) Copper Wire qualification. Reference QTP # 114906. Removed Assembly Sites 2 and 3 – ASE Assembled and transferred to spec 001-17657 in reference to QTPs 111816 and 114906 which reflects 8x8x1.0mm package dimension Updated the material composition table to reflect 4 decimal places on values. Added assembly site name in the Assembly heading. Changed Assembly code to Assembly site name. Sunset Due – No ChangeHLR Changed the substances with “------------- “to “Trade Secret Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-08151 Rev.*I Page 4 of 4