Document No.002-03306 Rev. *A ECN # 5077312 Cypress Semiconductor Package Qualification Report QTP# 153602 VERSION *A January 2016 165 FBGA (13x15x1.4mm) Sn/Pb & SAC405 Ball Finish, CuPd Wire MSL3, 260C Reflow BKK-Thailand (SB) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Lorena R. Zapanta(ILZ) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.002-03306 Rev. *A ECN # 5077312 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 153602 Qualification of 165 FBGA (13x15x1.4mm) at Cypress Bangkok, Thailand (BKK) Assembly using 0.8mil Cu-Pd wire, HR9050G Die Attach Film, KMC-3580LVA Mold Compound with Sn/Pb & Sn/Ag/Cu Ball Finish at MSL3, 260C Reflow Temperature September 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 Document No.002-03306 Rev. *A ECN # 5077312 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BW165, BB165 Package Outline, Type, or Name: 165-Ball FBGA (Fine Ball Grid Array) Mold Compound Name/Manufacturer: KMC-3580LVA/ ShinEtsu Mold Compound Flammability Rating: V-0 / UL94 Oxygen Rating Index: >40% Leadframe Material: BT Resin Lead Finish, Composition / Thickness: Sn/Ag/Cu (SAC405), SnPb Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Hitachi Die Attach Material: HR9050G Bond Diagram Designation: 001-98083 Wire Bond Method: Thermosonic Wire Material/Size: CuPd, 0.8 mil Thermal Resistance Theta JA °C/W: 72°C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-97055 Name/Location of Assembly (prime) facility: BKK-Thailand (SB) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.002-03306 Rev. *A ECN # 5077312 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack P P P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/1,000V/1,250V JESD22-C101 P Final Visual JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 110°C, 85% RH, 1.95V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P High Temperature Storage JESD22-A103:150°C No bias P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) P Solder Ball Shear JESD22-B117 P Solderability J-STD-002, JESD22-B102 P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Reliability Test Data QTP #: 153602 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 15 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 15 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 15 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 15 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 15 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 15 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 30 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 30 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 30 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 30 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 30 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 30 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 30 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 30 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 30 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 30 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 30 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 30 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 5 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Reliability Test Data QTP #: 153602 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: DIE SHEAR CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 10 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 10 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 10 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 10 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 10 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 10 0 STRESS: DYE PENETRANT TEST CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 15 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 15 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 15 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 15 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 15 0 STRESS: ESD-CHARGE DEVICE MODEL CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 500 9 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 1000 3 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 1250 3 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 656 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 916 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 286 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 391 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 388 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 1828 0 STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Reliability Test Data QTP #: 153602 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (110C, 85%RH, 1.95V), PRE COND 192 HR 30C/60%RH (MSL3) CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 264 28 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 528 28 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 264 28 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 528 28 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 264 25 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 528 25 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 264 25 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 528 24 0 STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 500 80 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 1000 80 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 5 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 5 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (MSL3) CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 168 80 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 288 80 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 168 79 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 168 77 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 168 77 0 STRESS: PHYSICAL DIMENSION CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 656 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 916 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 286 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 391 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 388 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 1828 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Reliability Test Data QTP #: 153602 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: SOLDER BALL SHEAR CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 25 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 25 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 25 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 25 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 25 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 25 0 STRESS: SOLDERABILITY TEST CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 3 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 3 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 3 0 STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 500 80 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 1000 80 0 CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand 1500 80 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 500 79 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 1000 76 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand 1500 76 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 500 77 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 1000 77 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand 1500 77 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand 500 76 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 500 75 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 1000 75 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand 1500 75 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand 500 77 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Reliability Test Data QTP #: 153602 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: X-RAY CY7C1414KV18 (7CD1414K) 9314007 RFB2336 SB-Thailand COMP 10 0 CY7C1414KV18 (7CD1414K) 9314007 611524100 SB-Thailand COMP 10 0 CY7C1414KV18 (7CD1414K) 9314007 611524099 SB-Thailand COMP 10 0 CY7C1514KV18 (7CD1514K) 9429001 611524102 SB-Thailand COMP 10 0 CY7C1514KV18 (7CD1514K) 9429001 611524101 SB-Thailand COMP 10 0 CY7C1312KV18 (7CD1312K) 9450004 611524098 SB-Thailand COMP 10 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.002-03306 Rev. *A ECN # 5077312 Document History Page Document Title: Document Number: Rev. ECN No. ** 4912817 *A 5077312 QTP# 153602: 165 FBGA (13X15X1.4MM) SN/PB & SAC405 BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, BKK-THAILAND (SB) 002-03306 Orig. of Change JYF ILZ Description of Change Initial spec release. Added Extended Readpoints on HAST (528Hours) and Temperature Cycle Stress Testing (1000/1500cycles) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10