Document No. 002-11403 Rev. ** ECN #5153831 Cypress Semiconductor Automotive Package Qualification Report QTP# 154004 VERSION ** February, 2016 48 FBGA Package (6mm x 10mm x 1.2mm) SnAgCu, Au Wire MSL3, 260C Reflow ASE, Taiwan FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-11403 Rev. ** ECN #5153831 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 154004 New Automotive (-40C to +125C) Package Qualification of the ASE 48 FBGA with KE G2270 Low Alpha Mold Compound, 2025D Die Attach, 1.0 mil Au Bond Wire, SnAgAu Lead Finish, 260C Reflow, MSL3 Feb 2016 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-11403 Rev. ** ECN #5153831 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: BK48C Mold Compound Flammability Rating: 48 FBGA KE G2270 (low alpha) / KYOCERA V-0 Mold Compound Alpha Emission Rate: 0.001C/CM2-H Oxygen Rating Index: >28% 52% Substrate Material: BT Resin / UMTC Lead Finish, Composition / Thickness: SnAgCu 0.3 Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: 2025D Bond Diagram Designation 001-97797 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil Au Thermal Resistance Theta JA C/W: 46.09 C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41040 Name/Location of Assembly (prime) facility: ASE-G MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Sort Test: CMI, USA / Class Test and Finish: CML, Philippines Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-11403 Rev. ** ECN #5153831 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESDCDM) Latchup Sensitivity NVM Endurance /Data Retention (Plastic) Test Condition (Temp/Bias) Result P/F AEC-Q100-002, 500V, 1,000V, 2,000V P AEC-Q100-011, 250V, 500V, 750V (corner pins) P P P High Temperature Operating Life Early Failure Rate AEC-Q100-004, +/- 140mA at 125C, 5.4V AEC-Q100-005, Endurance at 25C with Retention at 25C and Endurance at 125C with Retention at 150 C, nonbiased AEC-Q100-005 and JESD22-A108, Endurance at 125C with Life Test at 150 C, Dynamic Operating Condition, Vcc = 3.60V AEC-Q100-008 and JESD22-A108, 150 C Dynamic Operating Condition, Vcc = 3.60V High Temperature Operating Life Latent Failure Rate JESD22-A108, 150 C Dynamic Operating Condition, Vcc = 3.60V P High Accelerated Saturation Test (HAST) JESD22-A110,130 C, 85%RH, nnV Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) JESD22- A104, -65 C to 150 C Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) Mil-Std 883, Method 2011 P P Wire Bond Shear JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22-A113 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH) AEC Q100-001 Wire Bond Pull Mil-Std 883, Method 2011 P Solderability JESD22-B102 P Physical Dimensions JESD22B100 and B108 P Solder Ball Shear AEC Q100-010 P Electrical Distributions AEC Q100-009 P NVM Endurance / High Temperature Operating Life Temperature Cycle Post Temperature Cycle Wire Bond Pull Pressure Cooker Test Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P P P Document No. 002-11403 Rev. ** ECN #5153831 Reliability Test Data QTP #: 154103 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 500V 3 0 1000V 3 0 2000V 3 0 3 0 3 0 Failure Mechanism STRESS: Electrostatic Discharge- Human Body Model (ESD-HBM): 500V CY14B104NA-BA45XE 4520595 611530604 ASE-G STRESS: Electrostatic Discharge- Human Body Model (ESD-HBM): 1,000V CY14B104NA-BA45XE 4520595 611530604 ASE-G STRESS: Electrostatic Discharge- Human Body Model (ESD-HBM): 2,000V CY14B104NA-BA45XE 4520595 611530604 ASE-G STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 250V CY14B104NA-BA45XE 4520595 611530604 ASE-G 250V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 500V CY14B104NA-BA45XE 4520595 611530604 ASE-G 500V STRESS: Electrostatic Discharge- Charge Device Model (ESD-CDM): 48 BGA- 750V (corner pins) CY14B104NA-BA45XE 4520595 611530604 ASE-G 750V 3 0 COMP 6 0 80 80 80 0 0 0 80 80 80 0 0 0 STRESS: Static Latch up, ±140mA 125C, and Overvoltage Test at 5.4V CY14B104NA-BA45XE 4520595 611530604 ASE-G STRESS: 125C Endurance Test (1.4 Million Cycles) + 150C, 1000 hour Data Retention CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 1000 1000 1000 STRESS: 25C Endurance Test (1.4 Million Cycles) + 25C, 1000 hour Data Retention CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 1000 1000 1000 STRESS: 125C Endurance Test (1.4 Million Cycles) + High Temperature Operating Life, 150C, 3.6V, 408 Hrs CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 408 408 408 79 80 80 0 0 0 3446 3446 3448 0 0 0 80 80 80 0 0 0 STRESS: High Temperature Operating Life- Early Failure Rate, 150C, 3.6V, 48 Hrs CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 48 48 48 STRESS: High Temperature Operating Life- Latent Failure Rate, 150C, 3.6V, 408 Hrs CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 408 408 408 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-11403 Rev. ** ECN #5153831 Reliability Test Data QTP #: 154103 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: Highly Accelerated Saturation Test (HAST), 130C, 85%RH, 3.6V (MSL 3 Preconditioning) CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G 96 96 96 80 80 80 0 0 0 STRESS: Temperature Cycling Test (TCT), Condition C, -65 C to 150 C (MSL 3 Preconditioning) CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4520595 611530604 611530604 ASE-G ASE-G 500 1000 80 80 0 0 CY14B104NA-BA45XE CY14B104NA-BA45XE 4504243 4504243 611530606 611530606 ASE-G ASE-G 96 1000 80 80 0 0 CY14B104NA-BA45XE CY14B104NA-BA45XE 4519953 4519953 611530603 611530603 ASE-G ASE-G 96 1000 80 80 0 0 ASE-G 500 5 0 STRESS: Post Temperature Cycling Test (TCT) Bond Pull CY14B104NA-BA45XE 4520595 611530604 STRESS: Pressure Cooker Test (PCT), 121 C, 100%RH, 15 PSIG (MSL 3 Preconditioning) CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4520595 611530604 611530604 ASE-G ASE-G 96 168 80 80 0 0 CY14B104NA-BA45XE CY14B104NA-BA45XE 4504243 4504243 611530606 611530606 ASE-G ASE-G 96 168 80 80 0 0 CY14B104NA-BA45XE CY14B104NA-BA45XE 4519953 4519953 611530603 611530603 ASE-G ASE-G 96 168 80 80 0 0 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP 150 150 150 0 0 0 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP 150 150 150 0 0 0 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP 30 30 30 0 0 0 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP 15 15 15 0 0 0 STRESS: Wire Bond Shear CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE STRESS: Wire Bond Pull CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE STRESS: Solderability CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE STRESS: Physical Dimensions CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE STRESS: BGA Solder Ball Shear CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-11403 Rev. ** ECN #5153831 Reliability Test Data QTP #: 154103 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 30 30 30 0 0 0 Failure Mechanism STRESS: Electrical Distributions CY14B104NA-BA45XE CY14B104NA-BA45XE CY14B104NA-BA45XE 4520595 4504243 4519953 611530604 611530606 611530603 ASE-G ASE-G ASE-G COMP COMP COMP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No. 002-11403 Rev. ** ECN #: 5153831 Document History Page Document Title: QTP# 154004: New Automotive (-40C to +125C) Package Qualification of the ASE 48 FBGA with KE G2270 Low Alpha Mold Compound, 2025D Die Attach, 1.0 mil Au Bond Wire, SnAgAu Lead Finish, 260C Reflow, MSL3 Document Number: 002-11403 Rev. ECN Orig. of No. Change ** 5153831 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8