TI TS5USBA224RSWR

TS5USBA224
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SCDS306 – OCTOBER 2010
USB 2.0 High-Speed (480 Mbps) and Audio Switches with Negative Signal Capability and
1.8-V Logic Compatibility
Check for Samples: TS5USBA224
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
L
3
GND
4
VAUDIO
5
D–
RSW PACKAGE
(TOP VIEW)
2
1
6
7
D+/R
•
Cellular Phones
Personal Digital Assistants (PDAs)
Portable Instrumentation
Digital Still Cameras
Portable Navigation Devices
R
•
High-Speed USB Switch:
– 4 Ω RDSON Typical
– 12.5 pF CON Typical
– 650-MHz Bandwidth (–3 dB)
Audio Switch:
– 3 Ω RDSON Typical
– Negative Rail Capability
– Low THD: <0.05%
– Internal Shunt Resistors for Click-and-Pop
Reduction
– Powered From VAUDIO (2.7V to 5.5V)
1.8-V Compatible Control Input (ASEL and VBUS)
Threshold
IOFF Supports Partial Powerdown Mode
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 200-V Machine Model (A115-A)
D–/L
1
10
D+
9
VBUS
8
ASEL
DESCRIPTION
The TS5USBA224 is a double-pole, double throw (DPDT) multiplexer that includes a low-distortion audio switch
and a USB 2.0 High-Speed (480Mbps) switch in the same package. This configuration allows the system
designer to use a common connector for audio and USB data. The audio switch is designed to allow audio
signals to swing below ground which makes this common connector configuration possible.
The TS5USBA224 is powered up using VAUDIO. When ASEL=High, the audio path is selected regardless of the
logic level at VBUS. If ASEL=Low and VBUS=High, the USB path is selected. Otherwise if ASEL=Low and VBUS=Low,
the audio path is selected.
The TS5USBA224 also features shunt resistors on the audio path to reduce clicks and pops that may be heard
when the audio switches are selected.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE (1)
QFN 0.4-MM PITCH – RSW
(Pb-Free)
(2)
ORDERABLE PART NUMBER
Tape and reel
TS5USBA224RSWR
TOP-SIDE MARKING
A5R
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TS5USBA224
SCDS306 – OCTOBER 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SUMMARY OF TYPICAL CHARACTERISTICS
USB PATH
Number of switches
ON-state resistance (ron)
ON-state resistance match (Δron)
AUDIO PATH
2
2
4Ω
3Ω
< 0.3 Ω
< 0.3 Ω
N/A
1.5 Ω
< 2 µs
< 4 µs
650 MHz
N/A
OFF isolation (OISO)
–22 dB
–83 dB
Crosstalk (XTALK)
–31 dB
–83 dB
N/A
0.05%
ON-state resistance flatness (ron(flat))
Turn-on/turn-off time (tON/tOFF)
Bandwidth (BW)
Total harmonic distortion (THD)
PIN DESCRIPTION TABLE
PIN
NO.
2
NAME
DESCRIPTION
TYPE
1
D–
I/O
USB Data (Differential –)
2
R
I/O
Right Channel Audio
3
L
I/O
Left Channel Audio
4
GND
Ground
Ground
5
VAUDIO
Power
Supply Voltage
6
D–/L
I/O
USB/Audio Common Connector
7
D+/R
I/O
USB/Audio Common Connector
8
ASEL
Input
Control Input for Audio Path
9
VBUS
Input
Control Input for USB Path
10
D+
I/O
USB Data (Differential +)
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SCDS306 – OCTOBER 2010
FUNCTION TABLE
(1)
ASEL
VAUDIO
VBUS
L,R
D+, D–
L
L
L
L
OFF
OFF
L
H
OFF
L
OFF
H
L
ON
OFF
OFF
(1)
L
H
H
H
L
L
OFF
OFF
ON
H
L
H
OFF
OFF
H
H
L
ON
OFF
H
H
H
ON
OFF
100Ω shunt resistors are enabled in this state.
TYPICAL APPLICATION BLOCK DIAGRAM
Processor
Alternatively, wire
VBUS to the USB
connector for auto
USB detection
D+
D–
ASEL
VBUS
D+/R
D–/L
USB 2.0
Phy
D+
D–
VAUDIO
R
USB
Connector
L
TS5USBA224
AUDR
AUDL
Audio
Amplifier
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SWITCH BLOCK DIAGRAM
D+
D+/R
R
Rshunt
D–
D–/L
L
Rshunt
VAUDIO
VBUS
Rpd1
4
ASEL
Control Logic
Rpd2
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SCDS306 – OCTOBER 2010
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
VAUDIO
VD+
VD–
IK
ID+, ID–
IR, IL
ID+/R
ID–/L
VI
Analog port diode current
VD+, VD– < 0
ON-state switch current
VD+, VD– = 0 to VAUDIO,
VR, VL VD+/R, VD–/L = VAUDIO – 5.5 V to VAUDIO
6.5
V
–0.5
6.5
V
VAUDIO – 6.5
VAUDIO + 0.5
V
UNIT
–50
ON-state peak switch current (4)
Digital input voltage range
(3)
IIK
Digital logic input clamp current
IAUDIO
Continuous current through VAUDIO
IGND
Continuous current through GND
Tstg
Storage temperature range
(2)
(3)
(4)
MAX
Analog voltage Range (3)
VR
VL
(1)
MIN
–0.5
Supply voltage range (3)
mA
–100
100
–200
200
–0.5
6.5
V
–50
mA
100
mA
VI < 0
mA
–100
mA
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.
Pulse at 1-ms duration <10% duty cycle.
PACKAGE THERMAL IMPEDANCE (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Package thermal impedance
qJA
(1)
TEST CONDITIONS
RSW package
TYP
UNIT
175
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C, typical values are at VAUDIO = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
USB SWITCH
VD+,VD–
Analog voltage range
ron
ON-state resistance
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
VD+/D– = 0 V, 0.4 V, ION = –8 mA
Switch ON
0
5.5
V
7
Ω
Δron
ON-state resistance match
between channels
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
VD+/D– = 0 V, 0.4 V, ION = –8 mA
Switch ON
0.3
Ω
ID+(OFF)
ID–(OFF)
D+ ,DOFF leakage current
VAUDIO = 3.6 V, VBUS = 0 V, VASEL = 3.6
V,
VD+ ,VD– = 0.3 V, VD+/R ,VD–/L = 0.3 V
Switch OFF
±50
nA
ID+(ON)
ID–(ON)
D+ ,D–
ON leakage current
VAUDIO = 3.6 V, VBUS = 5 V, VASEL = 0
V,
VD+ ,VD– = 0.3 V, VD+/R = Open
Switch ON
±50
nA
VAUDIO
V
5
Ω
0.3
Ω
2.5
Ω
4
AUDIO SWITCH
VR,VL
Analog voltage range
VAUDIO
– 5.5
ron
ON-state resistance
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
VL/R = –2 V, 0 V, 0.7 V, ION = –26 mA
Switch ON
Δron
ON-state resistance match
between channels
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
VL/R = 0.7 V, ION = –26 mA
Switch ON
ron (flat)
ON-state resistance flatness
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
VL/R = –2 V, 0 V, 0.7 V, ION = –26 mA
Switch ON
3
1.5
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ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to 85°C, typical values are at VAUDIO = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
100
200
Ω
Switch OFF
±50
nA
Switch ON
±50
nA
rSHUNT
Shunt resistance
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
VL/R = 0.7 V, IOSHUNT = 10 mA
Switch OFF
IL(OFF)
IR(OFF)
L , R OFF leakage current
VAUDIO = 3.6 V, VBUS = 5 V, VASEL = 0
V, VR, VL = 0.3 V, VAUDIO–0.3 V,
VD+/R, VD–/L = 0.3 V, VAUDIO–0.3V
IL(ON)
IR(ON)
L , R ON leakage current
VAUDIO = 3.6 V, VBUS = 0 V, VASEL = 3.6
V,D+/R, D–L = 0.3 V, VR, VL = 0.3 V,
VAUDIO–0.3 V, VAUDIO–0.3V
VD+/R, VD–/L =Open
DIGITAL CONTROL INPUTS (ASEL, VBUS)
VIH
Input logic high
VAUDIO = 2.7V to 5.5V
VIL
Input logic low
VAUDIO = 2.7V to 5.5V
IIN
Input leakage current
VAUDIO = 3.6V
1.2
V
VIN = 3.6V
VIN = 0V
0.5
V
±10
mA
±1
rPD1
Internal pulldown resistance
3
MΩ
rPD2
Internal pulldown resistance
5
MΩ
6
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DYNAMIC CHARACTERISTICS
TA = –40°C to 85°C, typical values are at VAUDIO = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
USB SWITCH
tON
Turn-on time
VAUDIO = 3 V, VBUS = 0 V to 5 V, VASEL = 0 V,
VD+/R, D–/L = 1 V, Figure 10
2
ms
tOFF
Turn-off time
VAUDIO = 3 V, VBUS = 5 V to 0 V, VASEL = 0 V,
VD+/R, D–/L = 1 V, Figure 10
1
ms
tSK(O)
Channel-to-channel skew
f = 240 MHz,
Figure 11
35
ps
Skew of opposite
transitions of same
output
f = t 240 MHz,
Figure 11
25
ps
tSK(P)
CD+(OFF)
CD–(OFF)
D+, D-OFF capacitance
VAUDIO = 3 V, VBUS = 0 V, ASEL = 3 V,
f = 240 MHz
Switch OFF
2.8
pF
CD+(ON)
CD–(ON)
D+, D– ON capacitance
VAUDIO = 3 V, VBUS = 5 V, ASEL = 0 V,
f = 240 MHz
Switch ON
12.5
pF
CI
Digital input capacitance
VAUDIO = 3 V, VBUS = 0 V, ASEL = 0 V,
f = 1 MHz
2.2
pF
BW
Bandwidth
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V, Figure 12
Switch ON
650
MHz
OISO
OFF Isolation
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
RL = 50 Ω, f = 240 MHz, Figure 14
Switch OFF
–22
dB
XTALK
Crosstalk
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
RL = 50 Ω, f = 240 MHz, Figure 13
Switch ON
–31
dB
AUDIO SWITCH
tON
Turn-on time
VAUDIO = 3 V, VBUS = 0 V or 5 V, VASEL = 0 V to 3 V,
VD+/R,D–/L = 1 V, Figure 10
4
ms
tOFF
Turn-off time
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V to 0 V,
VD+/R,D–/L = 1 V, Figure 10
1
ms
CL(OFF)
CR(OFF)
L , R OFF capacitance
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
f = 20 kHz
Switch OFF
4.5
pF
CL(ON)
CR(ON)
L, R ON capacitance
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
f = 20 kHz
Switch ON
15
pF
–83
dB
OFF Isolation
VAUDIO = 3 V, VBUS = 5 V, VASEL = 0 V,
RL = 50 Ω,
f = 20 kHz, Figure 14
Switch OFF
OISO
–83
dB
Crosstalk
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V,
RL = 50 Ω,
f = 20 kHz, Figure 13
Switch ON
XTALK
THD
Total harmonic distortion
VAUDIO = 3 V, VBUS = 0 V, VASEL = 3 V, f = 20 Hz to 20 kHz,
RL = 600 Ω, VIN = 2 Vpp
0.05
%
SUPPLY
VAUDIO
Power supply voltage
IAUDIO
Positive supply current
VAUDIO = 3.6 V, VBUS = 0 or 5 V, VASEL = 0 to 3.6 V, IOUT = 0
2.7
IOFF
Power off leakage
current
VAUDIO = 0 V, VD+/R, D–/L, D+, D–, L, R = 0 to 5.5 V
6
5.5
V
10
mA
±10
mA
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TYPICAL CHARACTERISTICS
12
4.5
4
ron - On-State Resistance - W
ron - On-State Resistance - W
10
3.5
3
2.5
2
1.5
1
8
6
4
2
0.5
0
-2.5
-2
-1.5
-1
-0.5
0
0.5
VI - Input Voltage - V
1
0
1.5
Figure 1. ON Resistance vs VI for Audio Switch
0
0.1
0.2 0.3 0.4 0.5 0.6 0.7 0.8
VI - Input Voltage - V
0.9
1
Figure 2. ON Resistance vs VI for USB Switch
0
0.03
-2
-3
0.02
Attenuation - dB
THD - Total Harmonic Distortion - %
-1
0.025
0.015
0.01
-4
-5
-6
-7
-8
0.005
-9
0
0
5000
10000
15000
f - Frequency - Hz
20000
Figure 3. THD vs Frequency for Audio Switch
8
25000
-10
100.0E+3
1.0E+6
10.0E+6 100.0E+6
f - Frequency - Hz
1.0E+9
10.0E+9
Figure 4. Gain vs Frequency for USB Switch
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0
-10
-10
-20
-20
-30
-30
Attenuation - dB
Attenuation - dB
TYPICAL CHARACTERISTICS (continued)
0
-40
-50
-60
-40
-50
-60
-70
-70
-80
-80
-90
-90
-100
100.0E+3
1.0E+6
10.0E+6 100.0E+6
f - Frequency - Hz
1.0E+9
-100
100.0E+3 1.0E+6
10.0E+9
Figure 5. Off Isolation vs Frequency for Audio Switch
10.0E+6 100.0E+6
f - Frequency - Hz
1.0E+9
10.0E+9
Figure 6. Off Isolation vs Frequency for USB Switch
0
0
-10
-20
-30
-40
Attenuation - dB
Attenuation - dB
-20
-60
-80
-40
-50
-60
-70
-80
-100
-90
-120
100.0E+3
1.0E+6
10.0E+6 100.0E+6
f - Frequency - Hz
1.0E+9
10.0E+9
Figure 7. Cross Talk vs Frequency for Audio Switch
-100
100.0E+3
1.0E+6
10.0E+6 100.0E+6
f - Frequency - Hz
1.0E+9
10.0E+9
Figure 8. Cross Talk vs Frequency for USB Switch
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TYPICAL CHARACTERISTICS (continued)
Figure 9. USB 2.0 Eye Pattern for USB Switch
10
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SCDS306 – OCTOBER 2010
PARAMETER MEASUREMENT INFORMATION
(Enable and Disable Times)
VDD
Input Generator
VIN
50 W
50 W
VG1
TEST CIRCUIT
DUT
2 × VDD
Input Generator
VI
S1
RL
VO
GND
50 W
CL
(see Note A)
50 W
VG2
RL
TEST
VAUDIO (VDD)
S1
RL
Vin
CL
VD
tPLZ/tPZL
3.3 V
2 × VDD
200 W
GND
10 pF
0.3 V
tPHZ/tPZH
3.3 V
GND
200 W
VDD
10 pF
0.3 V
VI
VO
VDD
Output Control
(VIN)
VDD/2
VDD/2
0V
Output
Waveform 1
S1 at 2 VDD
(see Note B)
tPZL
tPLZ
VOH
VDD/2
tPZH
VO
Open
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 10%
VOL
tPHZ
VDD/2
VOH - 10%
VOH
VOL
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis or tOFF.
F. t PZL and tPZH are the same as ten or tON.
Figure 10. Test Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION
(Skew)
VDD
Input Generator
VIN
50 W
50 W
VG1
TEST CIRCUIT
DUT
2 × VDD
Input Generator
RL
TEST
VAUDIO (VDD)
S1
RL
Vin
CL
tsk(o)
3.3 V ± 0.3 V
Open
200 W
VDD or GND
10 pF
tsk(p)
3.3 V ± 0.3 V
Open
200 W
VDD or GND
10 pF
3.5 V
2.5 V
1.5 V
Data In at
Ax or Ay
tPLHx
tPHLx
VOH
(VOH + VOL)/2
VOL
Data Out at
XB1 or XB2
tsk(o)
VO
CL
(see Note A)
50 W
VG2
VO
Open
GND
50 W
VI
RL
VO
VI
S1
3.5 V
2.5 V
1.5 V
Input
tsk(o)
VOH
(VOH + VOL)/2
VOL
Data Out at
YB1 or YB2
tPLHy
tPHLy
tPLH
VOH
(VOH + VOL)/2
VOL
Output
tsk(o) = t PLHy - t PLHx or t PHLy - t PHLx
VOLTAGE WAVEFORMS
OUTPUT SKEW (tsk(o))
tPHL
tsk(p) = t PHL - t PLH
VOLTAGE WAVEFORMS
PULSE SKEW [tsk(p)]
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 11. Test Circuit and Voltage Waveforms
12
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PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
VBIAS
Network Analyzer
(HP8753ES)
P1
P2
VDD
0B1
A0
SEL
DUT
CL = 10 pF
(see Note A)
VSEL
A.
CL includes probe and jig capacitance.
Figure 12. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the
input, the output is measured at 0B1. All unused analog I/O ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
VBIAS
Network Analyzer
(HP8753ES)
P1
P2
VDD
A0
0B1
RL = 50 W
A1
1B1
0B2
DUT
A2
1B2
2B1
RL = 50 W
A3
3B1
2B2
3B2
SEL
VSEL
A.
CL includes probe and jig capacitance.
B.
A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 13. Test Circuit for Crosstalk (XTALK)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A1 is the
input, the output is measured at A3. All unused analog input (A) ports are connected to GND, and output (B)
ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
14
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PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
VBIAS
Network Analyzer
(HP8753ES)
P1
P2
VDD
A0
0B1
RL = 50 W
A1
1B1
DUT
0B2
1B2
SEL
VSEL
A.
CL includes probe and jig capacitance.
B.
A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 14. Test Circuit for OFF Isolation (OISO)
OFF isolation is measured at the output of the OFF channel. For example, when VSEL = GND and A1 is the input,
the output is measured at 1B2. All unused analog input (A) ports are connected to ground, and output (B) ports
are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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Product Folder Link(s): TS5USBA224
15
PACKAGE OPTION ADDENDUM
www.ti.com
29-Oct-2010
PACKAGING INFORMATION
Orderable Device
TS5USBA224RSWR
Status
(1)
ACTIVE
Package Type Package
Drawing
UQFN
RSW
Pins
Package Qty
10
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
NIPDAU
MSL Peak Temp
(3)
Samples
(Requires Login)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Oct-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS5USBA224RSWR
Package Package Pins
Type Drawing
UQFN
RSW
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
8.4
Pack Materials-Page 1
1.59
B0
(mm)
K0
(mm)
P1
(mm)
2.09
0.72
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Oct-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS5USBA224RSWR
UQFN
RSW
10
3000
202.0
201.0
28.0
Pack Materials-Page 2
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