AOSMD AO3423

AO3423
P-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO3423 uses advanced trench technology to
provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 2.5V. This
device is suitable for use as a load switch or in PWM
applications. It is ESD protected. Standard Product
AO3423 is Pb-free (meets ROHS & Sony 259
specifications). AO3423L is a Green Product
ordering option. AO3423 and AO3423L are
electrically identical.
VDS (V) = -20V
(V GS = -10V)
ID = -2 A
RDS(ON) < 92mΩ (VGS = -10V)
RDS(ON) < 118mΩ (VGS = -4.5V)
RDS(ON) < 166mΩ (VGS = -2.5V)
ESD Rating: 2000V HBM
D
TO-236
(SOT-23)
Top View
G
G
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
Current A
F
TA=25°C
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
W
0.9
TJ, TSTG
t ≤ 10s
Steady-State
Steady-State
A
1.4
-55 to 150
Symbol
A
V
-8
PD
TA=70°C
A
±12
-2
ID
IDM
TA=25°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead C
Units
V
-2
TA=70°CF
Pulsed Drain Current B
Power Dissipation A
Maximum
-20
RθJA
RθJL
Typ
65
85
43
°C
Max
90
125
60
Units
°C/W
°C/W
°C/W
AO3423
Electrical Characteristics (T J=25°C unless otherwise noted)
Parameter
Symbol
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250µA, VGS=0V
-20
-0.5
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.7
ID(ON)
On state drain current
VGS=-4.5V, VDS=-5V
-8
TJ=55°C
-2.5
µA
VDS=0V, VGS=±12V
±10
µA
-1.4
V
92
108
VGS=-4.5V, ID=-2A
94
118
mΩ
VGS=-2.5V, ID=-1A
128
166
mΩ
VDS=-5V, ID=-2A
6.8
Forward Transconductance
VSD
IS=-1A,VGS=0V
Diode Forward Voltage
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Reverse Transfer Capacitance
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
A
90
gFS
Rg
-0.9
76
TJ=125°C
Static Drain-Source On-Resistance
Crss
µΑ
±1
RDS(ON)
Output Capacitance
Units
VDS=0V, VGS=±10V
VGS=-10V, ID=-2A
Coss
Max
V
VDS=-16V, VGS=0V
IDSS
IS
Typ
-1
mΩ
S
-0.78
512
V
-1.8
A
620
pF
VGS=0V, VDS=-10V, f=1MHz
77
VGS=0V, VDS=0V, f=1MHz
9.2
13
Ω
5.5
6.6
nC
pF
62
VGS=-4.5V, VDS=-10V, ID=-2A
pF
0.8
nC
Qgd
Gate Drain Charge
1.9
nC
tD(on)
Turn-On DelayTime
5
ns
tr
Turn-On Rise Time
6.7
ns
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=-2A, dI/dt=100A/µs
9.8
Qrr
Body Diode Reverse Recovery Charge IF=-2A, dI/dt=100A/µs
2.7
VGS=-10V, VDS=-10V, RL=5Ω,
RGEN=3Ω
28
ns
13.5
ns
12
ns
nC
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve
provides a single pulse rating.
F. The maximum current rating is limited by bond-wires.
Rev 0 : Mar 2006
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO3423
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
12
10
-10.0V
-4.0V
VDS=-5V
-3.5V
-8.0V
8
-6.0V
6
-ID(A)
-ID (A)
-3.0V
9
-2.5V
6
-2.0V
3
4
125°C
2
25°C
VGS=-1.5V
0
0
0
1
2
3
4
5
0
0.5
180
Normalized On-Resistance
140
RDS(ON) (mΩ)
1.5
2
2.5
3
3.5
1.6
VGS=-2.5V
160
VGS=-4.5V
120
100
80
VGS=-10V
60
40
ID=-2A, VGS=-4.5V
ID=-2A, VGS=-10V
1.4
1.2
ID=-1A, VGS=-2.5V
1.0
0.8
0
2
4
6
8
10
0
25
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1E+01
200
ID=-2A
180
1E+00
125°C
160
1E-01
125°C
140
-IS (A)
RDS(ON) (mΩ)
1
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
120
100
25°C
1E-02
1E-03
1E-04
80
25°C
1E-05
60
1E-06
40
0.0
0
2
4
6
8
10
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO3423
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
800
5
ID=-2A
Capacitance (pF)
-VGS (Volts)
4
3
2
1
Ciss
600
400
200
Coss
Crss
0
0
0
1
2
3
4
5
6
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
15
20
40
TJ(Max)=150°C
TA=25°C
10µs
RDS(ON)
limited
100µs
30
Power (W)
-ID (Amps)
10
-VDS (Volts)
Figure 8: Capacitance Characteristics
10.0
1ms
1.0
10ms
TJ(Max)=150°C
TA=25°C
10s
0.1s
DC
0
0.001
0.1
0.1
1
10
100
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=90°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
-VDS (Volts)
10
20
10
1s
ZθJA Normalized Transient
Thermal Resistance
5
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000