ETC STD3N30L-1

STD3N30L
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR
TYPE
VDSS
R DS(on)
ID
STD3N30L
300 V
< 1.4 Ω
3A
■
■
■
■
■
■
■
TYPICAL RDS(on) = 1.15 Ω
AVALANCHE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
APPLICATION ORIENTED
CHARACTERIZATION
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX "-1")
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX "T4")
APPLICATIONS
■
HIGH SPEED SWITCHING
■
UNINTERRUPTIBLE POWER SUPPLY (UPS)
■
MOTOR CONTROL, AUDIO AMPLIFIERS
■
INDUSTRIAL ACTUATORS
■
DC-DC & DC-AC CONVERTERS FOR
TELECOM, INDUSTRIAL AND CONSUMER
ENVIRONMENT
■
PARTICULARLY SUITABLE FOR
ELECTRONIC FLUORESCENT LAMP
BALLASTS
3
1
3
2
IPAK
TO-251
(Suffix "-1")
1
DPAK
TO-252
(Suffix "T4")
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
V DGR
Parameter
Value
Unit
Drain-source Voltage (V GS = 0)
300
V
Drain- gate Voltage (R GS = 20 kΩ)
300
V
Gate-source Voltage
± 15
V
ID
Drain Current (continuous) at T c = 25 o C
3
A
ID
Drain Current (continuous) at T c = 100 o C
2
A
12
A
V GS
I DM (•)
P tot
T stg
Tj
Drain Current (pulsed)
o
Total Dissipation at T c = 25 C
50
W
Derating Factor
0.4
W/o C
Storage Temperature
Max. Operating Junction Temperature
-65 to 150
o
C
150
o
C
(•) Pulse width limited by safe operating area
November 1996
1/10
STD3N30L
THERMAL DATA
R thj-case
R thj-amb
R t hc-sink
Tl
Thermal Resistance Junction-case
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
o
2.5
100
1.5
275
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
IA R
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max, δ < 1%)
3
A
E AS
Single Pulse Avalanche Energy
(starting T j = 25 o C, I D = I AR , V DD = 50 V)
20
mJ
E AR
Repetitive Avalanche Energy
(pulse width limited by T j max, δ < 1%)
5
mJ
IA R
Avalanche Current, Repetitive or Not-Repetitive
(T c = 100 o C, pulse width limited by T j max, δ < 1%)
2
A
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbol
V(BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Conditions
I D = 250 µA
VGS = 0
I DS S
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating x 0.8
I GSS
Gate-body Leakage
Current (V DS = 0)
Min.
Typ.
Max.
300
Unit
V
T c = 125 o C
V GS = ± 15 V
10
100
µA
µA
± 100
nA
ON (∗)
Symbol
Parameter
Test Conditions
V GS(th)
Gate Threshold Voltage V DS = V GS
I D = 250 µA
R DS(on)
Static Drain-source On
Resistance
I D = 1.5 A
I D(on)
V GS = 5 V
On State Drain Current V DS > I D(on) x R DS(on)max
V GS = 10 V
Min.
Typ.
Max.
Unit
1
1.6
2.5
V
1.15
1.4
Ω
3
A
DYNAMIC
Symbol
gfs (∗)
C iss
C oss
C rss
2/10
Parameter
Test Conditions
Forward
Transconductance
V DS > I D(on) x R DS(on)max
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
ID = 1.5 A
VGS = 0
Min.
Typ.
1.5
3.5
580
75
15
Max.
Unit
S
800
120
25
pF
pF
pF
STD3N30L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
100
210
ns
ns
Turn-on Time
Rise Time
V DD = 150 V I D = 1.5 A
R G = 50 Ω
VGS = 5 V
(see test circuit, figure 3)
70
150
Turn-on Current Slope
V DD = 240 V I D = 3 A
R G = 50 Ω
VGS = 5 V
(see test circuit, figure 5)
115
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 240 V
ID = 3 A
V GS = 5 V
A/µs
16
5
7
22
nC
nC
nC
Typ.
Max.
Unit
50
40
100
70
60
140
ns
ns
ns
Typ.
Max.
Unit
3
12
A
A
1.5
V
SWITCHING OFF
Symbol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
Min.
V DD = 240 V I D = 3 A
R G = 50 Ω VGS = 5 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
IS D
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
VS D (∗)
Forward On Voltage
I SD = 3 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 3 A
di/dt = 100 A/µs
V DD = 200 V
T j = 150 o C
(see test circuit, figure 5)
t rr
Q rr
I RRM
Min.
V GS = 0
300
ns
1.5
µC
10
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/10
STD3N30L
Derating Curve
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
4/10
STD3N30L
Capacitance Variations
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Turn-on Current Slope
Turn-off Drain-source Voltage Slope
Cross-over Time
5/10
STD3N30L
Switching Safe Operating Area
Accidental Overload Area
Source-drain Diode Forward Characteristics
Fig. 1: Unclamped Inductive Load Test Circuits
6/10
Fig. 2: Unclamped Inductive Waveforms
STD3N30L
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge Test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
7/10
STD3N30L
TO-251 (IPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
MAX.
MIN.
A
2.2
TYP.
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A3
0.7
1.3
0.027
0.051
B
0.64
0.9
0.025
0.031
B2
5.2
5.4
0.204
0.212
B3
TYP.
MAX.
0.85
B5
0.033
0.3
0.012
B6
0.95
0.037
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
15.9
16.3
0.626
0.641
L
9
9.4
0.354
0.370
L1
0.8
1.2
0.031
0.047
L2
0.8
1
0.031
0.039
A1
C2
A3
A
C
H
B
B3
=
1
=
2
G
=
=
=
E
B2
=
3
B5
L
D
B6
L2
L1
0068771-E
8/10
STD3N30L
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
9.35
10.1
0.368
0.397
L2
0.8
L4
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL "A"
L2
D
=
1
=
G
2
=
=
=
E
=
B2
3
B
DETAIL "A"
L4
0068772-B
9/10
STD3N30L
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
© 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
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