ETC MURHB840CT/D

MURHB840CT
Preferred Device
MEGAHERTZ
Power Rectifier
D2PAK Power Surface Mount Package
Designed for use in switching power supplies, inverters and as free
wheeling diodes, these state–of–the–art devices have the following
features:
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ULTRAFAST
RECTIFIER
8.0 AMPERES
400 VOLTS
Package Designed for Power Surface Mount Applications
Ultrafast 28 Nanosecond Recovery Times
175°C Operating Junction Temperature
Epoxy Meets UL94, VO @ 1/8″
High Temperature Glass Passivated Junction
High Voltage Capability
Low Leakage Specified @ 150°C Case Temperature
Short Heat Sink Tab Manufactured – Not Sheared!
Similar in Size to Industrial Standard TO–220 Package
1
4
3
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 1.7 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
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•
4
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped 50 units per plastic tube
Available in 24 mm Tape and Reel, 800 units per reel by adding a
“T4” suffix to the part number
Marking: UH840
1
3
D2PAK
CASE 418B
STYLE 3
MARKING DIAGRAM
MAXIMUM RATINGS (Per Leg)
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
400
V
Average Rectified Forward Current
(Rated VR, TC = 120°C) Total Device
IF(AV)
4.0
8.0
A
Peak Repetitive Forward Current
(Rated VR, Square Wave,
20 kHz, TC = 120°C)
IFM
8.0
A
Non–Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM
100
A
Rating
UH840
UH840 = Device Code
ORDERING INFORMATION
Controlled Avalanche Energy
WAVAL
20
mJ
Operating Junction and Storage
Temperature Range
TJ, Tstg
–65 to +175
°C
Device
Package
Shipping
MURHB840CT
D2PAK
50 Units/Rail
MURHB840CTT4
D2PAK
800/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 2
1
Publication Order Number:
MURHB840CT/D
MURHB840CT
THERMAL CHARACTERISTICS (Per Leg)
Rating
Symbol
Value
Unit
Maximum Thermal Resistance, Junction to Case
RθJC
3.0
°C/W
Maximum Thermal Resistance, Junction to Ambient (Note 1.)
RθJA
50
°C/W
Symbol
Max
Unit
Maximum Instantaneous Forward Voltage (Note 2.) (iF = 4.0 Amps, TC = 150°C)
(iF = 4.0 Amps, TC = 25°C)
vF
1.9
Volts
Maximum Instantaneous Reverse Current (Note 2.) (Rated dc Voltage, TC = 150°C)
(Rated dc Voltage, TC = 25°C)
iR
500
10
µA
Maximum Reverse Recovery Time
(IF = 1.0 Amp, di/dt = 50 Amps/µs)
trr
28
ns
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
2.2
1000
500
100
IR, REVERSE CURRENT (A)
µ
50
TJ = 150°C
20
10
100°C
5
25°C
2
1
0.5
0.2
0.1
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
TJ = 150°C
200
100
50
20
10
100°C
5
25°C
2
1
0.5
0.2
0.1
0
50
100
150
200
250
300
350
400
vF, INSTANTANEOUS VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Typical Reverse Current, Per Leg
10
1000
RATED VR APPLIED
RθJC = 3°C/W
8
6
C, CAPACITANCE (pF)
I F, AVERAGE POWER DISSIPATION (WATTS)
i F, INSTANTANEOUS FORWARD CURRENT (AMP)
1. See Chapter 7 for mounting conditions
2. Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%
DC
SQUARE
WAVE
4
100
10
2
0
110
120
130
140
150
160
TC, CASE TEMPERATURE (°C)
170
180
1
0.01
Figure 3. Current Derating, Case
0.1
1
10
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Typical Capacitance, Per Leg
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2
100
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
MURHB840CT
20
18
TJ = 175°C
SQUARE WAVE
16
DC
14
12
10
8
6
4
2
0
1
2
3
4
5
6
7
8
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
9
Figure 5. Forward Power Dissipation, Per Leg
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MURHB840CT
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
interface between the board and the package. With the
total design. The footprint for the semiconductor packages
correct pad geometry, the packages will self align when
must be the correct size to insure proper solder connection
subjected to a solder reflow process.
0.74
18.79
0.065
1.651
0.420
10.66
0.07
1.78
0.14
3.56
0.330
8.38
inches
mm
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the
drain pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient; and the operating
temperature, TA. Using the values provided on the data
sheet for the D2PAK package, PD can be calculated as
follows:
PD =
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 3.0 watts.
PD = 175°C – 25°C = 3.0 watts
50°C/W
The 50°C/W for the D2PAK package assumes the
recommended drain pad area of 158K mil2 on FR–4 glass
epoxy printed circuit board to achieve a power dissipation
of 3.0 watts using the footprint shown. Another alternative
is to use a ceramic substrate or an aluminum core board
such as Thermal Clad. By using an aluminum core board
material such as Thermal Clad, the power dissipation can
be doubled using the same footprint.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
GENERAL SOLDERING PRECAUTIONS
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
* Due to shadowing and the inability to set the wave height
to incorporate other surface mount components, the D2PAK
is not recommended for wave soldering.
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MURHB840CT
RECOMMENDED PROFILE FOR REFLOW SOLDERING
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a
central solder joint. The two profiles are based on a high
density and a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177–189°C.
When this type of furnace is used for solder reflow work,
the circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction.
The circuit board, because it has a large surface area,
absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 6 shows a typical heating profile
for use when soldering the D2PAK to a printed circuit
board. This profile will vary among soldering systems but it
is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This
profile shows temperature versus time. The line on the
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
STEP 5
STEP 6 STEP 7
STEP 4
HEATING
VENT COOLING
HEATING
ZONES 3 & 6 ZONES 4 & 7
205° TO
SPIKE"
SOAK"
219°C
170°C
PEAK AT
SOLDER
160°C
JOINT
150°C
100°C
140°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TMAX
TIME (3 TO 7 MINUTES TOTAL)
Figure 6. Typical Solder Heating Profile for D2PAK
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MURHB840CT
PACKAGE DIMENSIONS
D2PAK
CASE 418B–03
ISSUE D
C
E
V
–B–
4
A
1
2
3
DIM
A
B
C
D
E
G
H
J
K
S
V
S
–T–
SEATING
PLANE
K
J
G
D 3 PL
0.13 (0.005)
H
M
T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
M
INCHES
MIN
MAX
0.340
0.380
0.380
0.405
0.160
0.190
0.020
0.035
0.045
0.055
0.100 BSC
0.080
0.110
0.018
0.025
0.090
0.110
0.575
0.625
0.045
0.055
STYLE 3:
PIN 1.
2.
3.
4.
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ANODE
CATHODE
ANODE
CATHODE
MILLIMETERS
MIN
MAX
8.64
9.65
9.65
10.29
4.06
4.83
0.51
0.89
1.14
1.40
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
14.60
15.88
1.14
1.40
MURHB840CT
Notes
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MURHB840CT
MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC.
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
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Toll Free from Hong Kong & Singapore:
001–800–4422–3781
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4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, UK, Ireland
For additional information, please contact your local
Sales Representative.
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MURHB840CT/D