ONSEMI MGY25N120

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by MGY25N120/D
SEMICONDUCTOR TECHNICAL DATA
 Motorola Preferred Device
N–Channel Enhancement–Mode Silicon Gate
This Insulated Gate Bipolar Transistor (IGBT) uses an advanced
termination scheme to provide an enhanced and reliable high
voltage blocking capability. Short circuit rated IGBT’s are specifically suited for applications requiring a guaranteed short circuit
withstand time. Fast switching characteristics result in efficient
operation at high frequencies.
•
•
•
•
IGBT IN TO–264
25 A @ 90°C
38 A @ 25°C
1200 VOLTS
SHORT CIRCUIT RATED
Industry Standard High Power TO–264 Package (TO–3PBL)
High Speed Eoff: 216 mJ/A typical at 125°C
High Short Circuit Capability – 10 ms minimum
Robust High Voltage Termination
C
G
G
C
E
CASE 340G–02
STYLE 5
TO–264
E
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
VCES
1200
Vdc
Collector–Gate Voltage (RGE = 1.0 MΩ)
VCGR
1200
Vdc
Gate–Emitter Voltage — Continuous
VGE
±20
Vdc
Collector Current — Continuous @ TC = 25°C
— Continuous @ TC = 90°C
— Repetitive Pulsed Current (1)
IC25
IC90
ICM
38
25
76
Adc
PD
212
1.69
Watts
W/°C
TJ, Tstg
– 55 to 150
°C
tsc
10
ms
RθJC
RθJA
0.6
35
°C/W
260
°C
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Operating and Storage Junction Temperature Range
Short Circuit Withstand Time
(VCC = 720 Vdc, VGE = 15 Vdc, TJ = 125°C, RG = 20 Ω)
Thermal Resistance — Junction to Case – IGBT
— Junction to Ambient
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 5 seconds
Mounting Torque, 6–32 or M3 screw
TL
Apk
10 lbfSin (1.13 NSm)
(1) Pulse width is limited by maximum junction temperature. Repetitive rating.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
IGBT
 Motorola
Motorola, Inc.
1997 Device
Data
1
MGY25N120
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
1200
—
—
960
—
—
mV/°C
25
—
—
Vdc
—
—
—
—
100
2500
—
—
250
—
—
—
2.37
2.15
2.98
3.24
—
4.19
4.0
—
6.0
10
8.0
—
mV/°C
gfe
—
12
—
Mhos
pF
OFF CHARACTERISTICS
Collector–to–Emitter Breakdown Voltage
(VGE = 0 Vdc, IC = 25 µAdc)
Temperature Coefficient (Positive)
V(BR)CES
Emitter–to–Collector Breakdown Voltage (VGE = 0 Vdc, IEC = 100 mAdc)
V(BR)ECS
Zero Gate Voltage Collector Current
(VCE = 1200 Vdc, VGE = 0 Vdc)
(VCE = 1200 Vdc, VGE = 0 Vdc, TJ = 125°C)
ICES
Gate–Body Leakage Current (VGE = ± 20 Vdc, VCE = 0 Vdc)
IGES
Vdc
µAdc
nAdc
ON CHARACTERISTICS (1)
Collector–to–Emitter On–State Voltage
(VGE = 15 Vdc, IC = 12.5 Adc)
(VGE = 15 Vdc, IC = 12.5 Adc, TJ = 125°C)
(VGE = 15 Vdc, IC = 25 Adc)
VCE(on)
Gate Threshold Voltage
(VCE = VGE, IC = 1.0 mAdc)
Threshold Temperature Coefficient (Negative)
VGE(th)
Forward Transconductance (VCE = 10 Vdc, IC = 25 Adc)
Vdc
Vdc
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VCE = 25 Vdc,
Vdc VGE = 0 Vdc,
Vdc
f = 1.0 MHz)
Transfer Capacitance
Cies
—
2795
—
Coes
—
181
—
Cres
—
45
—
td(on)
—
91
—
tr
—
124
—
td(off)
—
196
—
tf
—
310
—
Eoff
—
2.44
4.69
mJ
td(on)
—
88
—
ns
tr
—
126
—
td(off)
—
236
—
tf
—
640
—
Eoff
—
5.40
—
mJ
QT
—
97
—
nC
Q1
—
31
—
Q2
—
40
—
—
13
—
SWITCHING CHARACTERISTICS (1)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
(VCC = 720 Vdc,
Vd IC = 25 Ad
Adc,
VGE = 15 Vdc,
Vd L = 300 mH
RG = 20 Ω)
Energy losses include “tail”
Turn–Off Switching Loss
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
(VCC = 720 Vdc,
Vd IC = 25 Ad
Adc,
Vd L = 300 mH
VGE = 15 Vdc,
RG = 20 Ω, TJ = 125°C)
125 C)
Energy losses include “tail”
Turn–Off Switching Loss
Gate Charge
(VCC = 720 Vdc,
Vdc IC = 25 Adc
Adc,
VGE = 15 Vdc)
ns
INTERNAL PACKAGE INDUCTANCE
Internal Emitter Inductance
(Measured from the emitter lead 0.25″ from package to emitter bond pad)
LE
nH
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2
Motorola IGBT Device Data
MGY25N120
TYPICAL ELECTRICAL CHARACTERISTICS
75
75
VGE = 20 V
15 V
60
45
12.5 V
30
10 V
15
0
0
2
1
4
3
6
5
7
15 V
45
12.5 V
30
10 V
15
0
8
0
50
40
30
20
25°C
10
6
8
12
10
14
16
VCE , COLLECTOR–TO–EMITTER VOLTAGE (VOLTS)
IC, COLLECTOR CURRENT (AMPS)
VCE = 10 V
250 µs PULSE WIDTH
4
IC = 20 A
3
15 A
10 A
2
1
– 50
0
C, CAPACITANCE (pF)
VGE, GATE–TO–EMITTER VOLTAGE (VOLTS)
TJ = 25°C
VGE = 0 V
Coes
Cres
5
10
15
20
VCE, COLLECTOR–TO–EMITTER VOLTAGE (VOLTS)
Figure 5. Capacitance Variation
Motorola IGBT Device Data
100
150
Figure 4. Collector–to–Emitter Saturation
Voltage versus Junction Temperature
1000
0
50
TJ, JUNCTION TEMPERATURE (°C)
10000
10
8
7
VGE = 15 V
250 µs PULSE WIDTH
Figure 3. Transfer Characteristics
100
6
5
4
VGE, GATE–TO–EMITTER VOLTAGE (VOLTS)
Cies
4
3
Figure 2. Output Characteristics
70
0
2
1
VCE, COLLECTOR–TO–EMITTER VOLTAGE (VOLTS)
Figure 1. Output Characteristics
TJ = 125°C
17.5 V
60
VCE, COLLECTOR–TO–EMITTER VOLTAGE (VOLTS)
60
VGE = 20 V
TJ = 125°C
17.5 V
IC, COLLECTOR CURRENT (AMPS)
IC, COLLECTOR CURRENT (AMPS)
TJ = 25°C
25
16
QT
14
12
10
Q1
Q2
8
6
TJ = 25°C
IC = 25 A
4
2
0
0
10
20
30
40
50
60
70
Qg, TOTAL GATE CHARGE (nC)
Figure 6. Gate–to–Emitter Voltage versus
Total Charge
3
MGY25N120
7
IC = 25 A
Eoff , TURN–OFF ENERGY LOSSES (mJ)
Eoff , TURN–OFF ENERGY LOSSES (mJ)
6
5.5
VCC = 720 V
VGE = 15 V
TJ = 125°C
IC = 25 A
5
4.5
4
15 A
3.5
3
10 A
2.5
2
10
20
30
40
VCC = 720 V
VGE = 15 V
RG = 20 Ω
6
5
IC = 25 A
4
15 A
3
2
10 A
1
0
50
25
75
50
100
125
RG, GATE RESISTANCE (OHMS)
TC, CASE TEMPERATURE (°C)
Figure 7. Turn–Off Losses versus
Gate Resistance
Figure 8. Turn–Off Losses versus
Case Temperature
150
IC , COLLECTOR CURRENT (AMPS)
100
10
1
VGE = 15 V
RGE = 20 Ω
TJ = 125°C
0.1
1
10
100
1000
10,000
VCE, COLLECTOR–TO–EMITTER VOLTAGE (VOLTS)
Figure 9. Reverse Biased
Safe Operating Area
1.0
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
D = 0.5
0.2
0.1
0.1
0.05
P(pk)
0.02
0.01
t1
SINGLE PULSE
t2
DUTY CYCLE, D = t1/t2
0.01
1.0E–05
1.0E–04
1.0E–03
1.0E–02
1.0E–01
RθJC(t) = r(t) RθJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) – TC = P(pk) RθJC(t)
1.0E+00
1.0E+01
t, TIME (s)
Figure 10. Thermal Response
4
Motorola IGBT Device Data
MGY25N120
PACKAGE DIMENSIONS
0.25 (0.010)
M
T B
M
–Q–
–B–
–T–
C
E
U
N
A
1
R
2
L
3
–Y–
P
K
W
F 2 PL
G
J
H
D 3 PL
0.25 (0.010)
M
Y Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
DIM
A
B
C
D
E
F
G
H
J
K
L
N
P
Q
R
U
W
MILLIMETERS
MIN
MAX
2.8
2.9
19.3
20.3
4.7
5.3
0.93
1.48
1.9
2.1
2.2
2.4
5.45 BSC
2.6
3.0
0.43
0.78
17.6
18.8
11.0
11.4
3.95
4.75
2.2
2.6
3.1
3.5
2.15
2.35
6.1
6.5
2.8
3.2
INCHES
MIN
MAX
1.102
1.142
0.760
0.800
0.185
0.209
0.037
0.058
0.075
0.083
0.087
0.102
0.215 BSC
0.102
0.118
0.017
0.031
0.693
0.740
0.433
0.449
0.156
0.187
0.087
0.102
0.122
0.137
0.085
0.093
0.240
0.256
0.110
0.125
S
STYLE 5:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
CASE 340G–02
TO–264
ISSUE F
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
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Motorola IGBT Device Data
◊
MGY25N120/D
5