DIODES DMG4406LSS

DMG4406LSS
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
NEW PRODUCT
ADVANCE INFORMATION
V(BR)DSS
Features and Benefits
RDS(ON) max
ID max
TA = 25°C
11mΩ @ VGS = 10V
10.3A
15mΩ @ VGS = 4.5V
9.3A
30V
Description and Applications
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100% Unclamped Inductive Switch (UIS) test in production
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Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device, Halogan and Antimony Free (Note 2)
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
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Backlighting
Power Management Functions
DC-DC Converters
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Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
SO-8
S
D
S
D
S
D
G
D
Top View
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number
DMG4406LSS-13
Notes:
Case
SO-8
Packaging
2500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Top View
8
5
Logo
G4406LS
Part no.
YY WW
Xth week: 01 ~ 53
Year: “11” = 2011
1
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
4
1 of 6
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February 2012
© Diodes Incorporated
DMG4406LSS
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
NEW PRODUCT
ADVANCE INFORMATION
Continuous Drain Current (Note 5) VGS = 10V
Steady
State
t<10s
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
t<10s
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
ID
Value
30
±20
10.3
8.3
ID
13.4
10.6
A
ID
9.3
7.3
A
A
12.0
9.5
2.5
90
22
24
A
A
A
mJ
Value
1.5
80
48
2.0
61
37
6.4
-55 to 150
Units
W
°C/W
°C/W
W
°C/W
°C/W
°C/W
°C
ID
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Avalanche Current (Note 6) L = 0.1mH
Repetitive Avalanche Energy (Note 6) L = 0.1mH
Units
V
V
IS
IDM
IAR
EAR
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
PD
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient (Note 4)
Steady State
t<10s
RθJA
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
PD
Steady State
t<10s
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
RθJA
RθJC
TJ, TSTG
Electrical Characteristics TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
-
-
1
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS (ON)
|Yfs|
VSD
8
12
32
0.70
2.0
11
15
1.0
V
Static Drain-Source On-Resistance
1.4
-
VDS = VGS, ID = 250μA
VGS = 10V, ID = 12A
VGS = 4.5V, ID = 10A
VDS = 5V, ID = 12A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
-
1281
145
125
1.2
12.5
26.7
3.6
4.4
5.2
21.2
22.3
5.1
8.5
7.0
-
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
mΩ
S
V
Test Condition
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 15V, ID = 12A
ns
VDD = 15V, VGS = 10V,
RL = 1.25Ω, RG = 3Ω,
ns
nC
IF=12A, di/dt=500A/us
4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = 25°C
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
2 of 6
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February 2012
© Diodes Incorporated
DMG4406LSS
30
30
VGS = 10V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25
VGS = 4.5V
VGS = 4.0V
20
VGS = 3.5V
VGS = 3.0V
15
10
5
VDS = 5.0V
20
15
10
TA = 150°C
TA = 125°C
5
TA = 85°C
VGS = 2.5V
TA = 25°C
0
0.5
1.0
1.5
VDS, DRAIN -SOURCE VOLTAGE(V)
Fig. 1 Typical Output Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE(Ω)
0.04
0.03
0.02
0.01
0
0
2.0
0
5
10
15
20
25
ID, DRAIN SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
30
1
2
3
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
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4
0.04
VGS = 4.5V
0.03
TA = 125°C
0.02
T A = 150°C
TA = 85° C
T A = 25°C
0.01
T A = -55°C
0
0
5
10
15
20
25
ID, DRAIN SOURCE CURRENT (A)
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON),DRAIN-SOURCE ON-RESISTANCE(Ω)
TA = -55°C
0
0
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
ADVANCE INFORMATION
25
30
VGS = 4.5V
ID = 5A
VGS = 10V
ID = 10A
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
February 2012
© Diodes Incorporated
DMG4406LSS
VGS(TH), GATE THRESHOLD VOLTAGE(V)
IS, SOURCE CURRENT (A)
25
15
10
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
1,800
0.2
0.4
0.6
0.8
1.0
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
1.2
IDSS, LEAKAGE CURRENT (nA)
f = 1MHz
1,600
1,400
1,200
C iss
1,000
800
600
400
TA = 150°C
1,000
TA = 125°C
100
TA = 85°C
10
Coss
200
0
0
10,000
2,000
CT, JUNCTION CAPACITANCE (pF)
20
5
TA = 25°C
Crss
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Junction Capacitance
1
10
20
30
VDS, DRAIN-SOURCE VOLTAGE(V)
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
30
10
0
1,000
9
f = 1MHz
8
100
ID, DRAIN CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
NEW PRODUCT
ADVANCE INFORMATION
30
7
6
5
4
3
RDS(on)
Limited
10
DC
PW = 10s
1
PW = 100ms
PW = 10ms
PW = 1ms
0.1
2
PW = 1s
PW = 100µs
PW = 10µs
1
0
0
5
10
15
20
25
Qg, TOTAL GATE CHARGE (nC)
Fig. 11 Gate-Charge Characteristics
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
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0.01
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 SOA, Safe Operation Area
100
February 2012
© Diodes Incorporated
DMG4406LSS
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.7
D = 0.5
D = 0.3
D = 0.9
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t) = r(t) * RθJA
RθJA = 60°C/W
Duty Cycle, D = t1/ t2
D = 0.005
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
10
100
1,000
Package Outline Dimensions
0.254
NEW PRODUCT
ADVANCE INFORMATION
1
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
Suggested Pad Layout
X
C1
C2
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
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February 2012
© Diodes Incorporated
DMG4406LSS
IMPORTANT NOTICE
NEW PRODUCT
ADVANCE INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
DMG4406LSS
Document number: DS35539 Rev. 7 - 2
6 of 6
www.diodes.com
February 2012
© Diodes Incorporated