AP95T07GP
RoHS-compliant Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
▼ Lower On-resistance
▼ Fast Switching Characteristic
BVDSS
75V
RDS(ON)
5mΩ
ID
G
80A
S
Description
Advanced Power MOSFETs from APEC provide the designer with
the best combination of fast switching, ruggedized device design,
low on-resistance and cost-effectiveness.
G
D
TO-220(P)
S
The TO-220 package is widely preferred for commercial-industrial
power applications and suited for low voltage applications such as
DC/DC converters.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
3
Rating
Units
75
V
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V
80
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V
70
A
320
A
300
W
2
W/℃
450
mJ
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
Linear Derating Factor
4
EAS
Single Pulse Avalanche Energy
TSTG
Storage Temperature Range
-55 to 175
℃
TJ
Operating Junction Temperature Range
-55 to 175
℃
Thermal Data
Symbol
Parameter
Rthj-c
Maximum Thermal Resistance, Junction-case
Rthj-a
Maixmum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
Value
Units
0.5
℃/W
62
℃/W
1
201120071
AP95T07GP
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
75
-
-
V
-
0.01
-
V/℃
VGS=10V, ID=60A
-
-
5
mΩ
VDS=VGS, ID=250uA
2
-
4
V
VDS=10V, ID=60A
-
57
-
S
VDS=75V, VGS=0V
-
-
10
uA
Drain-Source Leakage Current (T j=150 C)
VDS=60V ,VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS= ±20V
-
-
±100
nA
ID=80A
-
85
135
nC
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
o
IDSS
Drain-Source Leakage Current (T j=25 C)
o
IGSS
2
VGS=0V, ID=1mA
2
Max. Units
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=40V
-
25
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
36
-
nC
VDS=40V
-
22
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=80A
-
160
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
38
-
ns
tf
Fall Time
RD=0.5Ω
-
165
-
ns
Ciss
Input Capacitance
VGS=0V
-
4290 6870
pF
Coss
Output Capacitance
VDS=25V
-
985
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
390
-
pF
Rg
Gate Resistance
f=1.0MHz
-
1.2
1.8
Ω
Min.
Typ.
IS=60A, VGS=0V
-
-
1.3
V
IS=40A, VGS=0V
-
75
-
ns
dI/dt=100A/µs
-
190
-
nC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Package limitation current is 80A, calculated continuous current
based on maximum allowable junction temperature is 169A.
4.Starting Tj=25oC , L=1mH , IAS=30A.
THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION.
THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT
DEVICE OR SYSTEM ARE NOT AUTHORIZED.
2
AP95T07GP
250
120
10 V
9.0 V
8.0 V
7.0 V
ID , Drain Current (A)
200
10V
9.0V
8.0V
7.0V
V G = 6.0 V
T C = 1 75 o C
100
ID , Drain Current (A)
o
T C = 25 C
150
100
V G = 6.0 V
80
60
40
50
20
0
0
0
1
2
3
0
4
1
2
3
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
12
2.4
I D =60A
V G =10V
I D =30A
o
T C =25 C
2.0
Normalized RDS(ON)
RDS(ON) (mΩ)
10
8
1.6
1.2
6
0.8
4
0.4
4
5
6
7
8
9
10
-50
0
50
100
150
200
T j , Junction Temperature ( o C)
V GS Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
60
1.4
50
1.2
T j =175 C
40
IS(A)
o
Normalized VGS(th) (V)
o
T j =25 C
30
20
1
0.8
0.6
10
0
0.4
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
200
T j ,Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP95T07GP
f=1.0MHz
10000
I D = 80 A
12
C iss
V DS = 40 V
V DS = 48 V
V DS = 64 V
10
8
C (pF)
VGS , Gate to Source Voltage (V)
14
6
1000
C oss
C rss
4
2
0
100
0
20
40
60
80
100
120
1
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS ,Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
Normalized Thermal Response (Rthjc)
1
100us
ID (A)
100
1ms
10ms
10
100ms
DC
o
T c =25 C
Single Pulse
1
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
0.02
t
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.1
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-220
E1
A
E
Millimeters
SYMBOLS
φ
L2
L5
c1
D
L4
b1
L3
MIN
NOM
MAX
A
4.25
4.48
4.70
b
b1
c
c1
0.65
0.80
0.90
1.15
1.38
1.60
0.40
0.50
0.60
1.00
1.20
1.40
E
9.70
10.00
10.40
E1
---
---
11.50
e
----
2.54
----
L
12.70
13.60
14.50
L1
2.60
2.80
3.00
L2
1.00
1.40
1.80
L3
2.6
3.10
3.6
L4
14.70
15.50
16
L1
L
c
b
L5
6.30
6.50
6.70
φ
3.50
3.60
3.70
D
8.40
8.90
9.40
1.All Dimensions Are in Millimeters.
2.Dimension Does Not Include Mold Protrusions.
e
Part Marking Information & Packing : TO-220
Part Number
meet Rohs requirement
Package Code
95T07GP
LOGO
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
5