VISHAY SI7705DN

Si7705DN
New Product
Vishay Siliconix
Single P-Channel 20-V (D-S) MOSFET With Schottky Diode
FEATURES
MOSFET PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
-20
D TrenchFETr Power MOSFETS: 1.8-V Rated
D Ultra-Low Thermal Resistance, PowerPAKt
Package with Low 1.07-mm Profile
ID (A)
0.048 @ VGS = -4.5 V
- 6.3
0.068 @ VGS = -2.5 V
- 5.3
APPLICATIONS
0.090 @ VGS = -1.8 V
- 4.6
D Charger Switching
SCHOTTKY PRODUCT SUMMARY
VKA (V)
Vf (V)
Diode Forward Voltage
IF (A)
20
0.48 V @ 0.5 A
1.0
PowerPAKt 1212-8
A
3.30 mm
S
K
D
A
3.30 mm
1
A
2
G
S
3
G
4
K
8
K
7
D
6
D
5
Bottom View
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 sec
Steady State
Drain-Source Voltage (MOSFET and Schottky)
VDS
-20
Reverse Voltage (Schottky)
VKA
20
Gate-Source Voltage (MOSFET)
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ (MOSFET)a
TA = 25_C
TA = 85_C
Pulsed Drain Current (MOSFET)
IS
Average Foward Current (Schottky)
Maximum Power Dissipation (Schottky)a
Operating Junction and Storage Temperature Range
-4.5
-3.1
-20
-2.3
IF
Pulsed Foward Current (Schottky)
V
-4.3
- 6.3
IDM
Continuous Source Current (MOSFET Diode Conduction)a
Maximum Power Dissipation (MOSFET)a
ID
A
-1.1
1.0
IFM
7
TA = 25_C
2.8
1.3
TA = 85_C
1.5
0.7
2.0
1.1
TA = 25_C
PD
TA = 85_C
1.0
TJ, Tstg
Unit
W
0.6
-55 to 150
_C
Notes
a. Surface Mounted on 1” x1” FR4 Board.
Document Number: 71607
S-22520—Rev. B, 27-Jan-03
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Si7705DN
New Product
Vishay Siliconix
THERMAL RESISTANCE RATINGS
Parameter
Device
t v 10 sec
Junction-to-Ambienta
Symbol
Typical
Maximum
MOSFET
35
44
Schottky
51
64
75
94
91
115
4
5
10
12
MOSFET
Steady State
RthJA
Schottky
MOSFET
Junction-to-Case (Drain)
Steady State
Schottky
RthJC
Unit
_
_C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS = VGS, ID = -250 mA
-0.45
Typ
Max
Unit
"100
nA
Static
Gate Threshold Voltage
VGS(th)
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
rDS(on)
V
VDS = 0 V, VGS = "8 V
VDS = -16 V, VGS = 0 V
-1
VDS = -16 V, VGS = 0 V, TJ = 85_C
-5
VDS v -5 V, VGS = -4.5 V
-20
m
mA
A
VGS = -4.5 V, ID = -6.3 A
0.040
0.048
VGS = -2.5 V, ID = -5.3 A
0.054
0.068
VGS = -1.8 V, ID = -1 A
0.070
0.090
gfs
VDS = -10 V, ID = -6.3 A
14
VSD
IS = -2.3 A, VGS = 0 V
-0.8
-1.2
11
17
VDS = -10 V, VGS = -4.5 V, ID = -6.3 A
2.7
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
1.9
Turn-On Delay Time
td(on)
70
105
tr
75
110
20
30
45
70
Typ
Max
Rise Time
Turn-Off Delay Time
Fall Time
td(off)
VDD = -10 V, RL = 10 W
ID ^ -1 A, VGEN = -4.5 V, RG = 6 W
tf
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
SCHOTTKY SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Forward Voltage Drop
VF
Maximum Reverse Leakage Current
Irm
Junction Capacitance
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2
CT
Test Condition
Min
IF = 0.5 A
0.42
0.48
IF = 0.5 A, TJ = 125_C
0.33
0.4
0.100
Vr = 20 V
0.002
Vr = 20 V, TJ = 85_C
0.10
1
Vr = 20 V, TJ = 125_C
1.5
10
Vr = 10 V
31
Unit
V
mA
pF
Document Number: 71607
S-22520—Rev. B, 27-Jan-03
Si7705DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Output Characteristics
Transfer Characteristics
20
20
TC = -55_C
VGS = 5 thru 2.5 V
25_C
16
I D - Drain Current (A)
I D - Drain Current (A)
16
2V
12
8
1.5 V
4
125_C
12
8
4
1, 0.5 V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.0
4.0
0.5
VDS - Drain-to-Source Voltage (V)
1.0
0.16
1600
0.12
VGS = 2.5 V
VGS = 4.5 V
0.00
0
8
12
16
Ciss
800
400
4
20
Coss
Crss
0
4
ID - Drain Current (A)
8
12
16
20
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
8
1.5
VDS = 10 V
ID = 6.3 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
3.0
1200
0.04
0
2.5
Capacitance
2000
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
VGS = 1.8 V
2.0
VGS - Gate-to-Source Voltage (V)
0.20
0.08
1.5
6
4
2
0
0
3
6
9
12
15
Qg - Total Gate Charge (nC)
Document Number: 71607
S-22520—Rev. B, 27-Jan-03
18
21
VGS = 4.5 V
ID = 6.3 A
1.3
1.1
0.9
0.7
-50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si7705DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
100
10
TJ = 150_C
TJ = 25_C
1
0.1
0.16
0.12
ID = 6.3 A
0.08
0.04
0.00
0.01
0
0.2
0.4
0.6
0.8
1.0
0
1.2
VSD - Source-to-Drain Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.4
50
ID = 935 mA
0.3
40
0.2
Power (W)
V GS(th) Variance (V)
1
0.1
30
20
0.0
10
-0.1
-0.2
-50
-25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
1
10
100
600
Time (sec)
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 75_C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
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4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71607
S-22520—Rev. B, 27-Jan-03
Si7705DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
MOSFET
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
Square Wave Pulse Duration (sec)
10- 1
1
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
SCHOTTKY
Reverse Current vs. Junction Temperature
Forward Voltage Drop
5
1
I F - Forward Current (A)
I R - Reverse Current (mA)
20
10
0.1
20 V
0.01
10 V
TJ = 150_C
1
TJ = 25_C
0.001
0.0001
0.1
0
25
50
75
100
125
150
0
TJ - Junction Temperature (_C)
0.4
0.6
0.8
1.0
VF - Forward Voltage Drop (V)
Capacitance
150
CT - Junction Capacitance (pF)
0.2
120
90
60
30
0
0
4
8
12
16
20
VKA - Reverse Voltage (V
Document Number: 71607
S-22520—Rev. B, 27-Jan-03
www.vishay.com
5
Si7705DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
SCHOTTKY
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 115_C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
10
100
600
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
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10- 3
10- 2
Square Wave Pulse Duration (sec)
10- 1
1
Document Number: 71607
S-22520—Rev. B, 27-Jan-03