MAXIM MAX9393ETJ

19-2913; Rev 0; 8/03
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
Also see the MAX9390/MAX9391 for the crossflow version.
Ordering Information
TEMP RANGE
PIN-PACKAGE
MAX9392EHJ
PART
-40°C to +85°C
32 TQFP
MAX9392ETJ*
-40°C to +85°C
32 Thin QFN
MAX9393EHJ
-40°C to +85°C
32 TQFP
MAX9393ETJ*
-40°C to +85°C
32 Thin QFN
*Future product—contact factory for availability.
Pin Configurations
INA1
VCC
ASEL0
INA0
INA0
GND
TOP VIEW
INA1
LVDS inputs and outputs are compatible with the
TIA/EIA-644 LVDS standard. The LVDS outputs drive
100Ω loads. The MAX9392/MAX9393 are offered in
5mm x 5mm thin QFN with exposed paddle and 32-pin
TQFP packages and operate over the extended temperature range (-40°C to +85°C).
♦ +3.0V to +3.6V Supply Voltage Range
♦ LVCMOS/LVTTL Logic Inputs Control Signal
Routing
ASEL1
Ultra-low 98ps(P-P) (max) pseudorandom bit sequence
(PRBS) jitter ensures reliable communications in highspeed links that are highly sensitive to timing error,
especially those incorporating clock-and-data recovery,
or serializers and deserializers. The high-speed switching performance guarantees 1.5GHz operation and less
than 67ps (max) skew between channels.
Features
♦ 1.5GHz Operation with 250mV Differential Output
Swing
♦ 2psRMS (max) Random Jitter
♦ AC Specifications Guaranteed for 150mV
Differential Input
♦ Signal Inputs Accept Any Differential Signaling
Standard
♦ LVDS Outputs for Clock or High-Speed Data
♦ High-Level Input Fail-Safe Detection (MAX9392)
♦ Low-Level Input Fail-Safe Detection (MAX9393)
32
31
30
29
28
27
26
25
GND 1
24 VCC
INB0 2
23 OUTA0
INB0 3
22 OUTA0
21 ENA0
BSEL0 4
Applications
High-Speed Telecom/Datacom Equipment
Central-Office Backplane Clock Distribution
MAX9392
MAX9393
VCC 5
20 GND
INB1 6
19 OUTA1
INB1 7
18 OUTA1
BSEL1 8
17 ENA1
12
13
14
15
16
GND
OUTB0
OUTB0
VCC
11
ENB0
10
OUTB1
Fault-Tolerant Systems
9
OUTB1
Protection Switching
ENB1
DSLAM
TQFP
Functional Diagram and Typical Operating Circuit appear at
end of data sheet.
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX9392/MAX9393
General Description
The MAX9392/MAX9393 dual 2 x 2 crosspoint switches
perform high-speed, low-power, and low-noise signal
distribution. The MAX9392/MAX9393 multiplex one of two
differential input pairs to either or both low-voltage differential signaling (LVDS) outputs for each channel.
Independent enable inputs turn on or turn off each differential output pair.
Four LVCMOS/LVTTL logic inputs (two per channel) control the internal connections between inputs and outputs.
This flexibility allows for the following configurations: 2 x 2
crosspoint switch, 2:1 mux, 1:2 splitter, or dual repeater.
This makes the MAX9392/MAX9393 ideal for protection
switching in fault-tolerant systems, loopback switching for
diagnostics, fanout buffering for clock/data distribution,
and signal regeneration.
Fail-safe circuitry forces the outputs to a differential low
condition for undriven inputs or when the commonmode voltage exceeds the specified range. The
MAX9392 provides high-level input fail-safe detection
for LVDS, HSTL, and other GND-referenced differential
inputs. The MAX9393 provides low-level input fail-safe
detection for LVPECL, CML, and other VCC-referenced
differential inputs.
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +4.1V
IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _,
_SEL_ to GND..........................................-0.3V to (VCC + 0.3V)
IN_ _ to IN_ _ ..........................................................................±3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (TA = +70°C)
32-Pin TQFP (derate 13.1mW/°C
above +70°C).............................................................1047mW
32-Pin 5mm x 5mm Thin QFN (derate 21.3mW/°C
above +70°C).............................................................1702mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin TQFP............................................................+76.4°C/W
32-Pin 5mm x 5mm Thin QFN....................................+47°C/W
Junction-to-Case Thermal Resistance
32-Pin 5mm x 5mm Thin QFN......................................+2°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, RL = 100Ω ±1%, EN_ _ = VCC, VCM = 0.05V to (VCC - 0.6V) (MAX9392), VCM = 0.6V to (VCC - 0.05V)
(MAX9393), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, TA = +25°C,
unless otherwise noted.) (Notes 1, 2, and 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2.0
VCC
V
LVCMOS/LVTTL INPUTS (EN_ _, _SEL_)
Input High Voltage
VIH
Input Low Voltage
VIL
0
0.8
V
Input High Current
IIH
VIN = +2.0V to VCC
0
20
µA
Input Low Current
IIL
VIN = 0 to +0.8V
0
10
µA
VID
VILD > 0 and VIHD < VCC, Figure 1
0.1
3.0
V
MAX9392
0.05
VCC - 0.6
MAX9393
0.6
VCC - 0.05
DIFFERENTIAL INPUTS (IN_ _, IN_ _)
Differential Input Voltage
Input Common-Mode Range
VCM
Input Current
IIN_ _,
IIN_ _
MAX9392
|VID| < 3.0V
-50
+10
MAX9393
|VID| < 3.0V
-10
+90
VOD
RL = 100Ω, Figure 2
V
µA
LVDS OUTPUTS (OUT_ _, OU T _ _)
Differential Output Voltage
Change in Magnitude of VOD
Between Complementary Output
States
Offset Common-Mode Voltage
Change in Magnitude of VOS
Between Complementary Output
States
2
∆VOD
Figure 2
VOS
Figure 2
∆VOS
Figure 2
250
1.125
350
450
mV
1.0
50
mV
1.25
1.375
V
1.0
50
mV
_______________________________________________________________________________________
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
(VCC = +3.0V to +3.6V, RL = 100Ω ±1%, EN_ _ = VCC, VCM = 0.05V to (VCC - 0.6V) (MAX9392), VCM = 0.6V to (VCC - 0.05V)
(MAX9393), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, TA = +25°C,
unless otherwise noted.) (Notes 1, 2, and 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
VOUT_ _ or V OUT_ _ = 0
30
40
VOUT_ _ = V OUT_ _ = 0
18
24
UNITS
Output Short-Circuit Current
(Either Output Shorted to GND)
|IOS|
VID = ±100mV
(Note 4)
Output Short-Circuit Current
(Outputs Shorted Together)
|IOSB|
VID = ±100mV, VOUT_ _ = V OUT_ _
(Note 4)
5.0
12
mA
RL = 100Ω, EN_ _ = VCC
68
98
mA
mA
SUPPLY CURRENT
Supply Current
ICC
AC ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, fIN < 1.34GHz, tR_IN = tF_IN = 125ps, RL = 100Ω ±1%, |VID| > 150mV, VCM = +0.075V to (VCC - 0.6V)
(MAX9392 only), VCM = +0.6V to (VCC - 0.075V) (MAX9393 only), EN_ _ = VCC, TA = -40°C to +85°C, unless otherwise noted. Typical
values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, fIN = 1.34GHz, TA = +25°C, unless otherwise noted.) (Note 5)
MAX
UNITS
_SEL_ to Switched Output
PARAMETER
SYMBOL
tSWITCH
Figure 3
CONDITIONS
MIN
TYP
1.1
ns
Disable Time to Differential
Output Low
tPHD
Figure 4
1.7
ns
Enable Time to Differential
Output High
tPDH
Figure 4
1.7
ns
Switching Frequency
fMAX
VOD > 250mV
1.5
2.2
Low-to-High Propagation Delay
tPLH
Figures 1, 5
294
410
574
ps
High-to-Low Propagation Delay
tPHL
Figures 1, 5
286
402
555
ps
GHz
Pulse Skew |tPLH - tPHL|
tSKEW
Figures 1, 5 (Note 6)
17
104
ps
Output-to-Output Skew
tCCS
Figures 5, 6 (Note 7)
4
67
ps
Output Low-to-High Transition
Time (20% to 80%)
tR
Figures 1, 5; fIN = 100MHz
112
142
185
ps
Output High-to-Low Transition
Time (80% to 20%)
tF
Figures 1, 5; fIN = 100MHz
112
145
185
ps
Added Random Jitter
tRJ
fIN_ _ = 1.34GHz, clock pattern (Note 8)
2
psRMS
Added Deterministic Jitter
tDJ
1.34Gbps, 223 - 1 PRBS (Note 8)
60
98
psP-P
Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except VID, VOD, and ∆VOD.
Current into the device defined as positive. Current out of the device defined as negative.
DC parameters tested at TA = +25°C and guaranteed by design and characterization for TA = -40°C to +85°C.
Current through either output.
Guaranteed by design and characterization. Limits set at ±6 sigma.
tSKEW is the magnitude difference of differential propagation delays for the same output over same conditions. tSKEW =
|tPHL - tPLH|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition, under the same
conditions.
Note 8: Device jitter added to the differential input signal.
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
_______________________________________________________________________________________
3
MAX9392/MAX9393
DC ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, fIN = 1.34GHz, TA = +25°C, unless otherwise noted.)
65
60
VCC = +3.0V
55
300
250
200
150
-15
10
35
85
60
120
-40
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
-15
10
35
60
TEMPERATURE (°C)
PROPAGATION DELAY
vs. TEMPERATURE
MAX9392
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9393
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
400
390
380
370
360
350
-15
10
35
60
85
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
VIN = 0.1V
-15
10
35
85
60
MAX9392 toc06
40
30
20
VIN = 0.3V
-40
-15
35
60
MAX9393
INPUT CURRENT vs. VILD
80
MAX9392 toc07
IN_ _ OR IN_ _ = GND
10
TEMPERATURE (°C)
70
IN_ _ OR IN_ _ = VCC
60
VCC = +3V
VCC = +3.6V
-30
-35
-40
INPUT CURRENT (µA)
-15
-20
-25
VIN = 3.2V
TEMPERATURE (°C)
10
85
0
-40
MAX9392
INPUT CURRENT vs. VIHD
-10
50
10
TEMPERATURE (°C)
5
0
-5
60
MAX9392 toc08
410
VIN = 3.0V
INPUT CURRENT (µA)
INPUT CURRENT (µA)
420
70
MAX9392 toc05
10
5
0
MAX9392 toc04
430
INPUT CURRENT (µA)
tR
FREQUENCY (GHz)
440
50
40
VCC = +3V
VCC = +3.6V
30
20
10
0
-45
-50
4
tF
140
TEMPERATURE (°C)
450
-40
150
130
0
-40
160
100
50
50
fIN = 100MHz
170
RISE/FALL TIME (ps)
VCC = +3.6V
180
MAX9392 toc02
350
OUTPUT AMPLITUDE (mV)
SUPPLY CURRENT (mA)
VCC = +3.3V
70
400
MAX9392 toc01
80
75
OUTPUT RISE AND FALL TIMES
vs. TEMPERATURE
OUTPUT AMPLITUDE vs. FREQUENCY
MAX9392 toc03
SUPPLY CURRENT
vs. TEMPERATURE
PROPAGATION DELAY (ps)
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
-10
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6
VIHD (V)
VILD (V)
_______________________________________________________________________________________
85
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
PIN
NAME
FUNCTION
1, 12,
20, 25
GND
Ground
2
INB0
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
3
INB0
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to VCC pulls the
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
4
BSEL0
Input Select for B0 Output. Selects the differential input to reproduce at the B0 differential outputs. Connect
BSEL0 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL0 to VCC to select the INB1
(INB1) set of inputs. An internal 435kΩ resistor pulls BSEL0 low when unconnected.
5, 16,
24, 29
VCC
Power-Supply Input. Bypass each VCC to GND with 0.1µF and 0.01µF ceramic capacitors. Install both bypass
capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device.
6
INB1
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
7
INB1
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to VCC pulls the
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
8
BSEL1
Input Select for B1 Output. Selects the differential input to reproduce at the B1 differential outputs. Connect
BSEL1 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL1 to VCC to select the INB1
(INB1) set of inputs. An internal 435kΩ resistor pulls BSEL1 low when unconnected.
9
ENB1
B1 Output Enable. Drive ENB1 high to enable the B1 LVDS outputs. An internal 435kΩ resistor pulls ENB1 low
when unconnected.
10
OUTB1
B1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver
inputs to ensure proper operation.
11
OUTB1
B1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB1 and OUTB1 at the receiver
inputs to ensure proper operation.
13
ENB0
14
OUTB0
B0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver
inputs to ensure proper operation.
15
OUTB0
B0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB0 and OUTB0 at the receiver
inputs to ensure proper operation.
B0 Output Enable. Drive ENB0 high to enable the B0 LVDS outputs. An internal 435kΩ resistor pulls ENB0 low
when unconnected.
_______________________________________________________________________________________
5
MAX9392/MAX9393
Pin Description
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
MAX9392/MAX9393
Pin Description (continued)
6
PIN
NAME
FUNCTION
17
ENA1
18
OUTA1
A1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver
inputs to ensure proper operation.
19
OUTA1
A1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver
inputs to ensure proper operation.
21
ENA0
22
OUTA0
A0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver
inputs to ensure proper operation.
23
OUTA0
A0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver
inputs to ensure proper operation.
26
INA0
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
27
INA0
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to VCC pulls the
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
28
ASEL0
Input Select for A0 Output. Selects the differential input to reproduce at the A0 differential outputs. Connect
ASEL0 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL0 to VCC to select the INA1
(INA1) set of inputs. An internal 435kΩ resistor pulls ASEL0 low when unconnected.
30
INA1
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Noninverting Input. An internal 128kΩ resistor to VCC pulls
the input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
31
INA1
LVDS/HSTL (MAX9392) or LVPECL/CML (MAX9393) Inverting Input. An internal 128kΩ resistor to VCC pulls the
input high when unconnected (MAX9392). An internal 68kΩ resistor to GND pulls the input low when
unconnected (MAX9393).
32
ASEL1
Input Select for A1 Output. Selects the differential input to reproduce at the A1 differential outputs. Connect
ASEL1 to GND or leave open to select the INA0 (INA0) set of inputs. Connect ASEL1 to VCC to select the INA1
(INA1) set of inputs. An internal 435kΩ resistor pulls ASEL1 low when unconnected.
—
EP
A1 Output Enable. Drive ENA1 high to enable the A1 LVDS outputs. An internal 435kΩ resistor pulls ENA1 low
when unconnected.
A0 Output Enable. Drive ENA0 high to enable the A0 LVDS outputs. An internal 435kΩ resistor pulls ENA0 low
when unconnected.
Exposed Paddle (QFN Package Only). Connect to GND for optimal thermal and EMI characteristics.
_______________________________________________________________________________________
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
MAX9392/MAX9393
VIN_ _
VIHD
VID = 0
VID = 0
VIN_ _
OUT_ _
VILD
1/4 MAX9392/MAX9393
tPHL
tPLH
VOUT_ _
VOD
RL/2
VOD = 0
IN_ _
VOD = 0
VOS
VOUT_ _
IN_ _
RL/2
80%
VOD = 0
50%
EN_ _ = HIGH
VID = VIN_ _ - VIN_ _
80%
∆VOD = VOD - VOD*
∆VOS = VOS - VOS*
VOD AND VOS ARE MEASURED WITH VID = +100mV
VOD* AND VOS* ARE MEASURED WITH VID = -100mV
20%
20%
tR
OUT_ _
VOD = 0
50%
tF
VID = VIN_ _ - VIN_ _
VOD = VOUT_ _ - VOUT_ _
tPLH AND tPHL MEASURED FOR ANY COMBINATION OF _SEL0 AND _SEL1.
Figure 1. Output Transition Time and Propagation Delay Timing
Diagram
Figure 2. Test Circuit for VOD and VOS
VIHD
IN_0
VID = 0
VILD
IN_0
VIHD
IN_1
VID = 0
VILD
IN_1
VIH
1.5V
1.5V
VIL
_SEL_
OUT_ _
IN_0
VOD = 0
IN_1 VOD = 0
IN_0
OUT_ _
tSWITCH
tSWITCH
EN_0 = EN_1 = HIGH
VID = VIN_ _ - VIN_ _
Figure 3. Input to Rising/Falling Edge Select and Mux Switch Timing Diagram
_______________________________________________________________________________________
7
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
OUT_ _
1/4 MAX9392/MAX9393
1.5V
VEN_ _
CL
3V
1.5V
0
RL/2
IN_ _
tPHD
IN_ _
+1.25V
RL/2
PULSE
GENERATOR
VOUT_ _ WHEN VID = +100mV
tPDH
50%
50%
50%
50%
VOUT_ _ WHEN VID = -100mV
OUT_ _
VOUT_ _ WHEN VID = -100mV
VOUT_ _ WHEN VID = +100mV
CL
50Ω
tPHD
RL = 100Ω ±1%
CL = 1.0pF
tPDH
VID = VIN_ _ - VIN_ _
Figure 4. Output Active-to-Disable and Disable-to-Active Test Circuit and Timing Diagram
_SEL0
IN_0
CL
OUT_0
0
IN_0
RL
1
PULSE
GENERATOR
50Ω
OUT_0
CL
MAX9392
MAX9393
50Ω
CL
OUT_1
0
RL
IN_1
1
IN_1
CL
_SEL1
EN_0 = EN_1 = HIGH
1 CHANNEL SHOWN
RL = 100Ω ±1%
CL = 1.0pF
Figure 5. Output Transition Time, Propagation Delay, and Output Channel-to-Channel Skew Test Circuit
8
_______________________________________________________________________________________
OUT_1
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
MAX9392/MAX9393
VOUT_0
VOD = 0
VOD = 0
tCCS
tCCS
IN_0
OUT_0
IN_1
OUT_1
VOUT_0
VOUT_1
VOD = 0
VOD = 0
2 x 2 CROSSPOINT
VOUT_1
VOD = VOUT_ _ - VOUT_ _
tCCS MEASURED WITH _SEL0 = _SEL1 = HIGH OR LOW
(1:2 SPLITTER CONFIGURATION).
IN_0
OUT_0 OR OUT_1
IN_1
Figure 6. Output Channel-to-Channel Skew
2:1 MUX
Detailed Description
The LVDS interface standard provides a signaling
method for point-to-point communication over a controlled-impedance medium as defined by the ANSI
TIA/EIA-644 standard. LVDS utilizes a lower voltage
swing than other communication standards, achieving
higher data rates with reduced power consumption,
while reducing EMI emissions and system susceptibility
to noise.
The MAX9392/MAX9393 1.5GHz dual 2 x 2 crosspoint
switches optimize high-speed, low-power, point-topoint interfaces. The MAX9392 accepts LVDS and
HSTL signals, while the MAX9393 accepts LVPECL and
CML signals. Both devices route the input signals to
either or both LVDS outputs.
When configured as a 1:2 splitter, the outputs repeat
the selected inputs. This configuration creates copies
of signals for protection switching. When configured as
a repeater, the device operates as a two-channel
buffer. Repeating restores signal amplitude, allowing
isolation of media segments or longer media drive.
When configured as a 2:1 mux, select primary or backup signals to provide a protection-switched, fault-tolerant application.
Input Fail-Safe
The differential inputs of the MAX9392/MAX9393 possess internal fail-safe protection. Fail-safe circuitry
forces the outputs to a differential low condition for
undriven inputs or when the common-mode voltage
exceeds the specified range. The MAX9392 provides
high-level input fail-safe detection for LVDS, HSTL, and
other GND-referenced differential inputs. The MAX9393
provides low-level input fail-safe detection for LVPECL,
CML, and other VCC-referenced differential inputs.
OUT_0
IN_0 OR IN_1
OUT_1
1:2 SPLITTER
IN_0
OUT_0
IN_1
OUT_1
DUAL REPEATER
Figure 7. Programmable Configurations
Select Function
The _SEL_ logic inputs control the input and output signal connections. Two logic inputs control the signal routing for each channel. _SEL0 and _SEL1 allow the
devices to be configured as a differential crosspoint
switch, 2:1 mux, dual repeater, or 1:2 splitter (Figure 7).
See Table 1 for mode-selection settings (insert A or B for
the _). Channels A and B possess separate select
inputs, allowing different configurations for each channel.
Enable Function
The EN_ _ logic inputs enable and disable each set of
differential outputs. Connect EN_ 0 to VCC to enable
the OUT_0/OUT_0 differential output pair. Connect
EN_0 to GND to disable the OUT_0/OUT_0 differential
output pair. The differential output pairs assert to a differential low condition when disabled.
_______________________________________________________________________________________
9
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
Table 1. Input/Output Function Table
_SEL0
_SEL1
OUT_0 / OUT_0
OUT_1 / OUT_1
MODE
0
0
IN_0 / IN_0
IN_0 / IN_0
1:2 splitter
0
1
IN_0 / IN_0
IN_1 / IN_1
Repeater
1
0
IN_1 / IN_1
IN_0 / IN_0
Switch
1
1
IN_1 / IN_1
IN_1 / IN_1
1:2 splitter
Applications Information
Differential Inputs
The MAX9392/MAX9393 inputs accept any differential
signaling standard within the specified common-mode
voltage range. The fail-safe feature detects commonmode input signal levels and generates a differential
output low condition for undriven inputs or when the
common-mode voltage exceeds the specified range.
Leave unused inputs unconnected or connect to VCC
for the MAX9392 or to GND for the MAX9393.
Expanding the Number of LVDS Output
Ports
Cascade devices to make larger switches. Consider
the total propagation delay and total jitter when determining the maximum allowable switch size.
Power-Supply Bypassing
Bypass each VCC to GND with high-frequency surfacemount ceramic 0.1µF and 0.01µF capacitors in parallel
as close to the device as possible. Install the 0.01µF
capacitor closest to the device.
Differential Traces
Input and output trace characteristics affect the performance of the MAX9392/MAX9393. Connect each input
and output to a 50Ω characteristic impedance trace.
Maintain the distance between differential traces and
eliminate sharp corners to avoid discontinuities in differential impedance and maximize common-mode
noise immunity. Minimize the number of vias on the differential input and output traces to prevent impedance
discontinuities. Reduce reflections by maintaining the
50Ω characteristic impedance through connectors and
across cables. Minimize skew by matching the electrical length of the traces.
10
Output Termination
Terminate LVDS outputs with a 100Ω resistor between
the differential outputs at the receiver inputs. LVDS outputs require 100Ω termination for proper operation.
Ensure that the output currents do not exceed the current limits specified in the Absolute Maximum Ratings.
Observe the total thermal limits of the MAX9392/
MAX9393 under all operating conditions.
Cables and Connectors
Use matched differential impedance for transmission
media. Use cables and connectors with matched differential impedance to minimize impedance discontinuities. Avoid the use of unbalanced cables. Balanced
cables such as twisted pair offer superior signal quality
and tend to generate less EMI due to canceling effects.
Board Layout
Use a four-layer printed circuit (PC) board providing
separate signal, power, and ground planes for highspeed signaling applications. Bypass VCC to GND as
close to the device as possible. Install termination
resistors as close to receiver inputs as possible. Match
the electrical length of the differential traces to minimize
signal skew.
______________________________________________________________________________________
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
+3.0V TO
+3.6V
0.1µF
0.01µF
VCC
Z0 = 50Ω
OUTA0
INA0
Z0 = 50Ω
100Ω
100Ω
Z0 = 50Ω
MAX9392
MAX9393
INA0
OUTA0
Z0 = 50Ω
OUTA1
Z0 = 50Ω
OUTA1
Z0 = 50Ω
OUTB0
Z0 = 50Ω
OUTB0
Z0 = 50Ω
OUTB1
Z0 = 50Ω
OUTB1
Z0 = 50Ω
INA1
INA1
INB0
LVDS
RECEIVER
MAX9173
INB0
INB1
INB1
ENA0
ENA1
ENB0
ENB1
LVCMOS/LVTTL
LOGIC INPUTS
ASEL0
ASEL1
BSEL0
BSEL1
GND
GND
GND
GND
______________________________________________________________________________________
11
MAX9392/MAX9393
Typical Operating Circuit
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
MAX9392/MAX9393
Functional Diagram
Pin Configurations (continued)
1
ASEL0
INA0
INA0
GND
30
29
28
27
26
25
OUTA0
24 VCC
ENA0
INB0 2
23 OUTA0
ASEL0
INB0 3
22 OUTA0
OUTA1
VCC 5
OUTA1
ENA1
INB1 6
21 ENA0
INB1 7
18 OUTA1
*EXPOSED PADDLE
BSEL1 8
13
14
15
16
VCC
12
OUTB0
11
OUTB0
10
ENBO
17 ENA1
9
GND
INB0
20 GND
19 OUTA1
OUTB1
INB0
0
MAX9392
MAX9393
OUTB1
ASEL1
THIN QFN
(5mm x 5mm)
OUTB0
ENB0
31
BSEL0 4
1
0
OUTB0
32
GND 1
INA1
INA1
VCC
OUTA0
INA1
MAX9392
MAX9393
0
ENB1
INA0
INA1
INA0
ASEL1
TOP VIEW
1
*CONNECT EXPOSED PADDLE TO GND.
BSEL0
INB1
OUTB1
OUTB1
ENB1
BSEL1
12
1
0
INB1
Chip Information
TRANSISTOR COUNT: 1565
PROCESS: Bipolar
______________________________________________________________________________________
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
b
CL
0.10 M C A B
D2/2
D/2
PIN # 1
I.D.
QFN THIN.EPS
D2
0.15 C A
D
k
0.15 C B
PIN # 1 I.D.
0.35x45
E/2
E2/2
CL
(NE-1) X e
E
E2
k
L
DETAIL A
e
(ND-1) X e
CL
CL
L
L
e
e
0.10 C
A
C
0.08 C
A1 A3
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE
16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL
COMMON DIMENSIONS
DOCUMENT CONTROL NO.
REV.
21-0140
C
1
2
EXPOSED PAD VARIATIONS
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1
SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE
ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE
16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL
DOCUMENT CONTROL NO.
REV.
21-0140
C
2
2
______________________________________________________________________________________
13
MAX9392/MAX9393
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
32L TQFP, 5x5x01.0.EPS
MAX9392/MAX9393
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.