DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2753GR IF DOWN-CONVERTER IC FOR 3 V GPS RECEIVER The µPC2753GR is a monolithic IC designed as IF down-converter for GPS receivers. This IF down-converter IC features high gain and the GC (gain control) function, and operates on 3 volts typ. Therefore, this IC is suitable for enhancing the performance and reducing the power consumption of user’s application sets. This IC is packaged in a 20-pin shrink SOP that enables high-density surface mounting. The µPC27×× series is manufactured using NEC original silicon bipolar process technology called “NESAT TM III” (fT = 20 GHz). This process technology includes direct silicon nitride film and gold electrode structure. Semiconductor chips produced with this technology have excellent moisture resistivity, anticorrosion, current characteristics, and high-frequency performance. As a result, this IC features excellent reliability and electrical characteristics. FEATURES • Low power operation: power supply VCC = 3.0 V typ. • Low power consumption: ICCTOTAL = 6.5 mA typ. • High gain of 79 dB in total: 38 dB typ. in down-converter block (VGC ≤ 12 V), and 41 dB typ. in 2nd IF amplifier block • GC function: GC dynamic range (DGC) = 19 dB typ. • Available in 20-pin shrink SOP : enabling high-density surface mount ORDERING INFORMATION Part Number Package Packing Style µPC2753GR-E1 20-pin plastic Shrink SOP (225 mil) Embossed tape 12-mm wide. No. 1 pin is in pull-out direction. 2500 pieces/reel µPC2753GR-E2 20-pin plastic Shrink SOP (225 mil) embossed tape 12-mm wide. No. 1 pin is in roll-in direction. 2500 pieces/reel Remark To order evaluation samples, please contact local NEC sales representative, mentioning “µPC2753GR.” Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14501EJ2V0DS00 (2nd edition) (Previous No. IC-3490) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1995, 1999 µ PC2753GR PRODUCT LINE-UP (TA =+ 25 °C, VCC = 3.0 V) Type Part Number ICC (mA) Gain (dB) SSB NF (dB) fin (GHz) RF Down-converter µPC2756T 6 14 12 0.1 - 2.0 IF Down-converter µPC2753GR 6.5 60 to 79Note 12 DC - 0.4 Remark Note Typical values of major parameters. For test conditions, refer to Electrical Characteristics Tables. V GC = 0 to 2.4 V PIN CONFIGURATION AND BLOCK DIAGRAM (Top View) MIXout1 1 20 MIXout2 GND 2 19 GND 1st IFin 3 18 LOin1 1st IFin 4 17 LOin2 2nd IFout 5 16 GC 2nd IF-AMPin 6 15 VCC (Downcon) 2nd IF-AMPin 7 14 VCC (2nd IF-AMP) bypass 8 13 2nd IFAMPout GND 9 12 GND NC 10 2 11 NC Data Sheet P14501EJ2V0DS00 µPC2753GR PIN FUNCTION Pin No. Symbol Pin Voltage (V) Description 3 1st IFin 2.5 No. 3 pin is the input pin of the 1st IF amplifier. No. 4 pin should be connected to GND via a bypass capacitor. Equivalent Circuit VCC To MIX To MIX 3 4 1st IFin 2.5 5 2nd IFout 1.1 6 7 2ndIF-AMPin 2ndIF-AMPin 2.1 2.1 No. 5 pin is the output pin of the 2nd IF. The output signal comes from the mixer unit via the GC amplifier. This output pin features low impedance because of its emitter-follower output port. No. 6 and 7 pins are the input pins of the 2nd IF amplifier. These two inputs are internally connected to each base of the pair transistors of the differential amplifier. No.6 pin should be connected to GND via a bypass capacitor. 8 bypass 2.1 No. 8 pin is connected to the feedback loop of the 2nd IF amplifier. This pin should be connected to GND via a bypass capacitor to stabilize the DC bias. 13 2ndIF-AMPout 1.4 No. 13 pin is the output pin of the 2nd IF amplifier. This output pin features low impedance because of its emitter-follower output port. Data Sheet P14501EJ2V0DS00 4 VCC MIX GC Amp 5 VCC 8 13 7 6 3 µ PC2753GR PIN FUNCTION Pin No. Symbol Pin Voltage (V) 16 GC 0 to 2.4 17 LO2 Description No. 16 pin is the gain control pin (Supply voltage) for the GC amplifier. The gain of the GC amplifier is controlled by the applied voltage of this pin. This GC amplifier functions as a reverse GC. 2.5 Equivalent Circuit VCC MIX GC Amp RF 5 LO 16 No. 17 and 18 pins are the local input pins of the mixer. The LO2 pin should be connected to GND via a bypass capacitor. VCC To MIX 18 4 17 18 LO1 2.5 15 VCC (Downcon) – No. 15 pin is the VCC supply pin for the IF down-converter block. This pin is independent of the VCC pin for the IF amplifier. Apply 3 V to the No. 15 pin. – 14 VCC (2nd IF-AMP) – No. 14 pin is the VCC supply pin for the 2nd IF amplifier. This pin is independent of the VCC pin for the IF down-converter unit. Apply 3 V to the No. 16 pin. – 2 9 12 19 GND – This pin is the ground pin for the entire chip. Therefore the ground of the IF down-converter and 2nd IF amplifier blocks are not separated. The ground pattern to be connected to this pin should be formed as wide as possible to minimize its impedance. – 10 11 NC – No. 10 and 11 pins are not connected to the internal circuits. Connecting these pins to GND is recommended, though these pins may be left unconnected. – 1 MIXout1 – – 20 MIXout2 No. 1 and 20 pins are the output pins of the mixer block. These pin are used to monitor the signal output from the 2nd IF amplifier and to be input to the GC amplifier. When this IC is actually used, these pins should be left opened. Data Sheet P14501EJ2V0DS00 To MIX µPC2753GR ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Parameter Symbol Conditions Rating Unit Supply Voltage VCC TA = +25 °C 4.0 V Gain control Voltage VGC TA = +25 °C 4.0 V Power Dissipation PD When mounted on double-sided copper clad epoxy glass board of 50 x 50 x 1.6 mm, Ta = +85 °C 34 mW Operating Ambient Temperature Topt –40 to +85 °C Storage Temperature Tstg –55 to +150 °C Recommended Operating Conditions Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.7 3.0 3.3 V Operating Ambient Temperature Topt –40 +25 +85 °C Lo Input Level PLoin –20 – 0 dBm Electrical Characteristics (Unless otherwise specified, TA = +25 °C, VCC = 3.0 V, Zs = Zo = 50 Ω) Parameter MIN. TYP. MAX. Unit No signal, VGC = GND 4.7 6.9 8.5 mA f1st IFin Within –3 dB from CG at f1st IFin = 50 MHz f1st IFout = 4 MHz, VGC = GND DC 400 MHz f2nd IFout Within –3 dB from CG at f1st IFin = 200 MHz f1st IFin = 200 MHz, VGC = GND DC 20 MHz C.G f1st IFin = 200 MHz, f2nd IFout = 4 MHz VGC = GND 35 38 42 dB Noise Figure SSB NF f1st IFin = 200 MHz, f2nd IFout = 20 MHz VGC = GND – 12 15 dB * Input VSWR VSWR1 f1stIF ≤ 400 MHz * Lo Leak to 2nd IF ouput pin LO 2nd IFout fLO = 1 to 400 MHz –62 dBm * Lo Leak to 1st IF input pin LO 1st IFin fLO = 1 to 500 MHz –25 dBm Circuit Current Symbol ICC TOTAL Conditions (1) IF Down-converter Block 1st IF Input Frequency 2nd IF Output Frequency Conversion Gain 1.5 : 1 Gain control Voltage VGC Voltage at CG = max. 1.2 Gain control Dynamic Range DGC f1st IFin = 200 MHz, f2nd IFout = 4 MHz VGC = 1.2 V to 2.4 V 15 Input Frequency fAMPin Within –3 dB from the gain at f = 4 MHz DC Output Voltage VAMPout f = 4 MHz, Zo = 1 MΩ//27 pF 350 f = 4 MHz 38 19 V dB (2) 2nd IF Amplifier Block Gain S21 20 MHz 450 550 mVP-P 41 45 dB * For reference only Data Sheet P14501EJ2V0DS00 5 µ PC2753GR Test Circuit 1 20 2 19 3 18 C1 1 000 pF SG SG C11 1 000 pF 1 000 pF 1 000 pF 4 17 5 16 C2 1 000 pF SA C10 C3 1 000 pF C9 6 15 7 14 8 13 C4 1 000 pF SG C5 1 000 pF 1 000 pF VGC C8 1 000 pF VCC = 3 V C7 Oscilloscope or 1 MEG 27 pF 1 000 pF C6 9 12 10 11 SA Footprint of Test Circuit 1st IFin LOin 11 C 1 C2 2nd IFout C C10 VGC C9 VCC C8 C3 C7 C 5 C6 C4 2nd IF-AMPin µ PC2753GR Legends (*1) Double-sided patterning with 35- µ m- Parts thick copper on polyhimid board siz- Number Value C1 to C11 1 000 pF ing 50 × 50 × 0.4 mm (*2) GND pattern on backside (*3) Solder coating over patterns (*4) 6 indicate through-holes Data Sheet P14501EJ2V0DS00 2nd IFAMPout µPC2753GR Characteristic Curves (Unless otherwise specified, TA = +25 °C, VCC = 3 V) – Entire IC – CIRCUIT CURRENT vs. SUPPLY VOLTAGE CIRCUIT CURRENT vs. TEMPERATURE 15 No Signal VGC = GND Circuit Current ICC TOTAL (mA) Circuit Current ICC TOTAL (mA) 15 10 5 0 1 2 3 4 No Signal VGC = GND 10 5 5 –20 –40 Supply Voltage VCC (V) 0 +20 +40 +60 +80 +100 Operating Temperature Topt (˚C) CONVERSION GAIN AND SSB NOISE FIGURE vs. INPUT FREQUENCY CONVERSION GAIN vs. 2nd IF OUTPUT FREQUENCY 50 VCC = 3.0 V VCC = 3.3 V 40 30 CG 20 VCC = 2.7 V SBB Noise Figure SSB NF (dB) 20 15 NF 10 5 f2nd IFout = 4 MHZ (Low-side Local) VGC = GND Conversion Gain CG (dB) 50 100 200 300 400 500 600 700 800 900 1000 40 VCC = 3.3 V 30 VCC = 2.7 V 20 VCC = 3.0 V 10 VGC = GND P1st IFin = –70 dBm PLoin = –10 dBm f1st IFin = 200 MHZ 0 20 40 60 80 100 2nd IF Output Frequency f2nd IFout (MHZ) 1st IF Input Frequency (MHZ) CONVERSION GAIN vs. Lo INPUT POWER CONVERSION GAIN vs. AGC VOLTAGE 50 VGC = GND Conversion Gain CG (dB) 50 Conversion Gain CG (dBm) Conversion Gain CG (dB) – IF Down-Converter Block – 40 30 20 10 0 –80 –70 –60 –50 –40 –30 –20 –10 0 10 40 VCC = 3.3 V 30 VCC = 3.0 V 20 10 VCC = 2.7 V 0 –10 0 Lo Input Level (dBm) 0.5 1 1.5 2 2.5 3 3.5 AGC Voltage (V) Data Sheet P14501EJ2V0DS00 7 µ PC2753GR – IF Down-Converter Block – Lo LEAKAGE AT 2nd IF OUTPUT PIN –20 –40 –60 –80 –100 0 PLoin = –10 dBm Lo Leak Level LOIFout (dBm) Lo Leak Level LOIFout (dBm) 0 Lo LEAKAGE AT 1st IF OUTPUT PIN 1 100 200 300 400 500 2nd IF Output Frequency fIFout (MHZ) PLoin = –10 dBm –20 –40 –60 –80 –100 1 100 1st IF INPUT RETURN LOSS vs. FREQUENCY 1st IF Return Loss (dB) 0 External 50-Ω termination 10 20 30 40 1 200 400 600 800 1000 1st IF Input Frequency fIFin (MHZ) 8 200 300 400 1st IF Input Frequency fIFout (MHZ) Data Sheet P14501EJ2V0DS00 500 µPC2753GR – 2nd IF Amplifier Block – GAIN vs. RESPONCE FREQUENCY Lo LEAKAGE AT 2nd IF AMPLIFIER OUTPUT PIN 0 Lo Leak Level LOAMPout (dBm) Power Gain S21 (dB) 60 50 VCC = 3.3 V 40 VCC = 3.0 V 30 VCC = 2.7 V 20 0.1 20 40 60 80 100 2nd IF Amplifier Input Frequency fAMPin (MHZ) 2nd IFout pin and 2nd IF AMPin pin connected –20 –40 –60 –80 –100 1 100 200 300 400 500 2nd IF Amplifier Input Frequency fAMPin (MHZ) OUTPUT VOLTAGE vs. INPUT POWER Output Voltage VAMPout (mV) 500 fAMPin = 1 MHZ with Oscilloscope 400 300 200 100 0 –80 –70 –60 –50 –40 –30 –20 –10 2nd IF Amplifier Input Level PAMPin (dBm) Data Sheet P14501EJ2V0DS00 9 µ PC2753GR SYSTEM APPLICATION EXAMPLES: GPS Receiver Schematic GPS RECEIVER CHIP SET Antenna 1 575.42 MHZ BPF BPF µ PC2756T GC 90 MHZ BPF RF Amp. µPC2749T 1st Mixer 1st IF Amp. 2nd IF Amp. 2nd IF OUT ≅ 2 MHZ 2nd Mixer Lo Buffer Lo2 input Output µPC2753GR Buffer ISV210 µPC2745T ÷4 OP Amplifier ÷2 ÷2 ÷2 ÷2 ÷2 Output (+) LOOP AMP/Filter Output (–) PHASE DETECTOR Reference Oscillation TCXO 11.6 MHZ Caution This block diagram schematically represents the chip set product line-up only, and does not imply a detailed application circuit. For details on the related devices, refer to the latest data sheet of each device. 10 Data Sheet P14501EJ2V0DS00 µPC2753GR PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm) 11 20 detail of lead end +7˚ 3˚–3˚ 1 10 6.7 ± 0.3 6.4 ± 0.2 1.8 MAX. 4.4 ± 0.1 1.5 ± 0.1 1.0 ± 0.2 0.5 ± 0.2 0.15 0.65 +0.10 0.22 –0.05 0.10 M 0.15 +0.10 –0.05 0.575 MAX. 0.1 ± 0.1 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. Data Sheet P14501EJ2V0DS00 11 µ PC2753GR ATTENTION ON USING THIS IC (1) Observe precautions for handling because of electrostatic sensitive devices. (2) The ground pattern should be designed as wide as possible to minimize its ground impedance. Otherwise, undesired oscillation may occur. (3) The track length of the ground pins should be as short as possible. (4) A bypass capacitor should be inserted between the VCC pin and the VCC line. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. µPC2753GR Soldering Process Soldering Conditions Infrared Ray Peak temperature of package surface : 235 °C, Reflow Reflow time : 30 seconds or less (210 ˚C or higher), Symbols IR35-00-2 Number of reflow processes : 2, Exposure limit : noneNote VPS Peak temperature of package surface : 215 °C, VP15-00-2 Reflow time : 40 seconds or less (200 °C or higher), Number of reflow processes : 2, Exposure limit : noneNote Wave Soldering Solder temperature : 260 °C or lower, WS60-00-1 Flow time : 10 seconds or less, Number of reflow processes : 1, Exposure limit : none Note Partial Heating Pin temperature : 300 °C or lower, Method Time : 10 seconds or less for each pin, Exposure limit : none Note Note Exposure limit before soldering after dry-pack package is opened. Storage conditions : 25 °C and relative humidity of 65 % or less. Caution Do not apply more than one soldering method at any one time, except for the partial heating method. 12 Data Sheet P14501EJ2V0DS00 µPC2753GR [MEMO] Data Sheet P14501EJ2V0DS00 13 µ PC2753GR [MEMO] 14 Data Sheet P14501EJ2V0DS00 µPC2753GR [MEMO] Data Sheet P14501EJ2V0DS00 15 µ PC2753GR ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. 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Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8