TPCS8008-H TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (MACHⅡπ-MOSⅤ) TPCS8008-H High-Speed Switching Applications Switching Regulator Applications DC/DC Converter Applications Unit: mm • Low drain-source ON-resistance: RDS (ON) = 0.48 Ω (typ.) • High forward transfer admittance: |Yfs| = 1.8 S (typ.) • Low leakage current: IDSS = 100 μA (max) (VDS = 250 V) • Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristic 1.2.3. Source 4 Gate 5.6.7.8 Drain Symbol Rating Unit Drain-source voltage VDSS 250 V Drain-gate voltage (RGS = 20 kΩ) VDGR 250 V Gate-source voltage VGSS ±20 V (Note 1) ID 1.7 Pulse (Note 1) IDP 6.8 Drain power dissipation (t = 10 s) (Note 2a) PD 1.5 Drain power dissipation (t = 10 s) (Note 2b) PD 0.6 Single-pulse avalanche energy(Note3) EAS 1.7 mJ Avalanche current IAR 1.7 A Repetitive avalanche energy (Note2a, Note 4) EAR 0.15 mJ Channel temperature Tch 150 °C Storage temperature range Tstg −55~150 °C Drain current DC JEDEC ― JEITA ― TOSHIBA 2-3R1F Weight: 0.036 g (typ.) A Circuit Configuration W Note: For Notes 1 to 4, refer to the next page. 8 7 6 5 1 2 3 4 Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic-sensitive device. Handle with care. 1 2006-11-21 TPCS8008-H Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Rth (ch-a) 83.3 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth (ch-a) 208 °C/W Marking (Note 5) Part No. (or abbreviation code) S8008 * Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. Note 1: The channel temperature should not exceed 150°C during use. Note 2: a) Device mounted on a glass-epoxy board (a) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 × 25.4 × 0.8 (unit: mm) FR-4 25.4 × 25.4 × 0.8 (unit: mm) (a) (b) Note 3: VDD = 50 V, Tch = 25°C (initial), L = 1.0 mH, RG = 25 Ω, IAR = 1.7 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: ○ on the lower right of the marking indicates Pin 1. * Weekly code: (Three digits) Week of manufacture (01 for first week of year, continuing up to 52 or 53) Year of manufacture (The last digit of the calendar year) 2 2006-11-21 TPCS8008-H Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS = ±16 V, VDS = 0 V ⎯ ⎯ ±10 μA Drain cutoff current IDSS VDS = 150 V, VGS = 0 V ⎯ ⎯ 100 μA V (BR) DSS ID = 10 mA, VGS = 0 V 250 ⎯ ⎯ V (BR) DSX ID = 10 mA, VGS = −5 V 250 ⎯ ⎯ V (BR) DSX ID = 10 mA, VGS = −20 V 200 ⎯ ⎯ Vth VDS = 10 V, ID = 1 mA 2.0 ⎯ 4.0 V Drain-source ON-resistance RDS (ON) VGS = 10 V, ID = 0.8 A ⎯ 0.48 0.58 Ω Forward transfer admittance |Yfs| VDS = 10 V, ID = 0.8 A 0.8 1.8 ⎯ S Input capacitance Ciss ⎯ 600 ⎯ pF Reverse transfer capacitance Crss ⎯ 20 ⎯ pF Output capacitance Coss ⎯ 220 ⎯ pF ⎯ 35 ⎯ ⎯ 95 ⎯ Gate threshold voltage Rise time VDS = 10 V, VGS = 0 V, f = 1 MHz tr VGS Turn-on time ton Fall time tf Turn-off time toff Total gate charge (gate-source plus gate-drain) Qg Gate-source charge Qgs Gate-drain (“Miller”) charge Qgd Gate switch charge Qsw 0V 4.7 Ω Switching time ID = 0.8 A VOUT 10 V RL = 156 Ω Drain-source breakdown voltage V ns ⎯ 20 ⎯ ⎯ 120 ⎯ ⎯ 10 ⎯ nC ⎯ 7.5 ⎯ nC ⎯ 2.5 ⎯ nC ⎯ 3.3 ⎯ nC VDD ∼ − 125 V Duty < = 1%, tw = 10 μs VDD ∼ − 200V, VGS = 10 V, ID = 1.7 A Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristic Drain reverse current (pulse) Forward voltage (diode) (Note 1) Symbol Test Condition Min Typ. Max Unit IDRP ⎯ ⎯ ⎯ 6.8 A ⎯ ⎯ −2.0 V VDSF IDR = 1.7 A, VGS = 0 V 3 2006-11-21 TPCS8008-H ID – VDS 6 4 4.8 5.5 ID 5.2 2 Drain current 4.6 4.4 1 4.2 VGS = 4 V 0 0 0.4 0.8 1.2 Drain-source voltage Common source Ta = 25°C Pulse test 5 8 (A) ID Drain current ID – VDS 5 10 Common source Ta = 25°C Pulse test 1.6 VDS 4.8 2 4.6 4.4 1 4.2 VGS = 4 V 0 1 (V) 2 (V) (V) Common source Ta = 25°C Pulse test 1.6 VDS 3 25 Drain-source voltage (A) VDS 5 VDS – VGS Common source ID Drain current 4 2.0 2 Ta = −55°C 100 1 0 2 4 6 Gate-source voltage 8 VGS 100 1 Drain current 10 ID 0 4 8 12 16 VGS 20 (V) RDS (ON) − ID 25 1 0.4 10 10 0.1 0.1 0.8 0.4 Gate-source voltage Common source VDS = 10 V Pulse test Ta = −55°C ID = 1.7 A 0.8 (V) Drain-source ON-resistance RDS (ON) (Ω) |Yfs| 100 1.2 0 10 ⎪Yfs⎪ − ID (S) 3 Drain-source voltage Pulse test Forward transfer admittance 5.2 5 0 2.0 VDS = 10 V 0 5.5 6 3 ID – VGS 4 10 8 (A) 3 Common source Ta = 25°C Pulse test 1 VGS = 10 V 0.1 0.1 100 (A) Drain current 4 10 1 ID (A) 2006-11-21 TPCS8008-H RDS (ON) − Ta 1.6 IDR − VDS 10 Common source Common source Ta = 25°C Pulse test (A) Pulse test IDR 1.2 0.8 ID = 1.7 A Drain reverse current Drain-source ON-resistance RDS (ON) (Ω) VGS = 10 V 0.8 0.4 0.4 0 −80 −40 0 40 80 Ambient temperature Ta 10 5 3 −0.2 0 (°C) −0.4 4 Vth (V) Ciss 100 Coss Gate threshold voltage (pF) −0.8 VDS −1.0 (V) Vth − Ta C Capacitance −0.6 Drain-source voltage Capacitance – VDS 1000 10 VGS = 0 V 1 0.1 160 120 1 Crss Common source VGS = 0 V f = 1 MHz Common source VDS = 10 V ID = 1mA Pulse test 3 2 1 Ta = 25°C 10 VDS −40 (V) 300 1.2 VDS Drain-source voltage (1) (V) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) t=10s (W) PD Drain power dissipation 1.6 0.8 (2) 0.4 0 0 40 80 120 Ambient temperature 40 80 120 Ta 160 (°C) Dynamic input/output characteristics PD – Ta 2.0 0 Ambient temperature 160 Ta 200 VDS 16 100 50 8 VGS 5 Total gate charge (°C) 5 VDS = 200 V 100 0 0 200 24 Common source ID = 1.7 A Ta = 25°C Pulse test (V) Drain-source voltage 0 −80 100 0 15 10 Qg VGS 1 Gate-source voltage 1 0.1 (nC) 2006-11-21 TPCS8008-H rth − tw 500 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) (2) Device mounted on a glass-epoxy board (b) (Note 2b) Transient thermal impedance rth (°C/W) 100 (1) 10 1 Single - pulse 0.1 0.001 0.01 0.1 1 Pulse width 10 tw 100 1000 (s) Safe operating area 10 ID max (pulse) * Drain current ID (A) 100 t =1 ms * 10 ms * 1 *Single - pulse Ta = 25°C Curves must be derated linearly with increase in temperature. 0.1 1 VDSS max 10 Drain-source voltage 100 VDS 1000 (V) 6 2006-11-21 TPCS8008-H RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 7 2006-11-21