ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 EcoSPARKTM 200mJ, 400V, N-Channel Ignition IGBT General Description Applications The ISL9V2040D3S, ISL9V2040S3S, and ISL9V2040P3 are the next generation ignition IGBTs that offer outstanding SCIS capability in the space saving D-Pak (TO-252), as well as the industry standard D²-Pak (TO-263) and TO-220 plastic packages. This device is intended for use in automotive ignition circuits, specifically as a coil driver. Internal diodes provide voltage clamping without the need for external components. • Automotive Ignition Coil Driver Circuits • Coil- On Plug Applications EcoSPARK™ devices can be custom made to specific clamp voltages. Contact your nearest Fairchild sales office for more information. Features • Space saving D - Pak package available • SCIS Energy = 200mJ at TJ = 25oC • Logic Level Gate Drive Formerly Developmental Type 49444 Package Symbol COLLECTOR JEDEC TO-252AA D-Pak JEDEC TO-263AB D²-Pak JEDEC TO-220AB E C G R1 GATE G G E R2 E COLLECTOR (FLANGE) EMITTER COLLECTOR (FLANGE) Device Maximum Ratings TA = 25°C unless otherwise noted Symbol BVCER Parameter Collector to Emitter Breakdown Voltage (IC = 1 mA) Ratings 430 Units V BVECS Emitter to Collector Voltage - Reverse Battery Condition (IC = 10 mA) 24 V ESCIS25 At Starting TJ = 25°C, ISCIS = 11.5A, L = 3.0mHy 200 mJ ESCIS150 At Starting TJ = 150°C, ISCIS = 8.9A, L = 3.0mHy 120 mJ IC25 Collector Current Continuous, At TC = 25°C, See Fig 9 10 A IC110 Collector Current Continuous, At TC = 110°C, See Fig 9 10 A VGEM Gate to Emitter Voltage Continuous ±10 V PD Power Dissipation Total TC = 25°C 130 W Power Dissipation Derating TC > 25°C 0.87 W/°C Operating Junction Temperature Range -40 to 175 °C Storage Junction Temperature Range -40 to 175 °C Max Lead Temp for Soldering (Leads at 1.6mm from Case for 10s) 300 °C Tpkg Max Lead Temp for Soldering (Package Body for 10s) 260 °C ESD Electrostatic Discharge Voltage at 100pF, 1500Ω 4 kV TJ TSTG TL ©2004 Fairchild Semiconductor Corporation ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 October 2004 Device Marking V2040D Device ISL9V2040D3ST Package TO-252AA Reel Size 330mm Tape Width 16mm Quantity 2500 V2040S ISL9V2040S3ST TO-263AB 330mm 24mm 800 V2040P ISL9V2040P3 TO-220AB Tube N/A 50 V2040D ISL9V2040D3S TO-252AA Tube N/A 75 V2040S ISL9V2040S3S TO-263AB Tube N/A 50 Electrical Characteristics TA = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off State Characteristics BVCER Collector to Emitter Breakdown Voltage IC = 2mA, VGE = 0, RG = 1KΩ, See Fig. 15 TJ = -40 to 150°C 370 400 430 V BVCES Collector to Emitter Breakdown Voltage IC = 10mA, VGE = 0, RG = 0, See Fig. 15 TJ = -40 to 150°C 390 420 450 V BVECS Emitter to Collector Breakdown Voltage IC = -75mA, VGE = 0V, TC = 25°C 30 - - V BVGES Gate to Emitter Breakdown Voltage IGES = ± 2mA Collector to Emitter Leakage Current VCER = 250V, RG = 1KΩ, See Fig. 11 ICER IECS Emitter to Collector Leakage Current R1 Series Gate Resistance R2 Gate to Emitter Resistance ±12 ±14 - V TC = 25°C - - 25 µA TC = 150°C - - 1 mA VEC = 24V, See TC = 25°C Fig. 11 TC = 150°C - - 1 mA - - 40 mA - 70 - Ω 10K - 26K Ω On State Characteristics VCE(SAT) Collector to Emitter Saturation Voltage IC = 6A, VGE = 4V TC = 25°C, See Fig. 3 - 1.45 1.9 V VCE(SAT) Collector to Emitter Saturation Voltage IC = 10A, VGE = 4.5V TC = 150°C See Fig. 4 - 1.95 2.3 V - 12 - nC TC = 25°C 1.3 - 2.2 V TC = 150°C 0.75 - 1.8 V - 3.4 - V Dynamic Characteristics QG(ON) Gate Charge IC = 10A, VCE = 12V, VGE = 5V, See Fig. 14 VGE(TH) Gate to Emitter Threshold Voltage IC = 1.0mA, VCE = VGE, See Fig. 10 VGEP Gate to Emitter Plateau Voltage IC = 10A, VCE = 12V Switching Characteristics td(ON)R triseR td(OFF)L tfL SCIS Current Turn-On Delay Time-Resistive Current Rise Time-Resistive Current Turn-Off Delay Time-Inductive Current Fall Time-Inductive Self Clamped Inductive Switching VCE = 14V, RL = 1Ω, VGE = 5V, RG = 1KΩ TJ = 25°C - 0.61 - µs - 2.17 - µs VCE = 300V, L = 500µHy, VGE = 5V, RG = 1KΩ TJ = 25°C, See Fig. 12 - 3.64 - µs - 2.36 - µs TJ = 25°C, L = 3.0mHy, RG = 1KΩ, VGE = 5V, See Fig. 1 & 2 - - 200 mJ TO-252, TO-263, TO-220 - - 1.15 °C/W Thermal Characteristics RθJC Thermal Resistance Junction-Case ©2004 Fairchild Semiconductor Corporation ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Package Marking and Ordering Information 20 ISCIS, INDUCTIVE SWITCHING CURRENT (A) ISCIS, INDUCTIVE SWITCHING CURRENT (A) 20 RG = 1KΩ, VGE = 5V,Vdd = 14V 18 16 14 TJ = 25°C 12 10 TJ = 150°C 8 6 4 2 SCIS Curves valid for Vclamp Voltages of <430V 0 0 20 40 60 80 100 120 140 160 180 16 14 TJ = 25°C 12 10 8 TJ = 150°C 6 4 2 0 200 RG = 1KΩ, VGE = 5V,Vdd = 14V 18 SCIS Curves valid for Vclamp Voltages of <430V 0 2 4 tCLP, TIME IN CLAMP (µS) VCE, COLLECTOR TO EMITTER VOLTAGE (V) VCE, COLLECTOR TO EMITTER VOLTAGE (V) ICE = 6A VGE = 3.7V VGE = 4.0V 1.45 1.40 VGE = 4.5V 1.35 VGE = 5.0V 1.30 VGE = 8.0V 1.25 -75 -25 25 75 125 2.4 ICE = 10A VGE = 4.0V 2.0 1.8 VGE = 4.5V 1.6 VGE = 8.0V 1.4 175 VGE = 3.7V 2.2 -75 TJ, JUNCTION TEMPERATURE (°C) 25 75 125 175 20 Figure 4. Collector to Emitter On-State Voltage vs Junction Temperature ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) -25 VGE = 5.0V TJ, JUNCTION TEMPERATURE (°C) Figure 3. Collector to Emitter On-State Voltage vs Junction Temperature VGE = 8.0V VGE = 5.0V VGE = 4.5V 15 10 Figure 2. Self Clamped Inductive Switching Current vs Inductance 1.60 1.50 8 L, INDUCTANCE (mHy) Figure 1. Self Clamped Inductive Switching Current vs Time in Clamp 1.55 6 VGE = 4.0V VGE = 3.7V 10 5 TJ = - 40°C 20 VGE = 8.0V VGE = 5.0V VGE = 4.5V 15 VGE = 4.0V VGE = 3.7V 10 5 TJ = 25°C 0 0 0 1.0 2.0 3.0 4.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 5. Collector to Emitter On-State Voltage vs Collector Current ©2004 Fairchild Semiconductor Corporation 0 1.0 2.0 3.0 4.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 6. Collector to Emitter On-State Voltage vs Collector Current ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Typical Performance Curves 30 VGE = 8.0V ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 20 VGE = 5.0V VGE = 4.5V 15 VGE = 4.0V VGE = 3.7V 10 5 TJ = 175°C 0 0 1.0 2.0 3.0 DUTY CYCLE < 0.5%, VCE = 5V PULSE DURATION = 250µs 25 20 15 10 TJ = 25°C 5 TJ = -40°C 0 4.0 TJ = 150°C 1.0 2.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 3.0 4.0 Figure 7. Collector to Emitter On-State Voltage vs Collector Current Figure 8. Transfer Characteristics 2.4 15.0 VCE = VGE VTH, THRESHOLD VOLTAGE (V) ICE, DC COLLECTOR CURRENT (A) VGE = 4.0V 12.5 10.0 7.5 5.0 2.5 0 5.0 VGE, GATE TO EMITTER VOLTAGE (V) ICE = 1mA 2.2 2.0 1.8 1.6 1.4 1.2 25 50 75 100 125 150 -50 175 -25 0 TC, CASE TEMPERATURE (°C) 25 50 75 100 125 150 175 TJ JUNCTION TEMPERATURE (°C) Figure 9. DC Collector Current vs Case Temperature Figure 10. Threshold Voltage vs Junction Temperature 10000 10 ICE = 6.5A, VGE = 5V, RG = 1KΩ 1000 Inductive tOFF SWITCHING TIME (µS) LEAKAGE CURRENT (µA) VECS = 24V 100 10 VCES = 300V 8 6 Resistive tOFF 4 1 Resistive tON VCES = 250V 0.1 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 11. Leakage Current vs Junction Temperature ©2004 Fairchild Semiconductor Corporation 175 2 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (°C) Figure 12. Switching Time vs Junction Temperature ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Typical Performance Curves (Continued) 8 1200 IG(REF) = 1mA, RL = 1.25Ω, TJ = 25°C VGE, GATE TO EMITTER VOLTAGE (V) FREQUENCY = 1 MHz C, CAPACITANCE (pF) 1000 800 CIES 600 400 CRES 200 COES 7 6 VCE = 12V 5 4 3 2 VCE = 6V 1 0 0 0 5 10 15 20 25 0 5 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 10 15 20 25 QG, GATE CHARGE (nC) Figure 13. Capacitance vs Collector to Emitter Voltage Figure 14. Gate Charge 415 BVCER, BREAKDOWN VOLTAGE (V) ICER = 10mA 410 TJ = - 40°C 405 400 395 TJ = 175°C 390 TJ = 25°C 385 380 375 370 10 100 1000 2000 3000 RG, SERIES GATE RESISTANCE (kΩ) ZthJC, NORMALIZED THERMAL RESPONSE Figure 15. Breakdown Voltage vs Series Gate Resistance 100 0.5 0.2 t1 0.1 10-1 PD 0.05 t2 0.02 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZθJC X RθJC) + TC 0.01 SINGLE PULSE 10-2 10-5 10-4 10-3 10-2 10-1 100 T1, RECTANGULAR PULSE DURATION (s) Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case ©2004 Fairchild Semiconductor Corporation ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Typical Performance Curves (Continued) L VCE R or L C PULSE GEN LOAD C RG RG = 1KΩ DUT G + DUT G VCE - 5V E E Figure 17. Inductive Switching Test Circuit Figure 18. tON and tOFF Switching Test Circuit BVCES VCE tP VCE L IAS VDD VARY tP TO OBTAIN REQUIRED PEAK IAS + RG VDD - VGE DUT tP 0V IAS 0 0.01Ω tAV Figure 19. Unclamped Energy Test Circuit ©2004 Fairchild Semiconductor Corporation Figure 20. Unclamped Energy Waveforms ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Test Circuit and Waveforms th JUNCTION REV 25 April 2002 ISL9V2040D3S, ISL9V2040S3S, ISL9V2040P3 CTHERM1 th 6 1.3e -2 CTHERM2 6 5 8.8e -4 CTHERM3 5 4 8.8e -3 CTHERM4 4 3 3.9e -1 CTHERM5 3 2 3.6e -1 CTHERM6 2 tl 1.9e -1 RTHERM1 CTHERM1 6 RTHERM1 th 6 1.2e -1 RTHERM2 6 5 3.2e -1 RTHERM3 5 4 1.7e -1 RTHERM4 4 3 1.2e -1 RTHERM5 3 2 1.3e -1 RTHERM6 2 tl 2.5e -1 RTHERM2 CTHERM2 5 SABER Thermal Model SABER thermal model ISL9V2040D3S, ISL9V2040S3S, ISL9V2040P3 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 6 = 1.3e -3 ctherm.ctherm2 6 5 = 8.8e -4 ctherm.ctherm3 5 4 = 8.8e -3 ctherm.ctherm4 4 3 = 3.9e -1 ctherm.ctherm5 3 2 = 3.6e -1 ctherm.ctherm6 2 tl = 1.9e -1 RTHERM3 CTHERM3 4 RTHERM4 CTHERM4 3 rtherm.rtherm1 th 6 = 1.2e -1 rtherm.rtherm2 6 5 = 3.2e -1 rtherm.rtherm3 5 4 = 1.7e -1 rtherm.rtherm4 4 3 = 1.2e -1 rtherm.rtherm5 3 2 = 1.3e -1 rtherm.rtherm6 2 tl = 2.5e -1 } RTHERM5 CTHERM5 2 CTHERM6 RTHERM6 tl ©2004 Fairchild Semiconductor Corporation CASE ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 Rev. B3, October 2004 ISL9V2040D3S / ISL9V2040S3S / ISL9V2040P3 SPICE Thermal Model TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST ActiveArray™ FASTr™ Bottomless™ FPS™ CoolFET™ FRFET™ CROSSVOLT™ GlobalOptoisolator™ DOME™ GTO™ EcoSPARK™ HiSeC™ E2CMOS™ I2C™ EnSigna™ i-Lo™ FACT™ ImpliedDisconnect™ FACT Quiet Series™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC Across the board. Around the world.™ OPTOPLANAR™ PACMAN™ The Power Franchise POP™ Programmable Active Droop™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I13