CYPRESS CY23FS08OXI-04T

CY23FS08-04
FailSafe™ 1.8V Zero Delay Buffer
Features
Functional Description
■
Internal DCXO for continuous glitch free operation
■
Zero input-output propagation delay
■
Low output cycle-to-cycle jitter (<46 ps RMS)
■
Low output-output skew (<200 ps)
The CY23FS08-04 is a FailSafe Zero Delay Buffer with two
reference clock inputs and eight phase aligned outputs. The
device provides an optimum solution for applications where
continuous operation is required in the event of a primary clock
failure.
■
3.84 MHz reference input
■
Supports industry standard input crystals
■
Up to 133 MHz (industrial) outputs
■
Phase-locked loop (PLL) bypass mode
■
Dual reference inputs
■
28-pin SSOP
■
1.8V output power supplies
■
3.3V core power supply
■
Industrial temperature
Continuous, glitch free operation is achieved by using a DCXO
that serves as a redundant clock source in the event of a
reference clock failure by maintaining the last frequency and
phase information of the reference clock.
The unique feature of the CY23FS08-04 is that the DCXO is in
fact, the primary clocking source, that is synchronized (phase
aligned) to the external reference clock. When this external clock
is restored, the DCXO automatically resynchronizes to the
external clock.
The frequency of the crystal that is connected to the DCXO is
chosen as an integer factor of the frequency of the reference
clock. This factor is set by four select lines: S[4:1]. For more
information, see Table 2 on page 3. The CY23FS08-04 has three
split power supplies; one for core, another for Bank A outputs,
and the third for Bank B outputs. Each output power supply,
except VDDC is connected to 1.8V. VDDC is the power supply
pin for internal circuits and is connected to 3.3V.
Logic Block Diagram
XIN XOUT
REFSEL
DCXO
REF1
4
FailsafeTM
Block
REF2
PLL
4
CLKA[1:4]
CLKB[1:4]
FBK
Decoder
FAIL# /SAFE
S[4:1]
4
Cypress Semiconductor Corporation
Document Number: 001-17042 Rev. **
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 20, 2007
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CY23FS08-04
Pinouts
REF1
REF2
VSSB
CLKB1
CLKB2
S2
S3
VDDB
VSSB
CLKB3
CLKB4
VDDB
VDDC
XIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CY23FS08 - 04
Figure 1. Pin Diagram - 28 Pin SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
REFSEL
FBK
VSSA
CLKA1
CLKA2
S1
S4
VDDA
VSSA
CLKA3
CLKA4
VDDA
FAIL#/SAFE
XOUT
28-pin SSOP
Table 1. Pin Definition - 28 Pin SSOP
Pin Number
Pin Name
Description
[3].
1,2
REF1,REF2
5V Tolerant. Reference clock inputs
4,5,10,11
CLKB[1:4]
Bank B Clock Outputs.[1] CLKB3 and CLKB4 are differential signals when terminated as
shown in Figure 8 on page 6. CLKB3 is negtive output, CLKB4 is positive output.
25,24,19,18
CLKA[1:4]
Bank A Clock Outputs.[1]
27
FBK
No Connect, Internal Feedback.
23,6,7,22
S[1:4]
Frequency Select Pins.[2]
14
XIN
Reference Crystal Input.
15
XOUT
Reference Crystal Output.
16
FAIL#/SAFE
Valid Reference Indicator. A high level indicates a valid reference input.
13
VDDC
3.3V Power Supply for the Internal Circuitry.
8,12
VDDB
1.8V Power Supply for Bank B Outputs.
3,9
VSSB
Ground.
17,21
VDDA
1.8V Power Supply for Bank A Outputs.
20,26
VSSA
Ground.
28
REFSEL
Reference Select. Selects the active reference clock from either REF1 or REF2.
REFSEL = 1, REF1 is selected, REFSEL = 0, REF2 is selected.[3]
Notes
1. Weak pull downs on all outputs.
2. Weak pull ups on these inputs.
3. Weak pull downs on these inputs.
Document Number: 001-17042 Rev. **
Page 2 of 11
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CY23FS08-04
Table 2. Configuration Table
S[4:1]
XTAL (MHz)
REF(MHz)
OUT/REF Ratio
Xtal/REF
Ratio CLKA1 CLKA2 CLKA3 CLKA4 CLKB1 CLKB2 CLKB3 CLKB4
Min
Max
Min
Max
0000
15.36
16.384
3.84
4.096
4
32
32
0001
15.36
16.384
3.84
4.096
4
Off
Off
0010
15.36
16.384
3.84
4.096
4
Off
Off
0011
15.36
16.384
3.84
4.096
4
Off
Off
16
16
0100
15.36
16.384
3.84
4.096
4
Off
Off
Off
Off
32
32
32
32
32
32
32
32
32
32
32
32
Off
Off
32
32
32
32
32
32
32
32
Off
Off
32
32
0101
15.36
16.384
3.84
4.096
4
8
8
16
16
32
32
32
32
0110
15.36
16.384
3.84
4.096
4
8
8
8
8
16
16
16
16
0111
15.36
16.384
3.84
4.096
4
1
1
10
10
20
20
20
20
1xxx
-
-
-
-
-
Off
Off
Off
Off
Off
Off
Off
Off
FailSafe Function
The CY23FS08-04 is targeted at clock distribution applications
that can or currently require continued operation, if the main
reference clock fail. Existing approaches to this requirement
have used multiple reference clocks with either internal or
external methods for switching between references. The
problem with this technique is that it leads to interruptions (or
glitches) when transitioning from one reference to another. This
often requires complex external circuitry or software to maintain
system stability. The technique implemented in this design
completely eliminates any switching of references to the PLL that
greatly simplifies the system design.
The CY23FS08-04 PLL is driven by the crystal oscillator that is
phase aligned to an external reference clock. It is aligned in a
way that the output of the device is effectively phase aligned to
reference via the external feedback loop. This is accomplished
by using a digitally controlled capacitor array to pull the crystal
frequency over an approximate range of ±100 ppm from its
nominal frequency.
In this mode, if the reference frequency fails (that is, stop or
disappear), the DCXO maintains its last setting. Then a flag
signal (FAIL#/SAFE) is set to indicate failure of the reference
clock.
The CY23FS08-04 provides four select bits, S1 through S4 to
control the reference to crystal frequency ratio. The DCXO is
internally tuned to the phase and frequency of the external
reference only when the reference frequency divided by this ratio
is within the DCXO capture range. If the frequency is out of
range, a flag is set on the FAIL#/SAFE pin notifying the system
that the selected reference is not valid. If the reference moves in
range, then the flag is cleared indicating the system that the
selected reference is valid.
Figure 2. Fail#/safe timing for input reference failing catastrophically
Missing REF
Detected
Valid REF but not
Phase Aligned
Phase Aligned
REF
Feedback(Internal)
=CLKOUT * 1/32
Keeping Frequency for all
CLKOUTs
FAIL#/SAFE
Trying to align phase between
REF and Feedback
tFSL
tFSH
Figure 3. Fail#/safe Timing formula
tFSL(max)
= tREF
+
25ns
t FSH(min) = tREF + 25ns
Document Number: 001-17042 Rev. **
Page 3 of 11
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CY23FS08-04
Table 3. FailSafe Timing Table
Parameter
Description
Conditions
Min
tFSL
Fail#/Safe Assert Delay
Measured at 80% to 20%, Load = 15 pF
tFSH
Fail#/Safe Deassert Delay
Measured at 80% to 20%, Load = 15 pF
Max
See Figure 3
See Figure 3
Unit
ns
ns
DCXO and capture range
Failsafe has DCXO for tracking to incoming reference clock. The CY23FS08-04 is configured its capture range of approx +/- 100ppm
with using pullable crystal that specified in Table 7.
Figure 4. FailSafe Timing Diagram: Input Reference Slowly Drifting Out of FailSafe Capture Range
Reference + 100 ppm
Reference
Reference - 100 ppm
Frequency
Reference Off
Output + 100 ppm
Output
Output - 100 ppm
Volt
Fail#/Safe
tFSH
tFSL
Document Number: 001-17042 Rev. **
Time
Page 4 of 11
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CY23FS08-04
Figure 5. FailSafe Reference Switching Behavior
Failsafe typical frequency settling time
OUTPUT FREQUENCY DELTA (ppm)
Initial valid Ref1 = 20 MHz +100 ppm,
then switching to REF2 = 20 MHz
150
100
50
0
0
0.45
1.3
2.5
SETTLING TIME (ms)
Figure 6. FailSafe Effective Loop Bandwidth (Min)
Document Number: 001-17042 Rev. **
Page 5 of 11
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CY23FS08-04
Figure 7. Sample Timing of Muxing Between Two Reference Clocks 180°C Out of Phase and Resulting Output Phase Offset
Typical Settling Time (105 MHz)
REF1
REF2
REFSEL
0 ms
0 d eg
-1 8 0 d e g
0 ms
1 .4 m s
Figure 8. Output Termination for Differential Output and Measurement Setup for Single-Ended Outputs
R UP
RS
TP
CLKB3
D if f e r e n t ia l
D R IV E R
V D D (1 .8 V )
R DN
R UP
RS
CLKB4
TP
R DN
D if f e r e n t ia l O u t p u t T e r m in a t io n N e t w o r k f o r C L K B 3 a n d C L K B 4
Document Number: 001-17042 Rev. **
M e a s u r e m e n t p o in t f o r
s in g le - e n d e d c lo c k s
Page 6 of 11
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CY23FS08-04
Figure 9. Waveforms for Timing Parameters
D u ty C y c le - t D C
V D D /2
V D D /2
V D D /2
V DD
0V
t1
t2
S le w R a te - t (S R )
80%
V DD
80%
20%
20%
0V
t S R (O )
t S R (O )
O u tp u t-O u tp u t S k e w - t S K (O )
V D D /2
V D D /2
t S K (O )
P a rt to P a rt S k e w - t S K (P P )
FBK,
P a rt 1
V D D /2
FBK,
P a rt 2
V D D /2
t S K (P P )
S ta tic P h a s e O ffs e t - t (φ )
REF
V D D /2
FBK
V D D /2
t (φ )
Document Number: 001-17042 Rev. **
Page 7 of 11
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CY23FS08-04
Absolute Maximum Conditions
Parameter
Description
Condition
Min
Max
Unit
VDD
Supply Voltage
–0.5
4.6
V
VIN
Input Voltage
Relative to VSS
–0.5
VDD+0.5
VDC
TS
Temperature, Storage
Non-functional
–65
+150
°C
TA
Temperature, Operating Ambient
Industrial Grade
–40
85
°C
125
°C
TJ
Temperature, Junction
Functional
ESDHBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
2000
V
ØJC
Dissipation, Junction to Case
Mil-Specification 883E Method 1012.1
36.17
°C/W
ØJA
Dissipation, Junction to Ambient
JEDEC (JESD 51)
100.6
°C/W
UL–94
Flammability Rating
At 1/8 in.
MSL
Moisture Sensitivity Level
V–0
1
Multiple Supplies: The voltage on any input or IO pin cannot exceed the power pin during power up. Power supply sequencing is NOT required.
Table 4. Operating Conditions for FailSafe Industrial Temperature Devices
Parameter
Description
Min
Max
Unit
VDDC
3.3V Supply Voltage
3.135
3.465
V
VDDA, VDDB
1.8V Supply Voltage Range
1.70
1.90
V
TA
Ambient Operating Temperature, Industrial
–40
85
°C
CL
Output Load Capacitance
15
pF
CIN
Input Capacitance (Except XIN)
CXIN
Crystal Input Capacitance (All internal caps off)
TPU
Power Up Time for all VDDs to Reach Minimum Specified Voltage (Power ramps
are monotonic)
7
pF
10
13
pF
0.05
500
ms
Table 5. Electrical Characteristics for FailSafe Industrial Temperature Devices
Parameter
Description
Test Conditions
VIL
Input Low Voltage
VIH
Input High Voltage
CMOS Levels, 70% of VDD
IIL
Input Low Current
VIN = VSS (100k pull up only)
IIH
Input High Current
VIN = VDD (100k pull down only)
IOL
Output Low Current
VOL = 0.5V, VDD = 1.8V
Min
CMOS Levels, 30% of VDD
Typ
Max
Unit
0.3xVDD
V
50
µA
0.7xVDD
V
50
10
µA
mA
IOH
Output High Current
VOH = VDD – 0.5V, VDD = 1.8V
10
mA
IDD
Dynamic Current
VDDA, VDDB, and VDDC are all at the maximum values,
IOUT = 0mA, output frequency = maximum
75
mA
IDDQ
Quiescent Current
All inputs are grounded, PLL and DCXO are in bypass
mode, Reference input = 0
250
µA
Document Number: 001-17042 Rev. **
Page 8 of 11
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CY23FS08-04
Table 6. Switching Characteristics for FailSafe Industrial Temperature Devices
Parameter [5]
Description
Test Conditions
Min
Typ
Max
Unit
fREF
Reference Frequency
Industrial Grade
1.0
–
4.1
MHz
fOUT
Output Frequency
15 pF Load
1.0
–
133
MHz
fXIN
DCXO Frequency
15
–
25
MHz
tDC
Duty Cycle
Measured at VDD/2
40
–
60
%
tSR(I)
Input Slew Rate
Measured on REF1 Input, 30% to 70% of VDD
0.5
–
4.0
V/ns
tSR(O)
Output Slew Rate
Measured from 20% to 80% of VDD = 1.8V, 15 pF Load
0.3
–
3.0
V/ns
tSK(O)
Output to Output Skew
All outputs equally loaded, measured at VDD/2
–
110
200
ps
tSK(IB)
Intrabank Skew
All outputs equally loaded, measured at VDD/2
–
–
75
ps
t(φ)[4]
Static Phase Offset
Measured at VDD/2
–
–
250
ps
tD(φ)[4]
Dynamic Phase Offset
Measured at VDD/2
–
150
200
ps
tJ(CC)
Cycle-to-Cycle Jitter
Load = 15 pF, fOUT ≥ 6.25 MHz
–
200
250
ps
–
18
46
psRMS
Min
Typ
Max
Unit
Table 7. Pullable Crystal Specifications
Parameter
Description
CR load
Crystal Load Capacitance
16
C0 / C1
C0 / C1 Ratio
240
ESR
Equivalent Series Resistance
pF
50
Ω
Notes
4. The t(φ) reference feedback input delay is guaranteed for a maximum 4:1 input edge ratio between the two signals as long as tSR(I) is maintained.
5. Parameters are guaranteed by design and characterization. Not 100% tested in production.
Document Number: 001-17042 Rev. **
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CY23FS08-04
Ordering Information
Part Number
Package Type
Product Flow
Pb-Free
CY23FS08OXI-04
28-pin SSOP
Industrial, –40°C to 85°C
CY23FS08OXI-04T
28-pin SSOP – Tape and Reel
Industrial, –40°C to 85°C
Package Drawing and Dimensions
Figure 10. 28-Pin (5.3 mm) Shrunk Small Outline Package O28
51-85079-*C
Document Number: 001-17042 Rev. **
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CY23FS08-04
Document History Page
Document Title: CY23FS08-04 FailSafe™ 1.8V Zero Delay Buffer
Document Number: 001-17042
REV.
ECN NO.
Issue
Date
**
1493204
See ECN
Orig. of
Change
Description of Change
XHT/WWZ/ New data sheet
AESA
© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any
circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,
life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-17042 Rev. **
Revised September 20, 2007
Page 11 of 11
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered
trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. FailSafe is a trademark of Cypress
Semiconductor. All product and company names mentioned in this document are the trademarks of their respective holders. All products and company names mentioned in this document may be the
trademarks of their respective holders.
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