VSMY3850 Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES • • • • • • • • • • • • 94 8553 DESCRIPTION VSMY3850 is an infrared, 850 nm emitting diode based on surface emitter technology with high radiant intensity, high optical power and high speed, molded in a PLCC-2 package for surface mounting (SMD). Package type: surface mount Package form: PLCC-2 Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 Peak wavelength: λp = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity: ϕ = ± 60° Suitable for high pulse current operation Floor life: 168 h, MSL 3, acc. J-STD-020 Lead (Pb)-free reflow soldering Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC APPLICATIONS • Infrared radiation source for operation with CMOS cameras (illumination) • High speed IR data transmission • IR touch panels • 3D TV • Light curtain PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) 17 ± 60 850 10 VSMY3850 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY3850-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMY3850-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity ** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902 Document Number: 83399 Rev. 1.0, 22-Dec-10 For technical questions, contact: [email protected] www.vishay.com 1 VSMY3850 Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage VR 5 V Forward current IF 100 mA mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 Surge forward current tp = 100 μs IFSM 1 A PV 190 mW °C Power dissipation Junction temperature Tj 100 Operating temperature range Tamb - 40 to + 85 °C Storage temperature range Tstg - 40 to + 100 °C acc. figure 7, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W Soldering temperature Thermal resistance junction/ambient 120 200 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 160 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 21890 10 20 30 40 50 60 70 80 0 90 100 Tamb - Ambient Temperature (°C) 10 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21891 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL TYP. MAX. IF = 100 mA, tp = 20 ms VF 1.6 1.9 IF = 1 A, tp = 100 μs VF 2.9 Radiant intensity UNIT V V IF = 1 mA TKVF - 1.45 mV/K IF = 10 mA TKVF - 1.2 mV/K IR not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 Cj 125 pF IF = 100 mA, tp = 20 ms Ie IF = 1 A, tp = 100 μs Ie Reverse current Junction capacitance MIN. 12 17 25 150 mW/sr mW/sr IF = 100 mA, tp = 20 ms φe 55 mW IF = 100 mA TKφe - 0.35 %/K Peak wavelength IF = 100 mA λp Spectral bandwidth IF = 30 mA Δλ 30 nm Temperature coefficient of λp IF = 100 mA TKλp 0.25 nm/K Rise time IF = 100 mA tr 10 ns Fall time IF = 100 mA tf 10 ns d 0.44 mm Radiant power Temperature coefficient of φe ϕ Angle of half intensity Virtual source diameter www.vishay.com 2 ± 60 840 For technical questions, contact: [email protected] 850 deg 870 nm Document Number: 83399 Rev. 1.0, 22-Dec-10 VSMY3850 High Speed Infrared Emitting Diode, Vishay Semiconductors 850 nm, Surface Emitter Technology BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 0° 10 20° Ie, rel - Relative Radiant Intensity 1 0.1 0.01 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement 30° tp = 100 µs IF - Forward Current (A) 10° 80° 0.001 0 0.5 1 1.5 2 2.5 3 0.6 0.4 0.2 0 94 8013 VF - Forward Voltage (V) 21892 Fig. 3 - Forward Current vs. Forward Voltage Fig. 6 - Relative Radiant Intensity vs. Angular Displacement 1000 Ie - Radiant Intensity (mW/sr) tp = 100 µs 100 10 1 0.1 0.001 0.01 0.1 1 IF - Forward Pulse Current (A) 21893 Fig. 4 - Radiant Intensity vs. Forward Current Φe, rel - Relative Radiant Power 1 IF = 30 mA 0.75 0.5 0.25 0 650 21776-1 750 850 950 λ - Wavelength (nm) Fig. 5 - Relative Radiant Power vs. Wavelength Document Number: 83399 Rev. 1.0, 22-Dec-10 For technical questions, contact: [email protected] www.vishay.com 3 VSMY3850 Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology PACKAGE DIMENSIONS in millimeters technical drawings according to DIN specifications 0.9 1.75 ± 0.1 3.5 ± 0.2 Mounting Pad Layout Pin identification 4 C area covered with solder resist 2.6 (2.8) A 2.2 2.8 ± 0.15 1.2 4 1.6 (1.9) Ø 2.4 3 + 0.15 Drawing-No.: 6.541-5067.02-4 Issue: 4; 19.07.10 20767 DRYPACK SOLDER PROFILE Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 200 250 FLOOR LIFE 300 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. www.vishay.com 4 For technical questions, contact: [email protected] Document Number: 83399 Rev. 1.0, 22-Dec-10 VSMY3850 High Speed Infrared Emitting Diode, Vishay Semiconductors 850 nm, Surface Emitter Technology Adhesive tape 10.0 9.0 120° 4.5 3.5 Blister tape 2.5 1.5 Component cavity Identification Label: Vishay type group tape code production code quantity 94 8670 Fig. 8 - Blister Tape 3.5 3.1 2.2 2.0 13.00 12.75 63.5 60.5 14.4 max. 180 178 94 8665 Fig. 11 - Dimensions of Reel-GS08 5.75 5.25 3.6 3.4 4.0 3.6 8.3 7.7 10.4 8.4 120° 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 4.5 3.5 0.25 2.05 1.95 2.5 1.5 94 8668 Fig. 9 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 321 329 14.4 max. 18857 Fig. 12 - Dimensions of Reel-GS18 De-reeling direction 94 8158 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 10 - Beginning and End of Reel The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. Document Number: 83399 Rev. 1.0, 22-Dec-10 For technical questions, contact: [email protected] www.vishay.com 5 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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