VISHAY SI3499DV

Si3499DV
New Product
Vishay Siliconix
P-Channel 1.5-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
−8
rDS(on) (W)
ID (A)
0.023 @ VGS = −4.5 V
−7
0.029 @ VGS = −2.5 V
−6.2
0.036 @ VGS = −1.8 V
−5.2
0.048 @ VGS = −1.5 V
−5.0
D TrenchFETr Power MOSFET: 1.5-V Rated
D Ultra-Low On-Resistance
D 100% Rg Tested
Qg (Typ)
APPLICATIONS
D Load Switch for Portable Devices
28
TSOP-6
Top View
3 mm
1
6
2
5
3
4
(4) S
(3) G
(1, 2, 5, 6) D
2.85 mm
P-Channel MOSFET
Ordering Information: Si3499DV-T1—E3
Marking Code:
B3xxx
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
−8
Gate-Source Voltage
VGS
"5
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 85_C
Pulsed Drain Current
ID
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
TA = 85_C
Operating Junction and Storage Temperature Range
PD
V
−7
−5.3
−3.6
−3.9
IDM
−20
−1.7
−0.9
2.0
1.1
1.0
0.6
TJ, Tstg
Unit
−55 to 150
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Symbol
t v 5 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
45
62.5
90
110
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 73138
Pending—Rev. A, 18-Oct-04
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Si3499DV
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = −250 mA
−0.35
Typ
Max
Unit
−0.75
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
VDS = 0 V, VGS = "5 V
−1
−10
VDS = −5 V, VGS = −4.5 V
rDS(on)
DS( )
−20
mA
A
VGS = −4.5 V, ID = −7 A
0.019
0.023
VGS = −2.5 V, ID = −6.2 A
0.024
0.029
VGS = −1.8 V, ID = −5.2 A
0.028
0.036
0.048
VGS = −1.5 V, ID = −3 A
0.035
gfs
VDS = −5 V, ID = −7 A
28
VSD
IS = −1.7 A, VGS = 0 V
−0.63
−1.1
28
42
VDS = −4 V,, VGS = −4.5 V,, ID = −7 A
2.9
Forward Transconductancea
Diode Forward Voltagea
VDS = −8 V, VGS = 0 V
VDS = −8 V, VGS = 0 V, TJ = 85_C
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
4
td(on)
Rise Time
tr
Turn-Off Delay Time
VDD = −4 V, RL = 4 W
ID ^ −1 A, VGEN = −4.5 V, Rg = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
5.8
IF = −1.7 A, di/dt = 100 A/ms
8.5
13
27
40
65
100
210
315
110
165
40
70
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 5 thru 2 V
25
I D − Drain Current (A)
I D − Drain Current (A)
25
20
1.5 V
15
10
5
20
15
10
TC = 125_C
5
25_C
1V
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
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2
5
0
0.0
−55_C
0.4
0.8
1.2
1.6
2.0
VGS − Gate-to-Source Voltage (V)
Document Number: 73138
Pending—Rev. A, 18-Oct-04
Si3499DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
3500
3000
0.08
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
0.10
0.06
VGS = 1.5 V
0.04
VGS = 1.8 V
VGS = 2.5 V
Ciss
2500
2000
1500
Coss
1000
0.02
Crss
500
VGS = 4.5 V
0.00
0
0
5
10
15
20
25
30
0
1
2
ID − Drain Current (A)
Gate Charge
5
6
7
8
On-Resistance vs. Junction Temperature
1.6
VDS = 4 V
ID = 7 A
5
VGS = 4.5 V
ID = 7 A
1.4
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
4
VDS − Drain-to-Source Voltage (V)
6
4
3
2
1.2
1.0
0.8
1
0
0
6
12
18
24
30
0.6
−50
36
−25
0
Qg − Total Gate Charge (nC)
10
0.08
0.1
0.0
r DS(on) − On-Resistance ( W )
0.10
TJ = 150_C
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
30
TJ = 25_C
1
25
TJ − Junction Temperature (_C)
Source-Drain Diode Forward Voltage
I S − Source Current (A)
3
ID = 7 A
0.06
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD − Source-to-Drain Voltage (V)
Document Number: 73138
Pending—Rev. A, 18-Oct-04
1.2
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
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Si3499DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
40
32
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
24
TA = 25_C
16
0.0
8
−0.1
−0.2
−50
−25
0
25
50
75
100
125
0
10−2
150
10−1
TJ − Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
*rDS(on) Limited
IDM Limited
I D − Drain Current (A)
10
1 mS
10 mS
1
0.1
0.01
0.1
100 mS
TC = 25_C
Single Pulse
1S
10 S
dc
BVDSS Limited
1
10
VDS − Drain-to-Source Voltage (V)
*VGS u minimum VGS at which rDS(on) is specified
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
ID(on)
Limited
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 360_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 73138
Pending—Rev. A, 18-Oct-04
Si3499DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?73138.
Document Number: 73138
Pending—Rev. A, 18-Oct-04
www.vishay.com
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Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
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