WEITRON WTC2302_09

WTC2302
N-Channel Enhancement
Mode Power MOSFET
DRAIN CURRENT
2.3 AMPERES
3 DRAIN
P b Lead(Pb)-Free
DRAIN SOUCE VOLTAGE
20 VOLTAGE
1
GATE
2
Features:
SOURCE
3
*Super High Dense Cell Design For Low R DS(ON)
R DS(ON) <60m Ω@VGS =4.5V
*Rugged and Reliable
*Simple Drive Requirement
*SOT-23 Package
Maximum Ratings(TA=25℃
1
2
SOT-23
Unless Otherwise Specified)
Rating
Symbol
Value
Drain-Source Voltage
V DS
20
Gate-Source Voltage
VG S
±8
ID
2.3
A
Pulsed Drain Current 1, 2
IDM
8
A
Total Power Dissipation (TA =25°C )
PD
0.9
W
R θJA
145
°C /W
-55~+150
°C
Continuous Drain Current 3
(T A
Maximum Junction-ambient 3
Operating Junction and Storage Temperature Range
T J , T s tg
Unit
V
Device Marking
WTC2302 = N02
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Rev.B 24-Aug-09
WTC2302
Electrical Characteristics (TA = 25℃
Unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
V(BR)DSS
20
-
-
Unit
Static
Drain-Source Breakdown Voltage
VGS=0,ID=-10μA
V
Gate-Source Threshold Voltage
VDS=VGS,ID=250μA
Gate-Source Leakage Current
VGS= ±8V
Drain-Source Leakage Current(Tj=25℃)
VDS=9.6V,VGS=0
VGS(Th)
0.6
-
1.2
IGSS
-
-
±100
nA
IDSS
-
-
-1
μA
-
40
50
60
115
mΩ
gfs
-
6.5
-
S
Ciss
-
427.12
-
Coss
-
80.56
-
Crss
-
57
-
Drain-Source On-Resistance
RDS(on)
VGS=4.5V,ID=2.8A
VGS=2.5V,ID=2.0A
Forward Transconductance
VDS=5V,ID=4.0A
Dynamic
Input Capacitance
VGS=0V,VDS=6V,f=1.0MHz
Output Capacitance
VGS=0V,VDS=6V,f=1.0MHz
Reverse Transfer Capacitance
VGS=0V,VDS=6V,f=1.0MHz
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pF
Rev.B 24-Aug-09
WTC2302
Switching
Turn-on Delay Time2
td(on)
-
6.16
-
Rise Time
VDD=6V,VGEN =4.5V,I D =1.0A,RL =6Ω,RG=6Ω
tr
-
7.56
-
Turn-off Delay Time
VDD=6V,VGEN =4.5V,I D =1.0A,RL =6Ω,RG=6Ω
td (off)
-
16.61
-
Fall Time
VDD=6V,VGEN =4.5V,I D =1.0A,RL =6Ω,RG=6Ω
tf
-
4.07
-
Qg
-
3.69
-
Gate-Source Charge
VDS=6V,VGS=4.5V,ID=2.8A
Qgs
-
0.7
-
Gate-Drain Change
VDS=6V,VGS=4.5V,ID=2.8A
Qgd
-
1.06
-
VSD
-
-
1.2
V
IS
-
-
1.6
A
VDD=6V,VGEN =4.5V,I D =1.0A,RL =6Ω,RG=6Ω
ns
Total Gate Charge2
VDS=6V,VGS=4.5V,ID=2.8A
nC
Source-Drain Diode Characteristics
Forward On Voltage2
VGS=0V,IS=-1.6A
Continuous Source Current(Body Diode)
Note: 1. Pulse width limited by Max, junction temperature.
2. pulse width≦300μs, duty cycle≦2%.
3. Surface mounted on 1 in2 copper pad of FR4 board; 270℃/W when mounted on min, copper pad.
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Rev.B 24-Aug-09
WTC2302
TYPICAL ELECTRICAL CHARACTERISTICS
20
Vds=5V
14
Id , DRA IN CU RR EN T(A )
Id DR AIN C URR EN T( A)
16
25°C
12
10
8
6
4
2
0
18
25°C
14
12
Vgs=2V
10
8
6
Vgs=1.5V
4
2
0
0
0.5
1
1.5
2
Vg s, G ATE -T O- SOU RC E VOL TA GE (V)
2.5
0
0.5
Figure 1. Transfer Characteristics
500
450
400
350
300
250
200
150
100
50
0
1
1.5
2
2.5
3
3.5
4
Vd s, DR AIN -T O- SOU RC E V OL TA GE( V)
4.5
5
Figure 2. On–Region Characteristics
350
Rds-On-Resistance(mR)
rDS(on)-On-Resistance(mR)
Vgs=2.5V
16
VGS=1.8V
VGS=2.5V
VGS=4.5V
0
1
2
3
4
5
ID-Drain Current(A)
6
7
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250
200
150
ID=3.5A
100
50
0
8
0
1
2
3
4
5
6
7
8
Vgs-Gate-to-Source Voltage(V)
Figure 3. On–Resistance versus Drain Current
WEITRON
300
Figure 4. On-Resistance vs. Gate-to-Source Voltage
4/6
Rev.B 24-Aug-08
WTC2302
TYPICAL ELECTRICAL CHARACTERISTICS
700
10
600
Capacita nce
12
Vgs(V)
8
6
4
2
Ciss
500
400
300
Coss
200
Crss
100
0
0
0
2
4
6
Qgs(nC)
8
10
0
12
1
2
4
5
6
Figure 6. Capacitance
Figure 5. Gate Charge
70
1.2
60
1
ID=250uA
50
40
Vgs(th)(V)
Rds(on)(mR)
3
Vd s
VGS=4.5V ID=2A
30
20
0.8
0.6
0.4
0.2
10
0
-50
0
-50
0
50
Temp(ºC)
100
150
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50
Temp(ºC)
100
150
Figure 8. Vth Vs.Junction Temperature
Figure 7. On-Resistance Vs.Junction Temperature
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Rev.B 24-Aug-09
WTC2302
SOT-23 Outline Dimension
SOT-23
A
B
TOP VIEW
Dim
A
B
C
D
E
G
H
J
K
L
M
C
D
E
G
H
K
J
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M
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Min
0.35
1.19
2.10
0.85
0.46
1.70
2.70
0.01
0.89
0.30
0.076
Max
0.51
1.40
3.00
1.05
1.00
2.10
3.10
0.13
1.10
0.61
0.25
Rev.B 24-Aug-09