FAIRCHILD FGH75T65UPD

FGH75T65UPD
650V, 75A Field Stop Trench IGBT
Features
General Description
175oC
• Maximum Junction Temperature : TJ =
Using Novel Field Stop Trench IGBT Technology, Fairchild’s
new series of Field Stop Trench IGBTs offer the optimum performance for Solar Inverter , UPS and Digital Power Generator
where low conduction and switching losses are essential.
• Positive Temperaure Co-efficient for easy parallel operating
• High current capability
• Low saturation voltage: VCE(sat) = 1.65V(Typ.) @ IC = 75A
• High input impedance
• Tightened Parameter Distribution
Applications
• RoHS compliant
• Short Circuit Ruggedness > 5us @25oC
E
• Solar Inverter, UPS, Digital Power Generator
C
C
G
G
COLLECTOR
(FLANGE)
E
Absolute Maximum Ratings
Symbol
Description
VCES
Collector to Emitter Voltage
VGES
Gate to Emitter Voltage
IC
ICM (1)
IF
IFM(1)
Collector Current
@ TC = 25oC
Collector Current
@ TC = 100oC
Pulsed Collector Current
o
Ratings
Units
650
V
± 20
V
150
A
75
A
225
A
Diode Forward Current
@ TC = 25 C
75
A
Diode Forward Current
@ TC = 100oC
50
A
225
A
Maximum Power Dissipation
@ TC = 25oC
375
W
Maximum Power Dissipation
@ TC = 100oC
187
W
SCWT
Short Circuit Withstand Time
@ TC = 25oC
5
us
TJ
Operating Junction Temperature
PD
Pulsed Diode Maximum Forward Current
Tstg
Storage Temperature Range
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
-55 to +175
o
-55 to +175
oC
o
300
C
C
Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Units
RθJC(IGBT)
Thermal Resistance, Junction to Case
-
0.40
o
RθJC(Diode)
Thermal Resistance, Junction to Case
-
0.86
oC/W
RθJA
Thermal Resistance, Junction to Ambient
-
40
©2012 Fairchild Semiconductor Corporation
FGH75T65UPD Rev. C0
1
o
C/W
C/W
www.fairchildsemi.com
FGH75T65UPD 650V 75A Field Stop IGBT
August 2012
Device Marking
Device
Package
FGH75T65UPD
FGH75T65UPD
TO-247
Eco Status
Pacing Type
Qty per Tube
-
30ea
-
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage
VGE = 0V, IC = 1mA
650
-
-
V
∆BVCES
∆TJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 1mA
-
0.65
-
V/oC
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
250
µA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
4.0
6.0
7.5
V
On Characteristics
VGE(th)
G-E Threshold Voltage
IC = 75mA, VCE = VGE
IC = 75A, VGE = 15V
-
1.65
2.3
V
VCE(sat)
Collector to Emitter Saturation Voltage
IC = 75A, VGE = 15V,
TC = 175oC
-
2.05
-
V
-
5665
-
pF
-
205
-
pF
-
100
-
pF
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
Switching Characteristics
td(on)
Turn-On Delay Time
-
32
42
ns
tr
Rise Time
-
43
56
ns
td(off)
Turn-Off Delay Time
-
166
216
ns
tf
Fall Time
-
24
33
ns
Eon
Turn-On Switching Loss
-
2.85
3.68
mJ
Eoff
Turn-Off Switching Loss
-
1.20
1.60
mJ
VCC = 400V, IC = 75A,
RG = 3Ω, VGE = 15V,
Inductive Load, TC = 25oC
Ets
Total Switching Loss
-
4.05
5.3
mJ
td(on)
Turn-On Delay Time
-
30
-
ns
tr
Rise Time
-
57
-
ns
td(off)
Turn-Off Delay Time
-
176
-
ns
tf
Fall Time
-
21
-
ns
Eon
Turn-On Switching Loss
-
4.45
-
mJ
Eoff
Turn-Off Switching Loss
-
1.60
-
mJ
Ets
Total Switching Loss
-
6.05
-
mJ
Tsc
Short Circuit Withstand Time
5
-
-
us
FGH75T65UPD Rev. C0
VCC = 400V, IC = 75A,
RG = 3Ω, VGE = 15V,
Inductive Load, TC = 175oC
VGE = 15V, VCC < 400V,
Rg = 10 Ω
2
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FGH75T65UPD 650V 75A Field Stop IGBT
Package Marking and Ordering Information
Symbol
Qg
Parameter
(Continued)
Test Conditions
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCE = 400V, IC = 75A,
VGE = 15V
Electrical Characteristics of the Diode
Symbol
Parameter
Min.
Typ.
Max
Units
-
385
578
nC
-
45
68
nC
-
210
315
nC
Min.
Typ.
Max
Units
TC = 25°C unless otherwise noted
Test Conditions
-
2.1
2.6
TC = 175oC
-
1.7
-
Reverse Recovery Energy
TC = 175oC
-
40
-
trr
Diode Reverse Recovery Time
TC = 25oC
-
65
85
TC = 175oC
-
127
-
Qrr
Diode Reverse Recovery Charge
TC = 25oC
-
120
170
-
550
-
VFM
Diode Forward Voltage
Erec
FGH75T65UPD Rev. C0
TC =
25oC
IF = 50A
IF =50A, dIF/dt = 200A/µs
TC =
3
175oC
V
uJ
ns
nC
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FGH75T65UPD 650V 75A Field Stop IGBT
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
225
VGE= 20V
Figure 2. Typical Output Characteristics
225
VGE= 20V
15V
15V
180
135
90
10V
45
8V
0
0
180
Collector Current, IC [A]
Collector Current, IC [A]
12V
12V
135
90
10V
45
8V
o
o
TC = 25 C
2
4
6
8
Collector-Emitter Voltage, VCE [V]
TC = 175 C
0
10
Figure 3. Typical Saturation Voltage
Characteristics
0
225
Common Emitter
VCE = 400V
Collector Current, IC [A]
Collector Current, IC [A]
200
175
150
125
100
75
Common Emitter
VGE = 15V
50
o
180
TC = 25 C
o
TC = 175 C
135
90
45
o
TC = 25 C
25
o
TC = 175 C
0
0
1
2
3
4
Collector-Emitter Voltage, VCE [V]
5
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
0
3
6
9
12
Gate-Emitter Voltage,VGE [V]
15
Figure 6. Saturation Voltage vs. VGE
3.5
20
Common Emitter
Common Emitter
VGE = 15V
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
10
Figure 4. Transfer Characteristics
225
0
2
4
6
8
Collector-Emitter Voltage, VCE [V]
3.0
150A
2.5
2.0
75A
1.5
IC = 40A
1.0
25
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
FGH75T65UPD Rev. C0
o
TC = -40 C
16
150A
12
75A
8
IC = 40A
4
0
4
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
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FGH75T65UPD 650V 75A Field Stop IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
Figure 8. Saturation Voltage vs. VGE
20
Common Emitter
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
20
o
TC = 25 C
16
150A
12
75A
8
IC = 40A
4
0
o
TC = 175 C
16
150A
12
75A
8
IC = 40A
4
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
4
20
Figure 9. Capacitance Characteristics
Gate-Emitter Voltage, VGE [V]
1000
Coes
Common Emitter
VGE = 0V, f = 1MHz
100
Cres
12
400V
200V
6
3
Common Emitter
o
o
1
VCC = 300V
9
TC = 25 C
TC = 25 C
10
Collector-Emitter Voltage, VCE [V]
0
30
Figure 11. SOA Characteristics
0
70
140
210
280
Gate Charge, Qg [nC]
350
420
Figure 12. Turn-on Characteristics vs.
Gate Resistance
1000
500
Common Emitter
VCC = 400V, VGE = 15V
IC = 75A
10µs
100
o
TC = 25 C
100µs
1ms
10
td(on)
100
10 ms
DC
1
o
TC = 175 C
Switching Time [ns]
Collector Current, Ic [A]
20
15
Cies
50
8
12
16
Gate-Emitter Voltage, VGE [V]
Figure 10. Gate charge Characteristics
10000
Capacitance [pF]
Common Emitter
*Notes:
o
1. TC = 25 C
tr
o
2. TJ < 175 C
3. Single Pulse
10
0.1
1
10
100
Collector-Emitter Voltage, VCE [V]
FGH75T65UPD Rev. C0
1000
5
0
10
20
30
40
Gate Resistance, RG [Ω ]
50
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FGH75T65UPD 650V 75A Field Stop IGBT
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Gate Resistance
Figure 14. Turn-on Characteristics vs.
Collector Current
500
5000
td(off)
100
Switching Time [ns]
Switching Time [ns]
1000
tf
100
Common Emitter
VCC = 400V, VGE = 15V
IC = 75A
tr
td(on)
10
Common Emitter
VGE = 15V, RG = 3Ω
o
o
TC = 25 C
TC = 25 C
o
o
TC = 175 C
10
0
10
TC = 175 C
20
30
40
Gate Resistance, RG [Ω ]
1
50
0
60
90
120
150
40
50
Collector Current, IC [A]
Figure 15. Turn-off Characteristics vs.
Collector Current
Figure 16. Switching Loss vs.
Gate Resistance
1000
100
Common Emitter
VCC = 400V, VGE = 15V
td(off)
IC = 75A
100
tf
10
o
TC = 25 C
Switching Loss [mJ]
Switching Time [ns]
30
Common Emitter
VGE = 15V, RG = 3Ω
o
TC = 175 C
Eon
10
Eoff
o
TC = 25 C
o
TC = 175 C
1
0
30
60
90
120
1
150
0
10
Collector Current, IC [A]
20
30
Gate Resistance, RG [Ω ]
Figure 17. Switching Loss vs.
Collector Current
Figure 18. Turn off Switching
SOA Characteristics
250
50
Collector Current, IC [A]
Switching Loss [mJ]
200
10
150
Eon
100
1
Common Emitter
VGE = 15V, RG = 3Ω
Eoff
o
TC = 25 C
50
Safe Operating Area
o
o
TC = 175 C
0.1
VGE = 15V, TC < 175 C
0
0
30
60
90
120
150
FGH75T65UPD Rev. C0
0
100
200
300
400
500
600
700
Collector-Emitter Voltage, VCE [V]
Collector Current, IC [A]
6
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FGH75T65UPD 650V 75A Field Stop IGBT
Typical Performance Characteristics
Figure 19. Current Derating
Figure 20. Load Current Vs. Frequence
180
o
TC = 100 C
150
150
Collector Current, IC A]
Average Forward Current, IF(AV) [A]
180
120
90
60
120
90
Duty cycle : 50%
60
o
T = 100 C
C
Power Dissipation = 187W
30
30
VCC = 400V
load Current : peak of square wave
0
0
25
50
75 100 125 150
o
Case temperature, TC [ C]
175
0
1k
200
10k
100k
1M
Switching Frequency, f [Hz]
Figure 21. Forward Characteristics
Figure 22. Reverse Recovery Current
300
11
o
TC = 25 C
10
o
TC = 175 C
Reverse Current Irr [A]
Forward Current, IF [A]
100
o
TC = 175 C
10
o
TC = 125 C
o
TC = 75 C
di/dt = 200A/µs
8
6
100A/ µs
4
di/dt = 200A/ µs
2
o
100A/µs
TC = 25 C
1
0
1
2
3
Forward Voltage, VF [V]
0
4
0
Figure 23. Stored Charge
30
40
IC [A]
50
60
70
80
200
o
TC = 25 C
o
TC = 25 C
0.6
Reverse Recovery Time, trr [ns]
Stored Recovery Charge, Qrr [uC]
20
Figure 24. Reverse Recovery Time
0.7
o
TC = 175 C
200A/µs
0.5
0.4
di/dt = 100A/µs
0.3
0.2
200A/µs
0.1
o
TC = 175 C
160
di/dt = 100A/µs
200A/µs
120
di/dt = 100A/µs
80
200A/µs
di/dt = 100A/µs
0.0
10
0
FGH75T65UPD Rev. C0
20
40
60
Forwad Current, IF [A]
40
80
0
20
40
60
80
Forward Current, IF [A]
7
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FGH75T65UPD 650V 75A Field Stop IGBT
Typical Performance Characteristics
FGH75T65UPD 650V 75A Field Stop IGBT
Typical Performance Characteristics
Figure 25. Transient Thermal Impedance of IGBT
0.5
Thermal Response [Zthjc]
0.5
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
single pulse
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
Rectangular Pulse Duration [sec]
Figure 26.Transient Thermal Impedance of Diode
2
Thermal Response [Zthjc]
1
0.5
0.2
0.1
0.1
0.01
0.05
0.02
0.01
single pulse
PDM
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
FGH75T65UPD Rev. C0
8
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FGH75T65UPD 650V 75A Field Stop IGBT
Mechanical Dimensions
TO - 247AB (FKS PKG CODE 001)
FGH75T65UPD Rev. C0
9
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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As used here in:
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intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
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expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I61
FGH75T65UPD Rev. C0
10
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FGH75T65UPD 650V 75A Field Stop IGBT
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
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