TRIQUINT TGC4407-SM

TGC4407-SM
Ka-Band Up-Converter
Applications



VSAT
Point-to-Point Radio
Test Equipments & Sensors
QFN 3x3mm 16L
Product Features







Functional Block Diagram
RF Frequency Range: 21.5 – 32.5 GHz
Wideband IF Frequency: DC – 7.0 GHz
Sub-Harmonic Pumped LO Frequency: 11 – 16
GHz
Integrated LO Amplifier: 0 to 7.5 dBm Input
Conversion Gain: -9 dB
Bias: Vd = 5 V, Id = 65 mA, Typical
Package Dimensions: 3.0 x 3.0 x 0.85 mm
General Description
Pin Configuration
The TriQuint TGC4407-SM is a Ka-Band sub-harmonic
Up-Converter with integrated LO buffer amplifier. The
TGC4407-SM operates from 21.5 to 32.5 GHz and is
designed using TriQuint’s pHEMT production process.
The TGC4407-SM typically provides 13 dBm of Input
TOI at -10dBm input power per tone and a conversion
gain of -9 dB.
Pin #
Symbol
1, 5, 12, 13, 15, 16
2, 4, 6, 8, 9, 11
3
7
10
14
N/C
GND
LO IN
IF IN
RF OUT
Vd
The TGC4407-SM is available in a low-cost, surface
mount 16 lead 3x3 QFN package and is ideally suited for
Point-to-Point Radio, and Ka-Band VSAT Ground
Terminal.
Lead-free and RoHS compliant.
Evaluation Boards are available upon request.
Ordering Information
Part No.
ECCN
Description
TGC4407-SM
EAR99
Ku-band Up-Converter
Standard T/R size = 500 pieces on a 7” reel.
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 1 of 16 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TGC4407-SM
Ka-Band Up-Converter
Specifications
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Rating
Parameter
Drain Voltage,Vd
Drain Current, Id
Power Dissipation, Pdiss
RF Input Power, CW, 50Ω,T = 25ºC
Channel Temperature, Tch
Mounting Temperature (30 Seconds)
Storage Temperature
+7 V
0.175 A
1.2 W
+10 dBm
200 oC
260 oC
-40 to 150 oC
Vd
Id
Id_drive (Under RF
Drive)
Temperature
Operation of this device outside the parameter ranges given
above may cause permanent damage. These are stress
ratings only, and functional operation of the device at these
conditions is not implied.
Min
Typical
4
5
0.065
Max Units
6
0.076
-40
25
V
A
A
85
°C
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Electrical Specifications
Test conditions unless otherwise noted: 25ºC, Vd = 5 V, Id = 0.065 A Typical.
For: IF = 500 MHz, LSB = 2 x LO – IF (19.5 – 31.5 GHz) and USB = 2 x LO + IF (20.5 – 32.5 GHz).
Parameter
RF Frequency Range
LO Frequency Range
IF Frequency Range
Conversion Gain
Noise Figure
2LO-to-RF Isolation
Input IP3
Input 1dB Compression
Supply Current
IF = 500 MHz, LO = 0 dBm, Vd = 5 V, Id = 0.065 A.
Min
Typical
Max.
21.5
32.5
11
16
DC
7
-9
9
35
13
4
65
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 2 of 16 -
Units
GHz
GHz
GHz
dB
dB
dB
dBm
dBm
mA
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Specifications (cont.)
Thermal and Reliability Information
Parameter
Condition
Rating
Thermal Resistance, θJC, measured to back of package
Tbase = 85 °C
Tbase = 85 °C, Vd = 5 V, Id = 65 mA,
Pdiss = 0.325 W
Tbase = 85 °C, Vd = 5 V, Id = 76 mA,
Pin = 7 dBm, Pdiss = 0.38 W
θJC = 47 °C/W
Tch = 100 °C
Tm = 2.9 E+11 Hours
Tch = 103 °C
Tm = 2.2 E+11 Hours
Channel Temperature (Tch), and Median Lifetime (Tm)
Channel Temperature (Tch), and Median Lifetime (Tm)
Under RF Drive
Median Lifetime (Tm) vs. Channel Temperature (Tch)
Median Lifetime, Tm (Hours)
1E+15
1E+14
1E+13
1E+12
1E+11
1E+10
1E+09
1E+08
1E+07
1E+06
1E+05
FET11
1E+04
25
50
75
100
125
150
175
200
Channel Temperature, Tch (°C)
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 3 of 16 -
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Typical Performance
Conversion Gain vs. LO Drive
Conversion Gain vs. LO Drive
Vd = 5 V, IF = 500 MHz, USB, 25 °C
0
0
-5
-5
Conversion Gain (dB)
Conversion Gain (dB)
Vd = 5 V, IF = 500 MHz, LSB, 25 °C
-10
-15
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
-20
-25
-30
-10
-15
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
-20
-25
-30
10
11
12
13
14
15
16
10
11
13
14
15
Input P1dB vs. LO Drive
Input P1dB vs. LO Drive
Vd = 5 V, IF = 500 MHz, LSB, 25 °C
Vd = 5 V, IF = 500 MHz, USB, 25 °C
15
15
10
10
5
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
0
-5
-10
16
5
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
0
-5
-10
10
11
12
13
14
15
16
10
11
LO Frequency (GHz)
12
13
14
15
Input IP3 vs. LO Drive
Input IP3 vs. LO Drive
Vd = 5 V, IF = 500 MHz, USB, 25 °C
25
Input Power = -10 dBm/Tone
10 MHz Spacing
15
10
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
5
0
Input Power = -10 dBm/Tone
10 MHz Spacing
20
Input IP3 (dBm)
20
16
LO Frequency (GHz)
Vd = 5 V, IF = 500 MHz, LSB, 25 °C
25
Input IP3 (dBm)
12
LO Frequency (GHz)
Input P1dB (dBm)
Input P1dB (dBm)
LO Frequency (GHz)
15
10
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
5
0
-5
-5
10
11
12
13
14
15
16
10
LO Frequency (GHz)
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
11
12
13
14
15
16
LO Frequency (GHz)
- 4 of 16 -
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Typical Performance (cont.)
IF Bandwidth vs. LO Drive
IF Bandwidth vs. LO Drive
Vd = 5 V, IF = 500 MHz, LO of 13 GHz, LSB, 25 °C
Vd = 5 V, IF = 500 MHz, LO of 13 GHz, USB, 25 °C
0
Conversion Gain (dB)
Conversion Gain (dB)
0
-5
-10
-15
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
-20
-5
-10
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
-15
-20
-25
-25
0
1
2
3
4
5
6
7
8
9
10
0
1
2
IF Frequency (GHz)
3
IF to RF Isolation vs. LO Drive
40
40
Isolation (dB)
Isolation (dB)
50
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
10
7
8
9
10
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
30
20
10
0
0
10
11
12
13
14
15
10
16
11
12
13
14
15
LO Frequency (GHz)
LO Frequency (GHz)
2LO to RF Isolation vs. LO Drive
3LO to RF Isolation vs. LO Drive
Vd = 5 V, 25 °C
50
40
40
30
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
20
10
16
Vd = 5 V, 25 °C
50
Isolation (dB)
Isolation (dB)
6
Vd = 5 V, 25 °C
50
20
5
LO to RF Isolation vs. LO Drive
Vd = 5 V, IF = 500 MHz, 25 °C
30
4
IF Frequency (GHz)
0 dBm
2.5 dBm
5.0 dBm
7.5 dBm
30
20
10
0
0
10
11
12
13
14
15
16
10
LO Frequency (GHz)
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
11
12
13
14
15
16
LO Frequency (GHz)
- 5 of 16 -
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Typical Performance (cont.)
Conversion Gain vs. Temperature
Conversion Gain vs. Temperature
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB
0
0
-5
-5
Conversion Gain (dB)
Conversion Gain (dB)
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB
-10
-15
85 °C
25 °C
-40 °C
-20
-25
-10
-15
85 °C
25 °C
-40 °C
-20
-25
-30
-30
10
11
12
13
14
15
10
16
11
14
15
Input P1dB vs. Temperature
Input P1dB vs. Temperature
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB
15
15
10
10
Input P1dB (dBm)
Input P1dB (dBm)
13
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB
5
0
85 °C
25 °C
-40 °C
-5
-10
16
5
0
85 °C
25 °C
-40 °C
-5
-10
10
11
12
13
14
15
16
10
11
LO Frequency (GHz)
12
13
15
Input IP3 vs. Temperature
Input IP3 vs. Temperature
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB
25
Input Power = -10 dBm/Tone
10 MHz Spacing
15
10
5
85 °C
25 °C
-40 °C
0
15
10
5
85 °C
25 °C
-40 °C
0
-5
-5
11
12
13
14
15
10
16
© 2011 TriQuint Semiconductor, Inc.
11
12
13
14
15
16
LO Frequency (GHz)
LO Frequency (GHz)
Preliminary Data Sheet: RevA 3/30/12
16
Input Power = -10 dBm/Tone
10 MHz Spacing
20
Input IP3 (dBm)
20
10
14
LO Frequency (GHz)
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB
25
Input IP3 (dBm)
12
LO Frequency (GHz)
LO Frequency (GHz)
- 6 of 16 -
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TGC4407-SM
Ka-Band Up-Converter
Typical Performance (cont.)
IF to RF Isolation vs. Temperature
LO to RF Isolation vs. Temperature
Vd = 5 V, LO = 0 dBm
50
50
40
40
30
Isolation (dB)
Isolation (dB)
Vd = 5 V, IF = 500 MHz, LO = 0 dBm
85 °C
25 °C
-40 °C
20
10
30
85 °C
25 °C
-40 °C
20
10
0
0
10
11
12
13
14
15
16
10
11
12
15
2LO to RF Isolation vs. Temperature
3LO to RF Isolation vs. Temperature
16
Vd = 5 V, LO = 0 dBm
50
50
40
40
Isolation (dB)
Isolation (dB)
14
LO Frequency (GHz)
Vd = 5 V, LO = 0 dBm
30
20
85 °C
25 °C
-40 °C
10
30
85 °C
25 °C
-40 °C
20
10
0
0
10
11
12
13
14
15
16
10
11
12
LO Frequency (GHz)
13
14
15
Conversion Gain vs. Bias
Conversion Gain vs. Bias
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB, 25 °C
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB, 25 °C
0
0
-5
-5
-10
-15
3V
4V
5V
6V
-20
-25
16
LO Frequency (GHz)
Conversion Gain (dB)
Conversion Gain (dB)
13
LO Frequency (GHz)
-30
-10
-15
3V
4V
5V
6V
-20
-25
-30
10
11
12
13
14
15
16
10
LO Frequency (GHz)
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
11
12
13
14
15
16
LO Frequency (GHz)
- 7 of 16 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TGC4407-SM
Ka-Band Up-Converter
Input P1dB vs. Bias
Input P1dB vs. Bias
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB, 25 °C
Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB, 25 °C
15
15
10
10
Input P1dB (dBm)
Input P1dB (dBm)
Typical Performance (cont.)
5
0
3V
4V
5V
6V
-5
-10
5
0
3V
4V
5V
6V
-5
-10
-15
-15
10
11
12
13
14
15
10
16
11
12
15
Input IP3 vs. Bias
Input IP3 vs. Bias
IF = 500 MHz, LO = 0 dBm, USB, 25 °C
25
Input Power = -10 dBm/Tone
10 MHz Spacing
15
10
3V
4V
5V
6V
5
0
16
Input Power = -10 dBm/Tone
10 MHz Spacing
20
Input IP3 (dBm)
20
Input IP3 (dBm)
14
IF = 500 MHz, LO = 0 dBm, LSB, 25 °C
25
15
10
3V
4V
5V
6V
5
0
-5
-5
10
11
12
13
14
LO Frequency (GHz)
15
10
16
11
12
13
14
15
16
LO Frequency (GHz)
IF Bandwidth vs. Bias
IF Bandwidth vs. Bias
IF = 500 MHz, LO of 13 GHz = 0 dBm, LSB, 25 °C
IF = 500 MHz, LO of 13 GHz = 0 dBm, USB, 25 °C
0
Conversion Gain (dB)
0
Conversion Gain (dB)
13
LO Frequency (GHz)
LO Frequency (GHz)
-5
-10
3V
4V
5V
6V
-15
-20
-25
-5
-10
3V
4V
5V
6V
-15
-20
-25
0
1
2
3
4
5
6
7
8
9
10
0
IF Frequency (GHz)
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 8 of 16 -
1
2
3
4
5
6
7
IF Frequency (GHz)
8
9
10
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TGC4407-SM
Ka-Band Up-Converter
Typical Performance (cont.)
LO to RF Isolation vs. Bias
2LO to RF Isolation vs. Bias
Vd = 5 V, LO = 0 dBm, 25 °C
Vd = 5 V, LO = 0 dBm, 25 °C
50
50
40
3V
4V
5V
6V
30
20
Isolation (dB)
Isolation (dB)
40
10
30
3V
4V
5V
6V
20
10
0
0
10
11
12
13
14
15
16
10
11
LO Frequency (GHz)
12
13
14
15
16
LO Frequency (GHz)
3LO to RF Isolation vs. Bias
Vd = 5 V, LO = 0 dBm, 25 °C
50
Isolation (dB)
40
`
3V
4V
5V
6V
30
20
10
0
10
11
12
13
14
15
16
LO Frequency (GHz)
M x N Spurious Outputs
LO at 13 GHz and 0 dBm; IF at 1 GHz and -10 dBm; Vd = 5 V; 25 °C; All values are in dBc from USB.
nLO
mRF
-2
-1
0
1
3
-32
-35
18
2
-39
-1
-16
1
-53
-40
12
-35
0
-35
2
-29
-43
-49
-42
-75
3
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
0
-59
-24
- 9 of 16 -
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TGC4407-SM
Ka-Band Up-Converter
Application Circuit
Vd
LO Input
4407
YYWW
XXXX
RF Output
IF Input
Bias-up Procedure
Bias-down Procedure
Set Vd to desired voltage within specified limits
Apply RF signals to LO and RF Inputs
Turn off RF supply
Reduce Vd to 0 V
The TGC4407-SM will be marked with the “4407” designator and a lot code marked below the part designator. The “YY”
represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the “XXXX” is an autogenerated number.
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 10 of 16 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TGC4407-SM
Ka-Band Up-Converter
Pin Description
Pin
Symbol
Description
1, 5, 12, 13, 15, 16
2, 4, 6, 8, 9, 11
3
7
10
N/C
GND
LO IN
IF IN
RF OUT
14
Vd
17
GND
No internal connection; must be grounded on PCB.
Internal Grounding; must be grounded on PCB.
Local Oscillator Input, matched to 50 ohms, AC Coupled.
IF Input matched to 50 ohms, DC Coupled.
RF Output matched to 50 ohms, AC Coupled.
Drain voltage. Bias network is required; see Application Circuit on page 10 as
an example.
Backside Paddle. Multiple vias should be employed to minimize inductance
and thermal resistance; see Mounting Configuration on page 14 for suggested
footprint.
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 11 of 16 -
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Applications Information
PC Board Layout
Top RF layer is 0.008” thick Rogers RO4003, єr = 3.38, with 0.062” FR4 stiffener. Metal
layers are 1-oz copper. The 50 Ω transmission line is a Grounded Coplanar Waveguide
Interface.
The pad pattern shown has been developed and tested for optimized assembly at
TriQuint Semiconductor. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to
company, careful process development is recommended.
For further technical information, refer to the TGC4407-SM Product Information page.
Bill of Material
Ref Des
Value
Description
Manufacturer
C1
C2
4.7 µF
0.01 µF
Cap, 1206, 20V, 5%, X7R
Cap, 0603, 25V, 5%, X5R
various
various
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 12 of 16 -
Part Number
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Mechanical Information
Package Information and Dimensions
All dimensions are in millimeters.
This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is 100%
matte Sn. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow
temperature) soldering processes.
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 13 of 16 -
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TGC4407-SM
Ka-Band Up-Converter
Mechanical Information (cont.)
Mounting Configuration
All dimensions are in millimeters (inches).
Notes:
1. Ground vias are critical for the proper performance of this
device. Vias have a final plated thru diameter of .40 mm (.016”).
Tape and Reel Information
Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.
Standard T/R size = 500 pieces on a 7 x 0.5” reel.
CARRIER AND COVER TAPE DIMENSIONS
Part
Feature
Cavity
Length
Width
Depth
Pitch
Cavity to Perforation
Length Direction
Cavity to Perforation
Width Direction
Width
Width
Distance Between Centerline
Cover Tape
Carrier Tape
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 14 of 16 -
Symbol
Size (in)
Size (mm)
A0
B0
K0
P1
0.134
0.126
0.055
0.315
3.4
3.2
1.4
8.0
P2
0.079
2.0
F
0.217
5.5
C
W
0.374
0.472
9.5
12.0
Disclaimer: Subject to change without notice
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TGC4407-SM
Ka-Band Up-Converter
Product Compliance Information
ESD Information
Solderability
Compatible with the latest version of J-STD-020, Lead
free solder, 260°C
ESD Rating:
Value:
Test:
Standard:
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
Class 0
≥ 200 V and < 250 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating
Level MSL1 at +260 °C convection reflow
The part is rated Moisture Sensitivity Level MSL1 at 260°C per
JEDEC standard IPC/JEDEC J-STD-020.
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
ECCN
US Department of Commerce EAR99
Recommended Soldering Temperature Profile
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 15 of 16 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
TGC4407-SM
Ka-Band Up-Converter
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and information about
TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.972.994.8465
+1.972.994.8504
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint
assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained
herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with
the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest
relevant information before placing orders for TriQuint products. The information contained herein or any use of such
information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property
rights, whether with regard to such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
Preliminary Data Sheet: RevA 3/30/12
© 2011 TriQuint Semiconductor, Inc.
- 16 of 16 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®