TGC4407-SM Ka-Band Up-Converter Applications VSAT Point-to-Point Radio Test Equipments & Sensors QFN 3x3mm 16L Product Features Functional Block Diagram RF Frequency Range: 21.5 – 32.5 GHz Wideband IF Frequency: DC – 7.0 GHz Sub-Harmonic Pumped LO Frequency: 11 – 16 GHz Integrated LO Amplifier: 0 to 7.5 dBm Input Conversion Gain: -9 dB Bias: Vd = 5 V, Id = 65 mA, Typical Package Dimensions: 3.0 x 3.0 x 0.85 mm General Description Pin Configuration The TriQuint TGC4407-SM is a Ka-Band sub-harmonic Up-Converter with integrated LO buffer amplifier. The TGC4407-SM operates from 21.5 to 32.5 GHz and is designed using TriQuint’s pHEMT production process. The TGC4407-SM typically provides 13 dBm of Input TOI at -10dBm input power per tone and a conversion gain of -9 dB. Pin # Symbol 1, 5, 12, 13, 15, 16 2, 4, 6, 8, 9, 11 3 7 10 14 N/C GND LO IN IF IN RF OUT Vd The TGC4407-SM is available in a low-cost, surface mount 16 lead 3x3 QFN package and is ideally suited for Point-to-Point Radio, and Ka-Band VSAT Ground Terminal. Lead-free and RoHS compliant. Evaluation Boards are available upon request. Ordering Information Part No. ECCN Description TGC4407-SM EAR99 Ku-band Up-Converter Standard T/R size = 500 pieces on a 7” reel. Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 1 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Specifications Absolute Maximum Ratings Recommended Operating Conditions Parameter Rating Parameter Drain Voltage,Vd Drain Current, Id Power Dissipation, Pdiss RF Input Power, CW, 50Ω,T = 25ºC Channel Temperature, Tch Mounting Temperature (30 Seconds) Storage Temperature +7 V 0.175 A 1.2 W +10 dBm 200 oC 260 oC -40 to 150 oC Vd Id Id_drive (Under RF Drive) Temperature Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Min Typical 4 5 0.065 Max Units 6 0.076 -40 25 V A A 85 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: 25ºC, Vd = 5 V, Id = 0.065 A Typical. For: IF = 500 MHz, LSB = 2 x LO – IF (19.5 – 31.5 GHz) and USB = 2 x LO + IF (20.5 – 32.5 GHz). Parameter RF Frequency Range LO Frequency Range IF Frequency Range Conversion Gain Noise Figure 2LO-to-RF Isolation Input IP3 Input 1dB Compression Supply Current IF = 500 MHz, LO = 0 dBm, Vd = 5 V, Id = 0.065 A. Min Typical Max. 21.5 32.5 11 16 DC 7 -9 9 35 13 4 65 Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 2 of 16 - Units GHz GHz GHz dB dB dB dBm dBm mA Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Specifications (cont.) Thermal and Reliability Information Parameter Condition Rating Thermal Resistance, θJC, measured to back of package Tbase = 85 °C Tbase = 85 °C, Vd = 5 V, Id = 65 mA, Pdiss = 0.325 W Tbase = 85 °C, Vd = 5 V, Id = 76 mA, Pin = 7 dBm, Pdiss = 0.38 W θJC = 47 °C/W Tch = 100 °C Tm = 2.9 E+11 Hours Tch = 103 °C Tm = 2.2 E+11 Hours Channel Temperature (Tch), and Median Lifetime (Tm) Channel Temperature (Tch), and Median Lifetime (Tm) Under RF Drive Median Lifetime (Tm) vs. Channel Temperature (Tch) Median Lifetime, Tm (Hours) 1E+15 1E+14 1E+13 1E+12 1E+11 1E+10 1E+09 1E+08 1E+07 1E+06 1E+05 FET11 1E+04 25 50 75 100 125 150 175 200 Channel Temperature, Tch (°C) Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 3 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Typical Performance Conversion Gain vs. LO Drive Conversion Gain vs. LO Drive Vd = 5 V, IF = 500 MHz, USB, 25 °C 0 0 -5 -5 Conversion Gain (dB) Conversion Gain (dB) Vd = 5 V, IF = 500 MHz, LSB, 25 °C -10 -15 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm -20 -25 -30 -10 -15 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm -20 -25 -30 10 11 12 13 14 15 16 10 11 13 14 15 Input P1dB vs. LO Drive Input P1dB vs. LO Drive Vd = 5 V, IF = 500 MHz, LSB, 25 °C Vd = 5 V, IF = 500 MHz, USB, 25 °C 15 15 10 10 5 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 0 -5 -10 16 5 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 0 -5 -10 10 11 12 13 14 15 16 10 11 LO Frequency (GHz) 12 13 14 15 Input IP3 vs. LO Drive Input IP3 vs. LO Drive Vd = 5 V, IF = 500 MHz, USB, 25 °C 25 Input Power = -10 dBm/Tone 10 MHz Spacing 15 10 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 5 0 Input Power = -10 dBm/Tone 10 MHz Spacing 20 Input IP3 (dBm) 20 16 LO Frequency (GHz) Vd = 5 V, IF = 500 MHz, LSB, 25 °C 25 Input IP3 (dBm) 12 LO Frequency (GHz) Input P1dB (dBm) Input P1dB (dBm) LO Frequency (GHz) 15 10 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 5 0 -5 -5 10 11 12 13 14 15 16 10 LO Frequency (GHz) Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. 11 12 13 14 15 16 LO Frequency (GHz) - 4 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Typical Performance (cont.) IF Bandwidth vs. LO Drive IF Bandwidth vs. LO Drive Vd = 5 V, IF = 500 MHz, LO of 13 GHz, LSB, 25 °C Vd = 5 V, IF = 500 MHz, LO of 13 GHz, USB, 25 °C 0 Conversion Gain (dB) Conversion Gain (dB) 0 -5 -10 -15 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm -20 -5 -10 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm -15 -20 -25 -25 0 1 2 3 4 5 6 7 8 9 10 0 1 2 IF Frequency (GHz) 3 IF to RF Isolation vs. LO Drive 40 40 Isolation (dB) Isolation (dB) 50 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 10 7 8 9 10 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 30 20 10 0 0 10 11 12 13 14 15 10 16 11 12 13 14 15 LO Frequency (GHz) LO Frequency (GHz) 2LO to RF Isolation vs. LO Drive 3LO to RF Isolation vs. LO Drive Vd = 5 V, 25 °C 50 40 40 30 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 20 10 16 Vd = 5 V, 25 °C 50 Isolation (dB) Isolation (dB) 6 Vd = 5 V, 25 °C 50 20 5 LO to RF Isolation vs. LO Drive Vd = 5 V, IF = 500 MHz, 25 °C 30 4 IF Frequency (GHz) 0 dBm 2.5 dBm 5.0 dBm 7.5 dBm 30 20 10 0 0 10 11 12 13 14 15 16 10 LO Frequency (GHz) Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. 11 12 13 14 15 16 LO Frequency (GHz) - 5 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Typical Performance (cont.) Conversion Gain vs. Temperature Conversion Gain vs. Temperature Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB 0 0 -5 -5 Conversion Gain (dB) Conversion Gain (dB) Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB -10 -15 85 °C 25 °C -40 °C -20 -25 -10 -15 85 °C 25 °C -40 °C -20 -25 -30 -30 10 11 12 13 14 15 10 16 11 14 15 Input P1dB vs. Temperature Input P1dB vs. Temperature Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB 15 15 10 10 Input P1dB (dBm) Input P1dB (dBm) 13 Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB 5 0 85 °C 25 °C -40 °C -5 -10 16 5 0 85 °C 25 °C -40 °C -5 -10 10 11 12 13 14 15 16 10 11 LO Frequency (GHz) 12 13 15 Input IP3 vs. Temperature Input IP3 vs. Temperature Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB 25 Input Power = -10 dBm/Tone 10 MHz Spacing 15 10 5 85 °C 25 °C -40 °C 0 15 10 5 85 °C 25 °C -40 °C 0 -5 -5 11 12 13 14 15 10 16 © 2011 TriQuint Semiconductor, Inc. 11 12 13 14 15 16 LO Frequency (GHz) LO Frequency (GHz) Preliminary Data Sheet: RevA 3/30/12 16 Input Power = -10 dBm/Tone 10 MHz Spacing 20 Input IP3 (dBm) 20 10 14 LO Frequency (GHz) Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB 25 Input IP3 (dBm) 12 LO Frequency (GHz) LO Frequency (GHz) - 6 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Typical Performance (cont.) IF to RF Isolation vs. Temperature LO to RF Isolation vs. Temperature Vd = 5 V, LO = 0 dBm 50 50 40 40 30 Isolation (dB) Isolation (dB) Vd = 5 V, IF = 500 MHz, LO = 0 dBm 85 °C 25 °C -40 °C 20 10 30 85 °C 25 °C -40 °C 20 10 0 0 10 11 12 13 14 15 16 10 11 12 15 2LO to RF Isolation vs. Temperature 3LO to RF Isolation vs. Temperature 16 Vd = 5 V, LO = 0 dBm 50 50 40 40 Isolation (dB) Isolation (dB) 14 LO Frequency (GHz) Vd = 5 V, LO = 0 dBm 30 20 85 °C 25 °C -40 °C 10 30 85 °C 25 °C -40 °C 20 10 0 0 10 11 12 13 14 15 16 10 11 12 LO Frequency (GHz) 13 14 15 Conversion Gain vs. Bias Conversion Gain vs. Bias Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB, 25 °C Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB, 25 °C 0 0 -5 -5 -10 -15 3V 4V 5V 6V -20 -25 16 LO Frequency (GHz) Conversion Gain (dB) Conversion Gain (dB) 13 LO Frequency (GHz) -30 -10 -15 3V 4V 5V 6V -20 -25 -30 10 11 12 13 14 15 16 10 LO Frequency (GHz) Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. 11 12 13 14 15 16 LO Frequency (GHz) - 7 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Input P1dB vs. Bias Input P1dB vs. Bias Vd = 5 V, IF = 500 MHz, LO = 0 dBm, LSB, 25 °C Vd = 5 V, IF = 500 MHz, LO = 0 dBm, USB, 25 °C 15 15 10 10 Input P1dB (dBm) Input P1dB (dBm) Typical Performance (cont.) 5 0 3V 4V 5V 6V -5 -10 5 0 3V 4V 5V 6V -5 -10 -15 -15 10 11 12 13 14 15 10 16 11 12 15 Input IP3 vs. Bias Input IP3 vs. Bias IF = 500 MHz, LO = 0 dBm, USB, 25 °C 25 Input Power = -10 dBm/Tone 10 MHz Spacing 15 10 3V 4V 5V 6V 5 0 16 Input Power = -10 dBm/Tone 10 MHz Spacing 20 Input IP3 (dBm) 20 Input IP3 (dBm) 14 IF = 500 MHz, LO = 0 dBm, LSB, 25 °C 25 15 10 3V 4V 5V 6V 5 0 -5 -5 10 11 12 13 14 LO Frequency (GHz) 15 10 16 11 12 13 14 15 16 LO Frequency (GHz) IF Bandwidth vs. Bias IF Bandwidth vs. Bias IF = 500 MHz, LO of 13 GHz = 0 dBm, LSB, 25 °C IF = 500 MHz, LO of 13 GHz = 0 dBm, USB, 25 °C 0 Conversion Gain (dB) 0 Conversion Gain (dB) 13 LO Frequency (GHz) LO Frequency (GHz) -5 -10 3V 4V 5V 6V -15 -20 -25 -5 -10 3V 4V 5V 6V -15 -20 -25 0 1 2 3 4 5 6 7 8 9 10 0 IF Frequency (GHz) Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 8 of 16 - 1 2 3 4 5 6 7 IF Frequency (GHz) 8 9 10 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Typical Performance (cont.) LO to RF Isolation vs. Bias 2LO to RF Isolation vs. Bias Vd = 5 V, LO = 0 dBm, 25 °C Vd = 5 V, LO = 0 dBm, 25 °C 50 50 40 3V 4V 5V 6V 30 20 Isolation (dB) Isolation (dB) 40 10 30 3V 4V 5V 6V 20 10 0 0 10 11 12 13 14 15 16 10 11 LO Frequency (GHz) 12 13 14 15 16 LO Frequency (GHz) 3LO to RF Isolation vs. Bias Vd = 5 V, LO = 0 dBm, 25 °C 50 Isolation (dB) 40 ` 3V 4V 5V 6V 30 20 10 0 10 11 12 13 14 15 16 LO Frequency (GHz) M x N Spurious Outputs LO at 13 GHz and 0 dBm; IF at 1 GHz and -10 dBm; Vd = 5 V; 25 °C; All values are in dBc from USB. nLO mRF -2 -1 0 1 3 -32 -35 18 2 -39 -1 -16 1 -53 -40 12 -35 0 -35 2 -29 -43 -49 -42 -75 3 Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. 0 -59 -24 - 9 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Application Circuit Vd LO Input 4407 YYWW XXXX RF Output IF Input Bias-up Procedure Bias-down Procedure Set Vd to desired voltage within specified limits Apply RF signals to LO and RF Inputs Turn off RF supply Reduce Vd to 0 V The TGC4407-SM will be marked with the “4407” designator and a lot code marked below the part designator. The “YY” represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the “XXXX” is an autogenerated number. Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 10 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Pin Description Pin Symbol Description 1, 5, 12, 13, 15, 16 2, 4, 6, 8, 9, 11 3 7 10 N/C GND LO IN IF IN RF OUT 14 Vd 17 GND No internal connection; must be grounded on PCB. Internal Grounding; must be grounded on PCB. Local Oscillator Input, matched to 50 ohms, AC Coupled. IF Input matched to 50 ohms, DC Coupled. RF Output matched to 50 ohms, AC Coupled. Drain voltage. Bias network is required; see Application Circuit on page 10 as an example. Backside Paddle. Multiple vias should be employed to minimize inductance and thermal resistance; see Mounting Configuration on page 14 for suggested footprint. Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 11 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Applications Information PC Board Layout Top RF layer is 0.008” thick Rogers RO4003, єr = 3.38, with 0.062” FR4 stiffener. Metal layers are 1-oz copper. The 50 Ω transmission line is a Grounded Coplanar Waveguide Interface. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, refer to the TGC4407-SM Product Information page. Bill of Material Ref Des Value Description Manufacturer C1 C2 4.7 µF 0.01 µF Cap, 1206, 20V, 5%, X7R Cap, 0603, 25V, 5%, X5R various various Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 12 of 16 - Part Number Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Mechanical Information Package Information and Dimensions All dimensions are in millimeters. This package is lead-free/RoHS-compliant with a copper alloy base (CDA194), and the plating material on the leads is 100% matte Sn. It is compatible with both lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow temperature) soldering processes. Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 13 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Mechanical Information (cont.) Mounting Configuration All dimensions are in millimeters (inches). Notes: 1. Ground vias are critical for the proper performance of this device. Vias have a final plated thru diameter of .40 mm (.016”). Tape and Reel Information Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section. Standard T/R size = 500 pieces on a 7 x 0.5” reel. CARRIER AND COVER TAPE DIMENSIONS Part Feature Cavity Length Width Depth Pitch Cavity to Perforation Length Direction Cavity to Perforation Width Direction Width Width Distance Between Centerline Cover Tape Carrier Tape Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 14 of 16 - Symbol Size (in) Size (mm) A0 B0 K0 P1 0.134 0.126 0.055 0.315 3.4 3.2 1.4 8.0 P2 0.079 2.0 F 0.217 5.5 C W 0.374 0.472 9.5 12.0 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Product Compliance Information ESD Information Solderability Compatible with the latest version of J-STD-020, Lead free solder, 260°C ESD Rating: Value: Test: Standard: This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). Class 0 ≥ 200 V and < 250 V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating Level MSL1 at +260 °C convection reflow The part is rated Moisture Sensitivity Level MSL1 at 260°C per JEDEC standard IPC/JEDEC J-STD-020. This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free ECCN US Department of Commerce EAR99 Recommended Soldering Temperature Profile Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 15 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TGC4407-SM Ka-Band Up-Converter Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.972.994.8465 +1.972.994.8504 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Preliminary Data Sheet: RevA 3/30/12 © 2011 TriQuint Semiconductor, Inc. - 16 of 16 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network®