TQP3M9019 High Linearity LNA Gain Block Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE General purpose Wireless Product Features 16-pin 3x3 QFN package Functional Block Diagram 20-4000 MHz 22 dB Gain @ 1900 MHz 1.3 dB Noise Figure @ 1900 MHz +39.5 dBm Output IP3 50 Ohm Cascadable Gain Block Unconditionally Stable High Input Power Capability +5V Single Supply, 125mA Current 3x3 mm QFN Package General Description The TQP3M9019 is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. At 1.9 GHz, the amplifier typically provides 22 dB gain, +39.5 dBm OIP3, and 1.3 dB Noise Figure while only drawing 115 mA current. The device is housed in a leadfree/green/RoHS-compliant industry-standard 16-pin 3x3mm QFN package. Pin Configuration Pin # Symbol 2 11 All Other Pins Backside Paddle RF Input RF Output / Vdd N/C or GND GND The TQP3M9019 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. This allows the device to be used in both receiver and transmitter chains for high performance systems. The amplifier is internally matched using a high performance E-pHEMT process and only requires an external RF choke and blocking/bypass capacitors for operation from a single +5V supply. The internal active bias circuit also enables stable operation over bias and temperature variations. The TQP3M9019 covers the 0.02 – 4 GHz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. Ordering Information Part No. Description TQP3M9019 TQP3M9019-PCB_IF TQP3M9019-PCB_RF High Linearity LNA Gain Block 50-500 MHz Evaluation Board 0.5-4 GHz Evaluation Board Standard T/R size = 2500 pieces on a 7” reel. Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. - 1 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Specifications Recommended Operating Conditions Absolute Maximum Ratings Parameter Storage Temperature RF Input Power,CW,50 Ω, T=25ºC Device Voltage,Vdd Reverse Device Voltage Rating -65 to 150 oC +23 dBm +7 V -0.3 V Parameter Min Typ Vdd Tcase 4.75 -40 5 Max Units 5.25 +85 Tch (for>106 hours MTTF) 190 V o C o C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Operation of this device outside the parameter ranges given above may cause permanent damage. Electrical Specifications Test conditions unless otherwise noted: +25ºC, +5V Vsupply, 50 Ω system. Parameter Operational Frequency Range Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 Conditions Min Typical 20 20 See Note 1. +36 Noise Figure Vdd Current, Idd Thermal Resistance (channel to case) jc 1900 22 10 13 +22 +39.5 1.3 +5 125 Max Units 4000 MHz MHz dB dB dB dBm dBm dB V mA o C/W 23 150 34 Notes: 1. OIP3 is measured with two tones at an output power of 3 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using 2:1 rule. 2:1 rule gives relative value w.r.t. fundamental tone. Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. - 2 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Application Circuit Configuration Notes: 1. See PC Board Layout, page 8 for more information. 2. Components shown on the silkscreen but not on the schematic are not used. 3. B1 (0 Ω jumper) may be replaced with copper trace in the target application layout. 4. The recommended component values are dependent upon the frequency of operation. 5. All components are of 0603 size unless stated on the schematic. Bill of Material Reference Designation TQP3M9019-PCB_RF 500 MHz - 4000 MHz TQP3M9019-PCB_IF 50 MHz - 500 MHz TQP3M9019 100 pF 0.01 uF 68 nH Do Not Place 0Ω TQP3M9019 1000 pF 0.01 uF 330 nH Do Not Place 0Ω Q1 C2, C6 C1 L2 L1, D1, C3, C4 B1 Notes: 1. Performances can be optimized at frequency of interest by using recommended component values shown in the table below. Reference Designation C2, C6 L2 50 200 0.01 uF 470 nH 1000 pF 220 nH Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. Frequency (MHz) 500 2000 2500 3500 100 pF 82 nH 22 pF 18 nH 22 pF 15 nH - 3 of 10 - 22 pF 22 nH Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Typical Performance (TQP3M9019-PCB_RF) Test conditions unless otherwise noted: +25ºC, +5V, 125 mA, 50 Ω system on TriQuint’s TQP3M9019-PCB_RF evaluation board. Frequency MHz 500 900 1900 2700 3500 4000 Gain Input Return Loss Output Return Loss Output P1dB OIP3 [1] Noise Figure [2] dB dB dB dBm dBm dB 25.6 11 10.5 +22.4 +41.8 0.9 24.6 10.5 12 +22.3 +40.6 0.9 22 10 13 +22 +40.6 1.3 20.5 11.5 9 +21.7 +38.5 1.7 19 8 10 +21.4 +38.8 2.1 18.3 6 11 +20.8 +37.9 2.4 Notes: 1. OIP3 measured with two tones at an output power of +4 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using 2:1 rule. 2. Noise figure data shown in the table above is measured on evaluation board which includes board losses of around 0.1dB @ 2 GHz. RF Performance Plots (TQP3M9019-PCB_RF) Gain vs. Frequency over Temp S11 vs. Frequency over Temp 0 28 C C C C -5 24 S11 (dB) Gain (dB) -40 -20 +25 +85 -10 20 +85 +25 -20 -40 -15 16 C C C C -20 0.5 1 1.5 2 2.5 3 3.5 4 0.5 1 1.5 2 2.5 3 3.5 4 Frequency (GHz) Frequency (GHz) Noise Figure vs. Frequency over Temp S22 vs. Frequency over Temp 0 4 -5 3 NF (dB) S22 (dB) +85 C -10 -40 -20 +25 +85 -15 C C C C +25 C -40 C 2 1 0 -20 0.5 1 1.5 2 2.5 Frequency (GHz) Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. 3 3.5 500 4 1000 1500 2000 2500 3000 3500 4000 Frequency (MHz) - 4 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block RF Performance Plots (TQP3M9019-PCB_RF) OIP3 vs. Pout/tone over Temp OIP3 vs. Frequency over Temp F=1900 MHz, 1 MHz tone spacing 45 1 MHz tone spacing, 4 dBm/tone 45 40 OIP3 (dBm) OIP3 (dBm) 40 +25 +85 -20 -40 35 30 +25 +85 -20 -40 C C C C 35 30 25 25 0 2 4 Pout/tone (dBm) 6 0.5 8 1 OIP3 vs. Pout/tone over Freq 2 2.5 Frequency (GHz) 3 3.5 4 24 22 P1dB (dBm) 40 OIP3 (dBm) 1.5 P1dB vs. Frequency over Temp +25°C, 1 MHz tone spacing 45 35 1.9 GHz 0.9 GHz 3.5 GHz 2.7 GHz 30 20 -40 -20 +25 +85 18 C C C C 16 25 0 2 4 Pout/tone (dBm) 6 0.5 8 1 1.5 3 3.5 4 CW Signal 130 125 Idd (mA) 125 120 115 110 105 3.25 2.5 Idd vs. Temperature T=25⁰C, CW Signal 130 2 Frequency (GHz) Idd vs. Vdd Idd (mA) C C C C 120 115 110 105 3.5 3.75 4 4.25 Vdd (V) 4.5 Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. 4.75 5 5.25 - 5 of 10 - -40 -15 10 35 Temperature (⁰C) 60 85 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Typical Performance 50-500 MHz (TQP3M9019-PCB_IF) Test conditions unless otherwise noted: +25ºC, +5V, 125 mA, 50 Ω system on TriQuint’s TQP3M9019-PCB_IF evaluation board. Frequency MHz 70 100 200 500 Gain Input Return Loss Output Return Loss Output P1dB OIP3 [1] Noise Figure [2] dB dB dB dBm dBm dB 27 12 11 +21.6 +37.6 1.4 26.8 13 11 +21.9 +38.8 1.3 26.4 13 12 +21.9 +39 0.9 25.8 13 13 +22.2 +41.4 0.9 Notes: 1. OIP3 measured with two tones at an output power of +3 dBm / tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the OIP3 using 2:1 rule. IF Performance Plots (TQP3M9019-PCB_IF) Gain vs. Frequency over Temp S11 vs. Frequency over Temp 0 28 -40 C -20 ⁰C +25 C +85 C -5 S11 (dB) Gain (dB) 24 -40 C -20 ⁰C +25 C +85 C 20 -10 -15 16 -20 0 100 200 300 400 500 0 100 Frequency (MHz) 300 400 500 Frequency (MHz) S22 vs. Frequency over Temp Noise Figure vs. Frequency over Temp 0 4 -40 C +20 C +25 C +85 ⁰C 3 +85 C NF (dB) -5 S22 (dB) 200 -10 -15 +25 C 2 -40 C 1 -20 0 0 100 200 300 400 500 Frequency (MHz) Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. 0 100 200 300 400 500 Frequency (MHz) - 6 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block IF Performance Plots (TQP3M9019-PCB_IF) OIP3 vs. Frequency over Temp P1dB vs. Frequency over Temp 1 MHz Spacing, 3 dBm/tone 24 45 22 35 P1dB (dB) OIP3 (dBm) 40 -40 C +25 C +85 C 30 20 -40 C +25 C +85 C 18 16 14 25 0 100 200 300 Pout / tone (dBm) Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. 400 500 0 100 200 300 400 500 Frequency (MHz) - 7 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Pin Description Pin Symbol Description 2 RF Input Input, matched to 50 ohms. External DC Block is required. 11 Vdd / RFout All other pins GND Output, matched to 50 ohms, External DC Block is required and supply voltage These pins are not connected internally but are recommended to be grounded on the PCB for optimal isolation. Backside Paddle. Multiple vias should be employed to minimize inductance and thermal resistance; see page 7 for suggested footprint. GND Paddle Applications Information PC Board Layout Top RF layer is .014” NELCO N4000-13, єr = 3.9, 4 total layers (0.062” thick) for mechanical rigidity. Metal layers are 1-oz copper. 50 ohm Microstrip line details: width = .029”, spacing = .035”. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, Refer to www.TriQuint.com Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. - 8 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Mechanical Information Package Information and Dimensions This package is lead-free/RoHS-compliant. The plating material on the leads is annealed matte tin. It is compatible with both leadfree (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes. The component will be marked with an “9019” designator with an alphanumeric lot code on the top surface of package. TriQuint 9019 YYWW aXXXX Mounting Configuration All dimensions are in millimeters (inches). Angles are in degrees. Notes: 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. - 9 of 10 - Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network® TQP3M9019 High Linearity LNA Gain Block Product Compliance Information ESD Information Solderability Compatible with the latest version of J-STD-020, Lead free solder, 260° ESD Rating: Value: Test: Standard: Class 1A Passes 250V to < 500 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101 This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free MSL Rating Level 1 at +260 °C convection reflow The part is rated Moisture Sensitivity Level 1 at 260°C per JEDEC standard IPC/JEDEC J-STD-020. Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Data Sheet: Rev J 11/01/11 © 2010 TriQuint Semiconductor, Inc. - 10 of 10 Disclaimer: Subject to change without notice Connecting the Digital World to the Global Network®