IRGR4045DPbF INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE C VCES = 600V Features IC 6.0A, TC = 100°C Low VCE (on) Trench IGBT Technology Low Switching Losses Maximum Junction temperature 175 °C 5μs SCSOA Square RBSOA 100% of the parts tested for ILM Positive VCE (on) Temperature Coefficient. Ultra Fast Soft Recovery Co-pak Diode Tighter Distribution of Parameters Lead-Free, RoHS Compliant Tjmax = 175°C G VCE(on) typ. 1.7V E n-channel C E Benefits G High Efficiency in a Wide Range of Applications Suitable for a Wide Range of Switching Frequencies due to Low VCE (ON) and Low Switching Losses Rugged Transient Performance for Increased Reliability Excellent Current Sharing in Parallel Operation Low EMI D-Pak IRGR4045DPbF G Gate C Colletor E Emitter Absolute Maximum Ratings Parameter VCES Collector-to-Emitter Breakdown Voltage IC@ TC = 25°C IC@ TC = 100°C ICM Continuous Collector Current Continuous Collector Current Pulsed Collector Current, VGE = 15V ILM IF@TC=25°C IF@TC=100°C IFM Clamped Inductive Load Current, VGE = 20V Diode Continuous Forward Current Diode Continuous Forward Current Diode Maximum Forward Current VGE PD @ TC =25° PD @ TC =100° TJ TSTG Units Max. 600 12 V 6.0 18 24 c A 8.0 4.0 24 d ± 20 ± 30 77 39 Continuous Gate-to-Emitter Voltage Transient Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and V W °C -55 to + 175 Storage Temperature Range Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case) Thermal Resistance Parameter R JC R JC R JA R JA e e Junction-to-Case - IGBT Junction-to-Case - Diode Junction-to-Ambient (PCB Mount) Junction-to-Ambient g Min. Typ. Max. ––– ––– 1.9 ––– ––– ––– ––– ––– ––– 6.8 50 110 Units °C/W *Qualification standards can be found at http://www.irf.com/ 1 www.irf.com October 10, 2012 IRGR4045DPbF Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter V(BR)CES Collector-to-Emitter BreakdownVoltage V(BR)CE S/T J Min. Typ. Max. Units 600 — — T emperature Coeff. of B reakdown Voltage — 0.36 — — 1.7 2.0 VCE(on) Collector-to-Emitter Saturation Voltage — 2.07 — — 2.14 — VGE(th) Gate Threshold Voltage 3.5 — 6.5 VGE (th)/T J Threshold Voltage temp. coefficient — -13 — gfe Forward Transconductance — 5.8 — S — — 25 μA — — 250 — 1.60 2.30 — 1.30 — — — ±100 ICES VFM IGES Collector-to-Emitter Leakage Current Diode Forward Voltage Drop Gate-to-Emitter Leakage Current V Conditions V GE = 0V, Ic =100 μA f o V/°C V GE = 0V, Ic = 250μA ( 25 -175 C ) V IC = 6.0A, V GE = 15V, TJ = 25°C IC = 6.0A, V GE = 15V, TJ = 150°C V IC = 6.0A, V GE = 15V, TJ = 175°C V CE = V GE, IC = 150μA R ef . F i g f CT 6 5,6,7,9, 10 ,11 9,10,11,12 o mV/°C V CE = V GE, IC = 250μA ( 25 -175 C ) V CE = 25V, IC = 6.0A, PW =80s V GE = 0V,V CE = 600V V GE = 0V, V CE = 600V, TJ =175°C V IF = 6.0A nA IF = 6.0A, TJ = 175°C V GE = ± 20 V 8 Switching Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Qg Total Gate Charge (turn-on) Qge Gate-to-Emitter Charge (turn-on) Qgc Gate-to-Collector Charge (turn-on) h Units Min. Typ. Max. — 13 19.5 — 3.1 4.65 — 6.4 9.6 Eon Turn-On Switching Loss — 56 86 Eoff Turn-Off Switching Loss — 122 143 Etotal Total Switching Loss — 178 229 td(on) Turn-On delay time — 27 35 tr Rise time — 11 15 td(off) Turn-Off delay time — 75 93 tf Fall time — 17 22 Eon Turn-On Switching Loss — 140 — Eoff Turn-Off Switching Loss — 189 — Etotal Total Switching Loss — 329 — td(on) Turn-On delay time — 26 — tr Rise time — 12 — td(off) Turn-Off delay time — 95 — tf Fall time — 32 — Cies Input Capacitance — 350 — Coes Output Capacitance — 29 — Cres Reverse Transfer Capacitance — 10 — nC Conditions IC = 6.0A 24 VCC = 400V CT 1 VGE = 15V IC = 6.0A, VCC = 400V, VGE = 15V μJ RG = 47, L=1mH, LS = 150nH, TJ = 25°C Reverse Bias Safe Operating Area CT 4 E nergy los s es include tail and diode revers e recovery IC = 6.0A, VCC = 400V ns RG = 47, L=1mH, LS = 150nH CT 4 TJ = 25°C IC = 6.0A, VCC = 400V, VGE = 15V μJ 13,15 RG = 47, L=1mH, LS = 150nH, TJ = 175°C E nergy los s es include tail and diode revers e recovery IC = 6.0A, VCC = 400V ns RG = 47, L=1mH, LS = 150nH TJ = 175°C VGE = 0V pF CT 4 WF 1,WF 2 14,16 CT 4 WF 1,WF 2 23 VCC = 30V f = 1Mhz TJ = 175°C, IC = 24A RBSOA R ef . F i g FULL SQUARE VCC = 500V, Vp =600V 4 CT 2 RG = 100, VGE = +20V to 0V VCC = 400V, Vp =600V 22 SCSOA Short Circuit Safe Operating Area — 5 — μs Erec Reverse recovery energy of the diode — 178 — μJ TJ = 175 C trr Diode Reverse recovery time — 74 — ns VCC = 400V, IF = 6.0A 20,21 Irr Peak Reverse Recovery Current — 12 — A VGE = 15V, Rg = 47, L=1mH, LS=150nH WF 3 RG = 100, VGE = +15V to 0V o CT 3, WF 4 17,18,19 Notes: VCC = 80% (VCES ), VGE = 15V, L = 1.0mH, RG = 47 Pulse width limited by max. junction temperature. R is measured at T J approximately 90°C. Refer to AN-1086 for guidelines for measuring V(BR)CES safely. When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. Maximum limits are based on statistical sample size characterization. 2 www.irf.com IRGR4045DPbF 14 80 12 70 60 10 50 Ptot (W) IC (A) 8 6 40 30 4 20 2 10 0 0 0 20 40 60 80 100 120 140 160 180 0 20 40 60 80 100 120 140 160 180 T C (°C) T C (°C) Fig. 1 - Maximum DC Collector Current vs. Case Temperature Fig. 2 - Power Dissipation vs. Case Temperature 100 100 10μsec 10 10 IC A) IC (A) 100μsec DC 1 1 Tc = 25°C Tj = 175°C Single Pulse 0 0.1 1 10 100 10 1000 100 VCE (V) VCE (V) Fig. 4 - Reverse Bias SOA TJ = 175°C, VGE = 20V Fig. 3 - Forward SOA, TC = 25°C, TJ 175°C, VGE = 15V 20 20 Top V = 18V GE V = 15V GE VGE = 12V 15 V = 10V GE Bottom VGE = 8.0V 10 ICE (A) ICE (A) 15 5 Top Bottom 10 V = 18V GE V = 15V GE V = 12V GE V = 10V GE V = 8.0V GE 5 0 0 0 www.irf.com 1000 2 4 6 8 10 0 2 4 6 8 10 VCE (V) VCE (V) Fig. 5 - Typ. IGBT Output Characteristics TJ = -40°C; tp = 80μs Fig. 6 - Typ. IGBT Output Characteristics TJ = 25°C; tp = 80μs 3 IRGR4045DPbF 20 Top Bottom 18 16 -40°C 25°C 175°C 14 12 IF (A) ICE (A) 15 20 V = 18V GE V = 15V GE V = 12V GE V = 10V GE V = 8.0V GE 10 10 8 6 5 4 2 0 0 0 2 4 6 8 10 0.0 1.0 2.0 VF (V) VCE (V) Fig. 8 - Typ. Diode Forward Characteristics tp = 80μs 10 10 8 8 ICE = 3.0A VCE (V) VCE (V) Fig. 7 - Typ. IGBT Output Characteristics TJ = 175°C; tp = 80μs 6 ICE = 6.0A ICE = 12A 4 2 6 ICE = 3.0A ICE = 6.0A ICE = 12A 4 2 0 0 5 10 15 20 5 10 VGE (V) 20 Fig. 10 - Typical VCE vs. VGE TJ = 25°C 20 IC, Collector-to-Emitter Current (A) 10 8 VCE (V) 15 VGE (V) Fig. 9 - Typical VCE vs. VGE TJ = -40°C ICE = 3.0A ICE = 6.0A 6 ICE = 12A 4 2 18 T J = 25°C T J = 175°C 16 14 12 10 8 6 4 2 0 0 5 10 15 VGE (V) Fig. 11 - Typical VCE vs. VGE TJ = 175°C 4 3.0 20 4 6 8 10 12 14 16 VGE, Gate-to-Emitter Voltage (V) Fig. 12 - Typ. Transfer Characteristics VCE = 50V; tp = 10μs www.irf.com IRGR4045DPbF 400 1000 350 Swiching Time (ns) Energy (μJ) 300 250 200 EOFF 150 tdOFF 100 tF tdON 10 tR EON 100 50 1 0 2 4 6 8 10 12 14 2 4 8 10 12 14 IC (A) IC (A) Fig. 14 - Typ. Switching Time vs. IC TJ = 175°C; L=1mH; VCE= 400V RG= 47; VGE= 15V Fig. 13 - Typ. Energy Loss vs. IC TJ = 175°C; L = 1mH; VCE = 400V, RG = 47; VGE = 15V. 220 1000 200 EOFF Swiching Time (ns) 180 Energy (μJ) 6 160 EON 140 120 tdOFF 100 tF tdON 10 tR 100 80 60 1 0 25 50 75 100 125 0 25 Fig. 15 - Typ. Energy Loss vs. RG TJ = 175°C; L = 1mH; VCE = 400V, ICE = 6.0A; VGE = 15V 100 125 Fig. 16- Typ. Switching Time vs. RG TJ = 175°C; L=1mH; VCE= 400V ICE= 6.0A; VGE= 15V 22 30 20 25 RG = 10 18 20 16 15 IRR (A) IRR (A) 75 RG () Rg () RG = 22 10 RG = 47 5 RG = 100 14 12 10 8 6 0 2 4 6 8 10 12 IF (A) Fig. 17 - Typical Diode IRR vs. IF TJ = 175°C www.irf.com 50 14 0 25 50 75 100 125 RG ( Fig. 18 - Typical Diode IRR vs. RG TJ = 175°C; IF = 6.0A 5 IRGR4045DPbF 1200 20 18 1000 12A 10 QRR (nC) IRR (A) 16 14 12 22 800 47 6.0A 600 10 100 400 3.0A 8 200 6 0 200 400 600 800 1000 0 1200 500 1500 diF /dt (A/μs) diF /dt (A/μs) Fig. 20 - Typical Diode QRR VCC= 400V; VGE= 15V; TJ = 175°C Fig. 19- Typical Diode IRR vs. diF/dt VCC= 400V; VGE= 15V; ICE= 6.0A; TJ = 175°C 50 20 350 300 40 Time (μs) RG = 47 10 30 5 20 Current (A) Isc RG = 22 200 Tsc 15 RG = 10 250 Energy (μJ) 1000 150 RG = 100 100 10 0 50 2 4 6 8 10 12 8 14 10 12 IF (A) 18 Fig. 22- Typ. VGE vs. Short Circuit Time VCC=400V, TC =25°C 1000 16 VGE, Gate-to-Emitter Voltage (V) Cies Capacitance (pF) 16 VGE (V) Fig. 21 - Typical Diode ERR vs. IF TJ = 175°C 100 Coes 10 Cres 1 V CES = 400V 14 V CES = 300V 12 10 8 6 4 2 0 0 100 200 300 400 VCE (V) Fig. 23- Typ. Capacitance vs. VCE VGE= 0V; f = 1MHz 6 14 500 0 2 4 6 8 10 12 14 Q G, Total Gate Charge (nC) Fig. 24 - Typical Gate Charge vs. VGE ICE = 6.0A, L=600μH www.irf.com IRGR4045DPbF Thermal Response ( Z thJC ) 10 1 D = 0.50 0.20 0.10 0.05 0.1 J 0.02 0.01 R1 R1 J 1 R3 R3 Ri (°C/W) i (sec) R4 R4 C 2 1 2 3 3 4 4 Ci= iRi Ci iRi SINGLE PULSE ( THERMAL RESPONSE ) 0.01 R2 R2 0.0301 0.000004 0.7200 0.000067 0.7005 0.000898 0.4479 0.005416 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.001 1E-006 1E-005 0.0001 0.001 0.01 0.1 t1 , Rectangular Pulse Duration (sec) Fig 25. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT) 10 Thermal Response ( Z thJC ) D = 0.50 0.20 1 0.10 0.05 J 0.02 0.1 0.01 R1 R1 J 1 R2 R2 R3 R3 C 2 1 2 3 3 Ci= iRi Ci iRi SINGLE PULSE ( THERMAL RESPONSE ) 0.01 1E-006 1E-005 0.0001 Ri (°C/W) i (sec) R4 R4 4 4 0.2056 0.000019 1.4132 0.000095 3.3583 0.001204 1.8245 0.009127 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig. 26. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE) www.irf.com 7 IRGR4045DPbF L L DUT 0 1K Fig.C.T.1 - Gate Charge Circuit (turn-off) Fig.C.T.3 - S.C.SOA Circuit Fig.C.T.5 - Resistive Load Circuit 8 VCC 80 V + - DUT Rg 480V Fig.C.T.2 - RBSOA Circuit Fig.C.T.4 - Switching Loss Circuit Fig.C.T.6 - Typical Filter Circuit for V(BR)CES Measurement www.irf.com IRGR4045DPbF 600 12 600 500 10 500 400 8 400 6 300 90% ICE 200 4 5% ICE 100 VCE (V) VCE (V) tf 300 30 25 tr TEST CURRENT 90% test current 2 100 0 0 -2 -100 10 10% test current 0 0.2 0.4 0.6 0.8 0 Fig. WF1 - Typ. Turn-off Loss Waveform @ TJ = 175°C using Fig. CT.4 100 t RR -5 -400 -10 -500 -15 -20 0.05 0.15 0.25 time (µS) WF.3- Typ. Diode Recovery Waveform @ TJ = 175°C using CT.4 www.irf.com Vce (V) VF (V) 10% Peak IRR Peak IRR -600 -0.05 450 5 0 80 500 10 QRR -200 -300 4.7 Fig. WF2 - Typ. Turn-on Loss Waveform @ TJ = 175°C using Fig. CT.4 15 -100 4.5 -5 time (µs) time(µs) 0 Eon Loss 4.3 1 5 5% VCE Eoff Loss -100 -0.2 15 200 5% VCE 0 20 VCE 70 400 60 350 50 300 40 250 200 ICE 30 20 150 10 100 0 50 -10 0 -20 -2 -1 0 1 2 3 4 5 6 7 8 Time (uS) WF.4- Typ. Short Circuit Waveform @ TJ = 25°C using CT.3 9 IRGR4045DPbF D-Pak (TO-252AA) Package Outline Dimensions are shown in millimeters (inches) D-Pak (TO-252AA) Part Marking Information 1RWHV7KLVSDUWPDUNLQJLQIRUPDWLRQDSSOLHVWRGHYLFHVSURGXFHGEHIRUH (;$03/( 7+,6,6$1,5)5 :,7+$66(0%/< /27&2'(83 ,17(51$7,21$/ 5(&7,),(5 /2*2 ,5)8 8 3 '$7(&2'( <($5 :((. $66(0%/< /27&2'( 1RWHV7KLVSDUWPDUNLQJLQIRUPDWLRQDSSOLHVWRGHYLFHVSURGXFHGDIWHU (;$03/( 7+,6,6$1,5)5 :,7+$66(0%/< /27&2'( $66(0%/('21:: 3$57180%(5 ,17(51$7,21$/ 5(&7,),(5 /2*2 ,17+($66(0%/</,1($ ,5)8 $ '$7(&2'( <($5 :((. /,1($ $66(0%/< /27&2'( Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 www.irf.com IRGR4045DPbF D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches) TR TRR 16.3 ( .641 ) 15.7 ( .619 ) 12.1 ( .476 ) 11.9 ( .469 ) FEED DIRECTION TRL 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 13 INCH 16 mm NOTES : 1. OUTLINE CONFORMS TO EIA-481. Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. 10/2012 www.irf.com 11