This product complies with the RoHS Directive (EU 2002/95/EC). DSC9G02 Silicon NPN epitaxial planar type For high-frequency amplification DSC5G02 in SSMini3 type package Features Package High forward current transfer ratio hFE with excellent linearity High transition frequency fT Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Code SSMini3-F3-B Pin Name 1. Base 2. Emitter 3. Collector Packaging Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Marking Symbol: C5 Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 30 V Collector-emitter voltage (Base open) VCEO 20 V Emitter-base voltage (Collector open) VEBO 3 V Collector current IC 15 mA Collector power dissipation PC 125 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 mA, IE = 0 30 V Emitter-base voltage (Collector open) VEBO IE = 10 mA, IC = 0 3 V Base-emitter voltage VBE VCE = 6 V, IC = 1 mA Forward current transfer ratio * hFE VCE = 6 V, IC = 1 mA 65 Transition frequency fT VCE = 6 V, IC = 1 mA 450 Reverse transfer capacitance (Common emitter) Cre Power gain Noise figure 0.72 V 260 650 MHz VCE = 6 V, IC = 1 mA , f = 10.7 MHz 0.6 pF PG VCE = 6 V, IC = 1 mA , f = 100 MHz 24 dB NF VCE = 6 V, IC = 1 mA , f = 100 MHz 3.3 dB Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Code C D 0 Rank C D No-rank hFE 65 to 160 100 to 260 65 to 260 Marking Symbol C5C C5D C5 Product of no-rank is not classified and have no marking symbol for rank. Publication date: September 2010 Ver. AED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DSC9G02 DSC9G02_PC-Ta DSC9G02_IC-VCE PC Ta IC VCE 100 75 50 25 0 40 80 120 160 16 IB = 120 µA 8 4 0 200 110 µA 100 µA 90 µA 80 µA 70 µA 60 µA 50 µA 40 µA 30 µA 12 Ambient temperature Ta (°C) 0 2 4 Collector current IC (mA) Collector-emitter saturation voltage VCE(sat) (V) 1 Ta = 85°C −30°C 1 10 102 Collector current IC (mA) Ta = 85°C 10 −30°C 5 0 0 0.2 0.4 Transition frequency fT (MHz) 1 200 800 400 10 102 Collector current IC (mA) 2 0.6 0.8 1.0 Base-emitter voltage VBE (V) VCE = 6 V Ta = 25°C 1 −30°C 80 40 Ver. AED 1 10 102 Collector current IC (mA) Cob VCB 15 fT IC 0 10−1 25°C DSC9G02_Cob-VCB 25°C DSC9G02_fT-IC 1 600 120 0 10−1 12 20 VCE = 6 V 10−2 10−1 Ta = 85°C IC VBE IC / IB = 10 25°C 10 160 DSC9G02_IC-VBE VCE(sat) IC 10−1 8 VCE = 6 V Collector-emitter voltage VCE (V) DSC9G02_VCEsat-IC 10 6 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 Forward current transfer ratio hFE Ta = 25°C 125 hFE IC 200 20 Collector current IC (mA) Collector power dissipation PC (mW) 150 DSC9G02_hFE-IC 1.2 2.0 IE = 0 f = 1 MHz Ta = 25°C 1.6 1.2 0.8 0.4 0 1 10 100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC). DSC9G02 SSMini3-F3-B Unit: mm +0.05 1.60 −0.03 +0.05 0.375 ±0.05 0.26 −0.02 (5°) 1.60 ±0.05 0.85 −0.03 +0.05 3 1 2 (0.50) +0.05 0.13 −0.02 (0.50) (0.45) 1.00 ±0.05 0 to 0.10 0.70 −0.03 +0.05 (5°) Ver. AED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202