PANASONIC DRC5114E0L

DRC5114E
Silicon NPN epitaxial planar type
For digital circuits
Complementary to DRA5114E
DRC2114E in SMini3 type package
Unit: mm
 Features
 Low collector-emitter saturation voltage VCE(sat)
 Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)

Marking Symbol: NB
 Packaging
DRC5114E0L Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)

Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
50
V
Collector-emitter voltage (Base open)
VCEO
50
V
Collector current
IC
100
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
1: Base
2: Emitter
3: Collector
Panasonic
JEITA
Code
B
SMini3-F2-B
SC-85

C
R1
R2
E
Resistance value
R1
10
kΩ
R2
10
kΩ

Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
50
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.5
mA
Forward current transfer ratio
hFE
VCE = 10 V, IC = 5 mA
Collector-emitter saturation voltage
VCE(sat)
IC = 10 mA, IB = 0.5 mA
Input voltage (ON)
VI(on)
VCE = 0.2 V, IC = 5 mA
Input voltage (OFF)
VI(off)
VCE = 5 V, IC = 100 µA
35

0.25
2.1
V
V
0.8
V
Input resistance
R1
–30%
10
+30%
kΩ
Resistance ratio
R1 / R2
0.8
1.0
1.2

Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: December 2012
Ver. DED
1
DRC5114E
DRC5114E_hFE-IC
DRC5114E_IC-VCE
DRC5114E_PT-Ta
PT  Ta
IC  VCE
200
hFE  IC
500
120
150
100
50
0
0
40
80
120
160
IB = 350 µA
300 µA
80
250 µA
60
200 µA
40
150 µA
20
100 µA
0
200
Ambient temperature Ta (°C)
50 µA
0
2
4
8
10
400
Ta = 85°C
300
25°C
200
−30°C
100
0
0.1
12
1
IC / IB = 20
100
DRC5114E_VIN-IO
IO  VIN
10
10
Collector current IC (mA)
DRC5114E_IO-VIN
VCE(sat)  IC
VIN  IO
100
VO = 5 V
VO = 0.2 V
Ta = 85°C
1
Ta = 85°C
0.1
−30°C
1
Input voltage VIN (V)
Output current IO (mA)
Collector-emitter saturation voltage VCE(sat) (V)
6
VCE = 10 V
Collector-emitter voltage VCE (V)
DRC5114E_VCEsat-IC
10
Forward current transfer ratio hFE
100
Collector current IC (mA)
Total power dissipation PT (mW)
Ta = 25°C
25°C
10−1
−30°C
10−2
10
25°C
−30°C
1
Ta = 85°C
25°C
0.01
0.1
1
10
Collector current IC (mA)
100
10−3
0
0.5
1.0
1.5
Input voltage VIN (V)
Ver. DED
2.0
0.1
0.1
1
10
100
Output current IO (mA)
2
DRC5114E
SMini3-F2-B
Unit: mm
 Land Pattern (Reference) (Unit: mm)
Ver. DED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
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equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
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the products may directly jeopardize life or harm the human body.
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Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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20100202