DMN32D4SDW - Diodes Incorporated

DMN32D4SDW
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) max
ID max
TA = +25°C
0.4Ω @ VGS = 10V
0.65A
0.7Ω @ VGS = 4.5V
0.52A
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•
•
•
•
Description
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high-efficiency power management applications.
Applications
•
•
•
•
Motor Control
Power Management Functions
DC-DC Converters
Backlighting
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
ESD Protected Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
•
•
•
•
•
•
Case: SOT363
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish  Matte Tin Annealed over Alloy42 Leadframe.
Solderable per MIL-STD-202, Method 208 e3
Weight: 0.006 grams (Approximate)
D1
SOT363
Gate Protection
Diode
ESD PROTECTED
Top View
D2
D2
G1
S1
S2
S2
G2
D1
G2
G1
Gate Protection
Diode
S1
Q2 N-CHANNEAL
Q1 N-CHANNEAL
Top View
Pin out
Ordering Information (Note 4)
Part Number
DMN32D4SDW-7
DMN32D4SDW-13
Notes:
Case
SOT363
SOT363
Packaging
3,000K/Tape & Reel
10,000K/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
SOT363
D2
G1
S1
N34 = Product Type Marking Code
YM = Date Code Marking
Y or Y= Year (ex: B = 2014)
M = Month (ex: 9 = September)
N34 YM
N34 YM
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
V(BR)DSS
30V
Features and Benefits
S2
Date Code Key
Year
Code
Month
Code
2014
B
Jan
1
G2
D1
2015
C
Feb
2
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
Mar
3
2016
D
Apr
4
May
5
2017
E
Jun
6
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2018
F
Jul
7
Aug
8
2019
G
Sep
9
Oct
O
2020
H
Nov
N
Dec
D
February 2015
© Diodes Incorporated
DMN32D4SDW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
TA = 25°C
TA = 70°C
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Symbol
VDSS
VGSS
Value
30
±20
Units
V
V
ID
0.65
0.50
A
IS
0.4
A
IDM
4
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Steady State
Steady State
Symbol
PD
RθJA
PD
RθJA
RθJC
TJ, TSTG
Value
0.29
420
0.35
360
128
-55 to 150
Units
W
°C/W
W
°C/W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
-
-
1
±10
V
µA
µA
VGS = 0V, ID = 250µA
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS (ON)
1.6
0.4
0.7
1.0
1.2
Ω
VSD
0.2
0.3
0.4
0.9
0.8
V
Static Drain-Source On-Resistance
0.8
-
VDS = VGS, ID = 250µA
VGS = 10V, ID = 0.25A
VGS = 4.5V, ID = 0.25A
VGS = 4.0V, ID = 0.25A
VGS = 2.5V, ID = 0.01A
VGS = 0V, IS = 0.23A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
50
10
6.8
114
0.6
1.3
0.2
0.1
2.8
3.2
26.3
22.8
-
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
V
Test Condition
VDS = 15V, VGS = 0V,
f = 1.0MHz
VDS = VGS = 0V,f = 1.0MHz
VDS = 10V,
ID = 250mA
VGS = 10V, VDS = 30V,
ID = 100mA, RG = 10Ω
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
2 of 6
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February 2015
© Diodes Incorporated
DMN32D4SDW
1.0
1
VGS = 10V
Vds = 5.0V
VGS = 5V
ID, DRAIN CURRENT (A)
I D, DRAIN CURRENT (A)
0.8
VGS = 4.5V
VGS = 4.0V
VGS = 3.5V
0.6
VGS = 3.0V
VGS = 2.5V
0.4
0.2
0.6
T A = 85°C
0.4
TA = 125°C
0.0
T A = 150°C
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.9
VGS = 2.5V
0.8
0.7
0.6
0.5
0.4
VGS = 4.5V
0.3
0.2
VGS = 10.0V
0.1
0
0
0.2
0.4
0.6
0.8
1
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( Ω)
1
T A = -55°C
0
1
2
3
4
V GS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristic
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TA = 25°C
0.2
VGS = 2.0V
5
2
1.8
I D = 250mA
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
I D, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
I D = 10mA
0
2
4
6
8
10 12 14
16 18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 TypicalTransfer Characteristic
20
1.6
0.7
RD S(ON ), DRAIN-SOURCE ON-RESIS TANCE
(Normalized)
0.8
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
0.8
Vgs = 4.5V
0.6
T A = 150°C
0.5
T A = 125°C
0.4
T A = 85°C
0.3
T A = 25°C
0.2
T A = -55°C
0.1
0
0
0.2
0.4
0.6
0.8
I D, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
1
VGS = 10.0V
1.4
I D = 500mA
VGS = 5.0V
1.2
I D = -300mA
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
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2
VG S(th ), GATE THRES HO LD VO LTAGE (V )
R DS(ON), DRAI N-SO URCE ON-RESISTANCE ( Ω)
0.5
VGS = 5V
0.4
I D = 300mA
0.3
VGS = 10V
I D = 500mA
0.2
0.1
0
-50
1.8
1.6
1.4
ID = 1mA
1.2
1
ID = 250µA
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( °C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
100
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( °C)
Figure 7 On-Resistance Variation with Temperature
1
CT , JUNCTION CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
0.9
0.8
0.7
TA = 85°C
0.6
0.5
T A = 125°C
T A = 25°C
0.4
0.3
TA = 150°C
0.2
TA = 55°C
C iss
C oss
10
Crss
0.1
f = 1MHz
0
0
0.2
0.4
0.6
0.8
1
VSD , SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
1
1.2
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
30
10
10
RDS(on)
Limited
PW = 100µs
8
6
4
VDS = 10V
I D = 250mA
-I D, DRAI N CURRENT (A)
V GS GATE THRESHOLD VOLTAGE (V)
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
DMN32D4SDW
1
DC
0.1
PW = 1ms
0.01
2
0
PW = 10s
PW = 1s
PW = 100ms
PW = 10ms
TJ (m ax ) = 150°C
TA = 25°C
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3
0.001
0.1
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
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V GS = 10V
Single Pulse
DUT on 1 * MRP Board
1
10
-VDS , DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
February 2015
© Diodes Incorporated
DMN32D4SDW
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
D = Single Pulse
RθJA = 415°C/W
Duty Cycle, D = t1/ t2
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
SOT363
Dim Min Max Typ
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D
0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J
0
0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0°
8°
α
All Dimensions in mm
B C
H
K
M
J
D
F
L
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
C1
G
Y
X
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
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© Diodes Incorporated
DMN32D4SDW
IMPORTANT NOTICE
NEW PRODUCT
ADVANCED
INFORMATION
ADVANCE
INFORMATION
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
DMN32D4SDW
Document number: DS36023 Rev. 2 - 2
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February 2015
© Diodes Incorporated