AO4264

AO4264
60V N-Channel AlphaMOS
General Description
Product Summary
VDS
• Trench Power AlphaMOS (αMOS MV) technology
• Low RDS(ON)
• Low Gate Charge
• Optimized for fast-switching applications
Applications
ID (at VGS=10V)
60V
12A
RDS(ON) (at VGS=10V)
< 11mΩ
RDS(ON) (at VGS=4.5V)
< 13.5mΩ
100% UIS Tested
100% Rg Tested
• Synchronus Rectification in DC/DC and AC/DC Converters
• Industrial and Motor Drive applications
SOIC-8
D
Top View
Bottom View
D
D
D
D
G
G
S
S
S
S
Orderable Part Number
Package Type
Form
Minimum Order Quantity
AO4264
SO-8
Tape & Reel
3000
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current
Pulsed Drain Current
Avalanche energy
VDS Spike
Power Dissipation B
L=0.1mH
C
10µs
TA=25°C
Thermal Characteristics
Parameter
A
Maximum Junction-to-Ambient
AD
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
Rev.1.0: March 2014
36
A
EAS
65
mJ
72
V
3.1
Steady-State
Steady-State
W
2.0
TJ, TSTG
Symbol
t ≤ 10s
A
IAS
PD
Junction and Storage Temperature Range
V
48
VSPIKE
TA=70°C
±20
9
IDM
Avalanche Current C
Units
V
12
ID
TA=70°C
C
Maximum
60
RθJA
RθJL
-55 to 150
Typ
31
59
16
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°C
Max
40
75
24
Units
°C/W
°C/W
°C/W
Page 1 of 5
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
Zero Gate Voltage Drain Current
IGSS
VGS(th)
Gate-Body leakage current
VDS=0V, VGS=±20V
Gate Threshold Voltage
VDS=VGS, ID=250µA
gFS
Forward Transconductance
VDS=5V, ID=12A
1.4
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
TJ=125°C
VGS=4.5V, ID=10A
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
f=1MHz
Qg(4.5V)
Total Gate Charge
Qgs
Gate Source Charge
Qgd
tD(on)
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=10V, VDS=30V, ID=12A
±100
nA
1.9
2.5
V
9.2
11
15.6
19
10.8
13.5
0.72
VGS=0V, VDS=30V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
Qg(10V)
µA
mΩ
mΩ
50
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Output Capacitance
V
5
VGS=10V, ID=12A
Static Drain-Source On-Resistance
Units
1
TJ=55°C
RDS(ON)
Max
60
VDS=60V, VGS=0V
IDSS
Coss
Typ
0.6
S
1
V
4
A
2007
pF
177
pF
12.5
pF
1.2
1.8
Ω
25.5
40
nC
11
20
nC
5.5
nC
Gate Drain Charge
2.5
nC
Turn-On DelayTime
8.5
ns
VGS=10V, VDS=15V, RL=1.25Ω,
RGEN=3Ω
3.5
ns
27
ns
3
ns
IF=12A, dI/dt=500A/µs
15
Body Diode Reverse Recovery Charge IF=12A, dI/dt=500A/µs
55
ns
nC
Body Diode Reverse Recovery Time
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev.1.0: March 2014
www.aosmd.com
Page 2 of 5
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
50
50
10V
VDS=5V
3.5V
40
40
4.5V
30
125°C
ID(A)
ID (A)
30
VGS=3V
20
20
25°C
10
10
0
0
0
1
2
3
4
0
5
1
3
4
5
6
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Figure 1: On-Region Characteristics (Note E)
20
Normalized On-Resistance
2
15
RDS(ON) (mΩ)
2
VGS=4.5V
10
VGS=10V
5
1.8
VGS=10V
ID=12A
1.6
1.4
VGS=4.5V
ID=10A
1.2
1
0.8
0
0
5
10
15
20
0
25
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
1.0E+01
ID=12A
1.0E+00
20
1.0E-01
15
IS (A)
RDS(ON) (mΩ)
125°C
125°C
1.0E-02
10
1.0E-03
25°C
25°C
5
1.0E-04
0
1.0E-05
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Rev.1.0: March 2014
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0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
Page 3 of 5
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
2500
VDS=30V
ID=12A
Ciss
2000
Capacitance (pF)
VGS (Volts)
8
6
4
2
1500
1000
500
Coss
Crss
0
0
0
5
10
15
20
25
30
0
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
20
30
40
1000
10µs
TJ(Max)=150°C
TA=25°C
100µs
10µs
RDS(ON)
limited
1.0
Power (W)
ID (Amps)
1ms
0.1
60
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
10.0
50
10ms
100
10
TJ(Max)=150°C
TA=25°C
DC
0.0
0.01
0.1
1
10
VDS (Volts)
100
1000
1
0.0001 0.001 0.01
ZθJA Normalized Transient
Thermal Resistance
1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
VGS> or equal to 4.5V
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
10
0.1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=75°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Rev.1.0: March 2014
www.aosmd.com
Page 4 of 5
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
DUT
Vgs
90%
+ Vdd
VDC
-
Rg
10%
Vgs
Vgs
td(on)
tr
td(off)
ton
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
I AR
VDC
-
Rg
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Ig
Rev.1.0: March 2014
Vgs
L
Isd
+ Vdd
t rr
dI/dt
I RM
Vdd
VDC
-
IF
Vds
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Page 5 of 5