Top View Features Directly mounts to target PCB (needs tooling holes) with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes forces evenly Clamshell lid A 10 32.60mm [1.283"] Materials: Side View (Section AA) 4 43.32mm [1.706"] + IC thickness 1 Clam Shell Lid: Black anodized Aluminum. Height = 20 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 12 mm. 4 Compression Screw: Clear anodized Aluminum. Height = 27 mm, Fluted Knob 1 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 3 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 3/8" long. 8 Ball Guide: Kapton polyimide. 9 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 2 5 8 9 Customer's PCB 7 10 Latch: Black anodized Aluminum. 6 CG-BGA-4010 Drawing . © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 1.25:1 Rev: A Drawing: M.A. Fedde Date: 11/2/09 File: CG-BGA-4010 Dwg Modified: All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is offset by 0.375mm to the right of center with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1.250mm±0.125mm(x4) 1.250mm±0.125mm(x4) Socket Body Size 0.80mm typ. 2.538mm* 2.163mm 2.540mm Ø 0.850mm±0.025mm (x2) Alignment Hole Ø 0.36mmPAD 5.080mm Ø 1.61mm±0.05mm(x4) Mounting Hole 9.950mm 14.725mm(x4) 17.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish DXF DATA WILL BE PROVIDED CG-BGA-4010 Drawing . © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: A Drawing: M.A. Fedde Date: 11/2/09 File: CG-BGA-4010 Dwg Modified: Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 3 Compatible BGA Spec X DETAIL D Y DETAIL 5 0.25 Z Z 0.15 Z A A1 4 E 0.20 TOP VIEW SIDE VIEW DIM Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 3 Øb Ø0.25 Z X Y Ø0.10 5 MAX 2.5 A 1 A1 e MIN 0.34 0.2 b Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 0.50 D 12.00 BSC E 12.00 BSC e 0.80 BSC Parallelism measurement shall exclude any effect of mark on top surface of package. Array 14x14 BOTTOM VIEW CG-BGA-4010 Drawing . © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: A Drawing: M.A. Fedde Date: 11/2/09 File: CG-BGA-4010 Dwg Modified: PAGE 3 of 3