IRGP6660DPBF - International Rectifier

IRGP6660DPbF
IRGP6660D-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 600V
C
C
C
IC = 60A, TC =100°C
tSC ≥ 5µs, TJ(max) = 175°C
G
G
VCE(ON) typ. = 1.7V @ IC = 48A
E
E
G
G
Gate
C
Collector
Features
Benefits
High efficiency in a wide range of applications
Optimized diode for full bridge hard switch converters
Optimized for welding and H bridge converters
Improved reliability due to rugged hard switching
performance and higher power capability
Square RBSOA and maximum junction temperature 175°C
5µs short circuit SOA
Enables short circuit protection scheme
Positive VCE (ON) temperature coefficient
Excellent current sharing in parallel operation
Lead-free, RoHS compliant
Environmentally friendly
Package Type
IRGP6660DPBF
IRGP6660D-EPBF
TO-247AC
TO-247AD
E
E
Emitter
Low VCE(ON) and switching losses
Base part number
C
IRGP6660D-EPbF
TO-247AD
IRGP6660DPbF
TO-247AC
n-channel
Applications
• Welding
• H Bridge Converters
C
Standard Pack
Form
Quantity
Tube
25
Tube
25
Orderable Part Number
IRGP6660DPBF
IRGP6660D-EPBF
Absolute Maximum Ratings
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IFRM @ TC = 100°C
IFM
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Parameter
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulse Collector Current, VGE = 15V
Clamped Inductive Load Current, VGE = 20V 
Diode Repetitive Peak Forward Current
Diode Maximum Forward Current 
Continuous Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Max.
600
95
60
144
192
30
192
±20
330
167
-40 to +175
Units
V
A
V
W
C
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
Thermal Resistance
RθJC (IGBT)
RθJC (Diode)
RθCS
RθJA
1
Parameter
Thermal Resistance Junction-to-Case-(each IGBT) 
Thermal Resistance Junction-to-Case-(each Diode) 
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min.
–––
–––
–––
–––
Typ.
–––
–––
0.24
–––
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Max.
0.45
3.35
–––
40
Units
°C/W
November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
ΔV(BR)CES/ΔTJ
Parameter
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
600
—
Typ.
—
0.65
—
1.65
—
2.05
—
2.10
VGE(th)
Gate Threshold Voltage
4.0
—
Threshold Voltage Temperature Coeff.
—
-17
ΔVGE(th)/ΔTJ
gfe
Forward Transconductance
—
33
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
630
Gate-to-Emitter Leakage Current
—
—
IGES
—
1.8
Diode Forward Voltage Drop
VFM
—
1.3
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max.
—
—
Units
Conditions
V
VGE = 0V, IC = 150µA 
V/°C VGE = 0V, IC = 2mA (25°C-175°C)
1.95
IC = 48A, VGE = 15V, TJ = 25°C
V
—
IC = 48A, VGE = 15V, TJ = 150°C
—
IC = 48A, VGE = 15V, TJ = 175°C
6.5
V
VCE = VGE, IC = 1.4mA
—
mV/°C VCE = VGE, IC = 1.4mA (25°C-175°C)
—
S
VCE = 50V, IC = 48A, PW = 20µs
75
µA VGE = 0V, VCE = 600V
—
VGE = 0V, VCE = 600V, TJ = 175°C
±100
nA VGE = ±20V
2.8
V
IF = 8.0A
—
IF = 8.0A, TJ = 175°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Parameter
Total Gate Charge
Gate-to-Emitter Charge
Gate-to-Collector Charge
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
5
—
—
µs
Erec
trr
Irr
Reverse Recovery Energy of the Diode
Diode Reverse Recovery Time
Peak Reverse Recovery Current
—
—
—
135
70
22
—
—
—
µJ
ns
A
Min.
—
—
—
—
—
—
—
—
—
—
—
Typ.
95
28
35
0.6
1.3
1.9
60
50
155
30
0.78
Max
—
—
—
—
—
—
—
—
—
—
—
Units
—
—
—
—
—
—
—
—
—
1.6
2.38
45
55
160
60
2970
175
85
—
—
—
—
—
—
—
—
—
mJ
nC
mJ
ns
ns
pF
FULL SQUARE
Conditions
IC = 48A
VGE = 15V
VCC = 400V
IC = 48A, VCC = 400V, VGE=15V
RG = 10Ω, L = 210µH, TJ = 25°C
Energy losses include tail & diode
reverse recovery 
IC = 48A, VCC = 400V, VGE=15V
RG = 10Ω, L = 210µH, TJ = 175°C
Energy losses include tail & diode
reverse recovery 
VGE = 0V
VCC = 30V
f = 1.0MHz
TJ = 175°C, IC = 192A
VCC = 480V, Vp ≤ 600V
VGE = +20V to 0V
TJ = 150°C,VCC = 400V, Vp ≤ 600V
VGE = +15V to 0V
TJ = 175°C
VCC = 400V, IF = 8.0A
VGE = 15V, Rg = 10Ω
Notes:






VCC = 80% (VCES), VGE = 20V, L = 210µH, RG = 10Ω.
Rθ is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement.
fsw =40KHz, refer to figure 26.
2
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
100
For both:
Duty cycle : 50%
Tj = 175°C
Tcase = 100°C
Gate drive as specified
Power Dissipation = 167W
90
Load Current ( A )
80
70
60
Square Wave:
VCC
50
I
40
30
Diode as specified
20
0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
350
300
80
250
200
Ptot (W)
IC (A)
60
40
150
100
20
50
0
0
25
50
75
100
125
150
175
25
TC (°C)
50
75
100
125
150
175
TC (°C)
Fig. 3 - Power Dissipation vs.
Case Temperature
Fig. 2 - Maximum DC Collector Current vs.
Case Temperature
1000
100
10µsec
100µsec
1msec
100
IC (A)
IC (A)
10
DC
10
1
Tc = 25°C
Tj = 175°C
Single Pulse
1
0.1
1
10
100
VCE (V)
Fig. 4 - Forward SOA
TC = 25°C; TJ ≤ 175°C; VGE = 15V
3
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10
100
1000
V CE (V)
Fig. 5 - Reverse Bias SOA
TJ = 175°C; VGE = 20V
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
200
200
150
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
100
ICE (A)
ICE (A)
150
100
50
50
0
0
0
2
4
6
8
0
10
2
4
10
Fig. 6 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 20µs
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
200
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
175°C
25°C
-40°C
IF (A)
150
100
100
50
50
0
0
0
2
4
6
8
10
0.0
1.0
2.0
V CE (V)
7
6
6
V CE (V)
ICE = 24A
ICE = 48A
4
4.0
5.0
6.0
7.0
Fig. 9 - Typ. Diode Forward Voltage Drop
Characteristics
7
5
3.0
VF (V)
Fig. 8 - Typ. IGBT Output Characteristics
TJ = 175°C; tp = 20µs
V CE (V)
8
V CE (V)
150
ICE = 96A
3
5
ICE = 24A
ICE = 48A
4
ICE = 96A
3
2
2
1
1
0
0
5
10
15
20
V GE (V)
Fig. 10 - Typical VCE vs. VGE
TJ = -40°C
4
6
V CE (V)
200
ICE (A)
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
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5
10
15
20
V GE (V)
Fig. 11 - Typical VCE vs. VGE
TJ = 25°C
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
7
200
6
ICE = 24A
ICE = 48A
150
ICE = 96A
4
ICE (A)
V CE (V)
5
TJ = 25°C
TJ = 175°C
3
100
2
50
1
0
0
5
10
15
20
2
4
6
8
10
12
14
16
V GE (V)
V GE (V)
Fig. 12 - Typical VCE vs. VGE
TJ = 175°C
Fig. 13 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
6.0
1000
Swiching Time (ns)
5.0
Energy (mJ)
4.0
3.0
EOFF
2.0
1.0
tdOFF
tF
100
tdON
EON
tR
0.0
10
20
30
40
50
60
70
80
90
100
10
20
30
40
50
70
80
90 100
IC (A)
IC (A)
Fig. 14 - Typ. Energy Loss vs. IC
TJ = 175°C; L = 210µH; VCE = 400V, RG = 10Ω; VGE = 15V
Fig. 15 - Typ. Switching Time vs. IC
TJ = 175°C; L = 210µH; VCE = 400V, RG = 10Ω; VGE = 15V
1000
5.0
tdOFF
Swiching Time (ns)
4.0
Energy (mJ)
60
EOFF
3.0
2.0
EON
tR
100
tF
tdON
1.0
10
0.0
0
20
40
60
80
100
RG ( Ω )
Fig. 16 - Typ. Energy Loss vs. RG
TJ = 175°C; L = 210µH; VCE = 400V, ICE = 48A; VGE = 15V
5
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0
20
40
60
80
100
RG ( Ω )
Fig. 17 - Typ. Switching Time vs. RG
TJ = 175°C; L = 210µH; VCE = 400V, ICE = 48A; VGE = 15V
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IRGP6660DPbF/IRGP6660D-EPbF
30
25
25
20
20
IRR (A)
IRR (A)
RG = 10Ω
RG = 22Ω
15
RG = 47Ω
15
10
10
RG = 100Ω
5
5
4
6
8
10
12
14
16
18
0
20
40
60
80
100
IF (A)
RG ( Ω)
Fig. 18 - Typ. Diode IRR vs. IF
TJ = 175°C
Fig. 19 - Typ. Diode IRR vs. RG
TJ = 175°C
25
1250
16A
20
1000
22Ω
QRR (nC)
IRR (A)
47Ω
15
10
500
5
250
0
200
400
600
800
1000
100Ω
750
8.0A
4.0A
0
1200
200
400
600
800
1200
diF /dt (A/µs)
Fig. 20 - Typ. Diode IRR vs. diF/dt
VCC = 400V; VGE = 15V; IF = 8.0A; TJ = 175°C
Fig. 21 - Typ. Diode QRR vs. diF/dt
VCC = 400V; VGE = 15V; TJ = 175°C
25
500
RG = 10Ω
20
RG = 22Ω
200
Time (µs)
RG = 47Ω
150
RG = 100Ω
100
Isc
Tsc
400
15
300
10
200
5
100
0
50
0
5
10
15
20
25
IF (A)
Fig. 22 - Typ. Diode ERR vs. IF
TJ = 175°C
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Current (A)
Energy (µJ)
1000
diF /dt (A/µs)
250
6
10Ω
0
9
10
11
12
13
14
15
16
V GE (V)
Fig. 23 - VGE vs. Short Circuit Time
VCC = 400V; TC = 25°C
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IRGP6660DPbF/IRGP6660D-EPbF
10000
V GE, Gate-to-Emitter Voltage (V)
16
Capacitance (pF)
Cies
1000
100
Coes
Cres
10
V CES = 400V
14
V CES = 300V
12
10
8
6
4
2
0
0
100
200
300
400
500
600
0
10 20 30 40 50 60 70 80 90 100
V CE (V)
Q G, Total Gate Charge (nC)
Fig. 25 - Typical Gate Charge vs. VGE
ICE = 48A
Fig. 24 - Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
70
D=0.1
Repetitive Peak Current (A)
60
50
D=0.2
40
30
D=0.3
20
10
0
100
125
150
175
Case Temperature (°C)
Fig. 26 - Typical Gate Charge vs. VGE
Thermal Response ( Z thJC )
1
D = 0.50
0.1
0.20
0.10
0.05
τJ
0.02
0.01
0.01
R1
R1
τJ
τ1
R2
R2
R3
R3
R4
R4
τC
τ2
τ1
τ2
τ3
τ4
τ3
τ4
Ci= τi/Ri
Ci= τi/Ri
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
τC
Ri (°C/W)
τi (sec)
0.007832
0.000007
0.117473
0.000170
0.181692
0.003719
0.142534
0.023371
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
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IRGP6660DPbF/IRGP6660D-EPbF
Thermal Response ( Z thJC )
10
D = 0.50
1
0.20
0.10
0.05
0.1
0.02
0.01
τJ
R1
R1
τJ
τ1
R2
R2
R3
R3
R4
R4
τC
τ2
τ1
τ2
τ3
τ3
τ4
τ4
Ci= τi/Ri
Ci= τi/Ri
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
τC
Ri (°C/W)
τi (sec)
0.116586
0.000047
1.136344
0.000298
1.434449
0.002865
0.664097
0.026578
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 28 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
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IRGP6660DPbF/IRGP6660D-EPbF
L
L
VCC
DUT
0
80 V +
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
L
4X
DC
VCC
-5V
DUT /
DRIVER
DUT
VCC
Rg
RSH
Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
C force
R=
VCC
ICM
100K
D1
22K
C sense
DUT
VCC
G force
DUT
0.0075µF
Rg
E sense
E force
Fig.C.T.5 - Resistive Load Circuit
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Fig.C.T.6 - BVCES Filter Circuit
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
400
90% ICE
500
80
400
60
300
60
200
40
40
200
10% VCE
10% ICE
Eon Loss
Eoff Loss
-0.3
0
0
0
-0.5
-20
-100
-20
-0.6
-0.2
-0.5
-0.4
-0.2
time (µs)
time(µs)
Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 175°C using Fig. CT.4
Fig. WF2 - Typ. Turn-on Loss Waveform
@ TJ = 175°C using Fig. CT.4
20
600
600
15
500
500
QRR
10
400
300
Vce (V)
0
-5
-10
VCE
400
tRR
5
IF (A)
20
10% VCE
0
-0.6
80
90% ICE
10% ICE
-100
100
TEST
CURRENT
100
20
100
tr
Peak
IRR
300
ICE
200
200
100
Ice (A)
VCE (V)
300
100
120
ICE (A)
tf
600
VCE (V)
500
120
ICE (A)
600
100
-15
0
-20
-100
-25
-0.2
0.1
0.3
0.6
time (µs)
Fig. WF3 - Typ. Diode Recovery Waveform
@ TJ = 175°C using Fig. CT.4
10
0
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-100
-5
0
5
10
time (µs)
Fig. WF4 - Typ. S.C. Waveform
@ TJ = 150°C using Fig. CT.3
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
11
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM B LED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
12
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November 14, 2014
IRGP6660DPbF/IRGP6660D-EPbF
Qualification Information†
Industrial
Qualification Level
(per JEDEC JESD47F) ††
Moisture Sensitivity Level
TO-247AC
N/A
TO-247AD
N/A
Yes
RoHS Compliant
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
Revision History
Date
11/14/2014
Comments
• Added IFM Diode Maximum Forward Current = 192A with the note  on page 1.
• Removed note from switching losses test condition on page 2.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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November 14, 2014