1460PTG Series

RoHS
RoHS
1460PTG Series
SEMICONDUCTOR
Nell High Power Products
Distributed Gate Thyristors
(Hockey PUK Version), 1460A
FEATURES
Distributed center amplifying gate
Metal case with ceramic insulator
lnternational standard case TO-200AC (K-PUK),
Nell’s D-type Capsule
Compliant to RoHS
Low on-state and switching losses
Fast turn-on time, tgt ≤ 3µs
di/dt > 1500 A/µs
TO-200AC(K-PUK)
(Nell’s D-type Capsule)
TYPICAL APPLICATIONS
DC and AC motor controls
Controlled DC power supplies
AC controllers
Ideal for Impulse Magnetizer
PRODUCT SUMMARY
IT(AV)
1460A
MAJOR RATINGS AND CHARACTERISTICS
TEST CONDITIONS
PARAMETER
VALUES
Double side cooled, single phase, 50Hz, 180° half-sine wave
IT(AV)
1460
A
55
ºC
2900
A
T hs
25
ºC
50 HZ
20
60 HZ
21
50 HZ
2000
60 HZ
1830
T hs
I T(RMS)
I TSM
UNIT
kA
I 2t
V DRM /V RRM
kA 2 s
1600 to 3200
t gt
Typical
2.0
Tq
Maximum
250
TJ
V
µs
-40 to 125
ºC
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE
NUMBER
VOLTAGE
CODE
VDRM/VRRM, MAXIMUM REPETITIVE
PEAK AND OFF-STATE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
16
1600
1700
18
1800
1900
20
2000
2100
24
2400
2500
26
2600
2700
30
3000
3100
32
3200
3300
1460PTGxxD0
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Page 1 of 8
lDRM/lRRM, MAXIMUM
AT TJ = TJ MAXIMUM
mA
100
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum average current
at heatsink temperature
Maximum RMS on-state current
TEST CONDITIONS
180° conduction, half sine wave
double side (single side) cooled
I T(AV)
I T(RMS)
DC at 25°C heatsink temperature double side cooled
t = 10ms
Maximum peak, one cycle
t = 8.3ms
I TSM
non-reptitive surge current
t = 8.3ms
t = 10ms
1460(630)
A
55/(85)
ºC
2900
A
No voltage
reapplied
20
100%V RRM
reapplied
16.8
No voltage
reapplied
t = 8.3ms
I 2t
t = 10ms
21
Sinusoidal half wave,
17.6
initial T J = T J maximum
2000
100%V RRM
reapplied
t = 8.3ms
I 2√t
Maximum l²√t for fusing
UNIT
KA
t = 10ms
Maximum l²t for fusing
VALUES
t = 0.1 to 10 ms, no voltage reapplied
1830
1411
1286
20000
Low level value of threshold voltage
V T(TO)1
(16.7% x π x l T(AV) < I < π x l T(AV) ),T J =T J maximum
1.25
High level value of threshold voltage
V T(TO)2
(I > π x l T(AV) ),T J =T J maximum
1.50
r t1
(16.7% x π x l T(AV) < I < π x l T(AV) ),T J =T J maximum
0.48
High level value on-state slope resistance
r t2
(I > π x l T(AV) ),T J =T J maximum
0.44
l pk =3000A, T J =T J maximum , t p = 10 ms sine pulse
2.90
V TM
Maximum holding current
lH
Typical latching current
lL
T J = 25°C, anode supply 12V resistive load
kA 2√s
V
Low level value on-state slope resistance
Maximum on-state voltage
kA 2 s
mΩ
V
1000
mA
1500
SWITCHING
PARAMETER
Minimum non-repetitive rate of rise
of turned-on current
SYMBOL
dl/dt
Typical turn-off time
tq
Maximum gate controlled turn-on
delay time
td
Maximum turn-on time
t gt
Typical reverse recovery time
t rr
Typical recovered charge
Q rr
Typical reverse recovery current
I rm
TEST CONDITIONS
V D = 67% V DRM , I FG = 2A,
T case =1 25°C
l TM = 1000A, T J =T J maximum, dl/dt = 60A/µs.
V R = 50V, dV/dt = 20 V/µs, V DR = 33% V DRM, t p = 1000µs
VALUES
UNIT
1500
A/µs
200
1.6
V D = 67% V DRM , I TM = 1000A, dl/dt = 60A/µs.
I FG = 2A, t r = 0.5µs, T J = 25°C
µs
3.0
9.5
I TM = 1000A, t p = 1000µs, dl/dt = 60A/µs.
V R = 50V
3500
µC
315
A
VALUES
UNIT
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
Minimum critical rate of rise of
off-state voltage
dV/dt
T J =T J maximum, linear to 80% rated V DRM
200
V/µs
Maximum peak reverse and
off-state leakage current
l RRM,
l DRM,
T J =T J maximum, rated V DRM /V RRM applied
100
mA
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1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
TRIGGERING
SYMBOL
PARAMETER
VALUES
TEST CONDITIONS
Maximum peak gate power
P GM
Maximum average gate power
I GM
Maximum peak positive gate voltage
+V GM
Maximum peak negative gate voltage
-V GM
T J = T J maximum, t p ≤ 5 ms
30
T J = T J maximum, f = 50 Hz, d% = 50
5
T J = T J maximum, t p ≤ 5 ms
3
W
P G(AV)
Maximum peak positive gate current
V
5
I GT
100
-
50
300
25
-
1.3
-
T J = 25°C
1.0
3.0
T J = 125°C
0.8
-
T J = 25°C
Maximum required gate
current/voltage are the lowest
value which will trigger all units
12V anode to cathode applied
T J = 125°C
T J = -40°C
DC gate voltage required to trigger
DC gate current not to trigger
V GT
l GD
T J = T J maximum
DC gate voltage not to trigger
A
20
T J = T J maximum, t p ≤ 5 ms
T J = -40°C
DC gate current required to trigger
UNIT
MAX.
TYP.
V GD
Maximum gate current/
voltage not to trigger is the
maximum value which will
not trigger any unit with rated
V DRM anode to cathode applied
mA
V
10
mA
0.25
V
VALUES
UNIT
THERMAL AND MECHANICAL SPECIFICATIONS
SYMBOL
PARAMETER
Maximum operating junction temperature range
Maximum storage temperature range
Maximum thermal resistance, junction to heatsink
TEST CONDITIONS
TJ
-40 to 125
T stg
-40 to 150
ºC
R th(J-hs)
DC operation single side cooled
0.040
DC operation double side cooled
0.020
DC operation single side cooled
0.006
DC operation double side cooled
0.003
K/W
Maximum thermal resistance, case to heatsink
R th(C-hs)
Mounting force, ±10%
Approximate weight
Case style
24500
(2500)
N
(kg)
500
g
TO-200AC (K-PUK), Nell’s D-type Capsule)
RthJC CONDUCTION
CONDUCTION ANGEL
SINUSOIDAL CONDUCTION
RECTANGULAR CONDUCTION
SINGLE SIDE
TEST CONDUCTIONS
UNITS
T J = T J maximum
K/W
DOUBLE SIDE
SINGLE SIDE
DOUBLE SIDE
180°
0.003
0.003
0.002
0.002
120°
90°
0.004
0.005
0.004
0.005
0.004
0.005
60°
0.007
0.007
0.007
0.004
0.005
0.007
30°
0.012
0.012
0.012
0.012
Note
• The table above shows the increment of thermal resistance RthJ-hs when devices operate at different conduction angles than DC
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Page 3 of 8
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.1 Current ratings characteristics
(Single side cooled)
R thJ-hs (DC) = 0.04 K/W
120
110
Conduction Angle
100
90
30°
60° 90°
120°
80
180°
130
Maximum allowable heatsink
temperature(˚C)
Maximum allowable heatsink
temperature(˚C)
130
Fig.2 Current ratings characteristics
70
0
110
Conduction Period
100
90
30°
60°
80
90°
120° 180°
DC
0
200
400
600
800 1000 1200 1400
Average on-state current (A)
Average on-state current (A)
Fig.3 Current ratings characteristics
Fig.4 Current ratings characteristics
130
(Double side cooled)
R thJ-hs (DC) = 0.02 K/W
120
110
100
Conduction Angle
90
80
70
60
30°
50
60°
90° 90°
120°
Maximum allowable heatsink
temperature(˚C)
Maximum allowable heatsink
temperature(˚C)
120
70
100 200 300 400 500 600 700 800 900
130
(Double side cooled)
R thJ-hs (DC) = 0.02 K/W
120
110
100
Conduction Period
90
30°
80
60°
90°
70
120°
180°
60
50
DC
180°
40
40
0
400
800
1200
1600
0
400
800
1200 1600
2400
2000
Average on-state current (A)
Average on-state current (A)
Fig.5 On-state power loss characteristics
Fig.6 On-state power loss characteristics
5000
6000
180°
4000
90°
3500
60°
30°
DC
5500
120°
3000
RMS Limit
2500
2000
1500
1000
Conduction Angle
500
Maximum average on-state
power loss(W)
4500
Maximum average on-state
power loss(W)
(Single side cooled)
R thJ-hs (DC) = 0.04 K/W
T J = 125°C
180°
120°
90°
5000
4500
60°
4000
30°
3500
RMS Limit
3000
2500
2000
1500
Conduction Period
1000
T J = 125°C
500
0
0
0
400
800
1200
1600
0
Average on-state current (A)
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500
1000
1500
2000
Average on-state current (A)
Page 4 of 8
2500
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.8 Maximum non-repetitive surge current
single and double side cooled
Peak half sine wave on-state current(A)
Peak half sine wave on-state current(A)
Fig.7 Maximum non-repetitive surge current
single and double side cooled
18000
At Any Rated Load Condition And With
Rated V RRM Applied Following Surge
initial T J = 125°C
@ 60Hz 0.0083 s
@ 50Hz 0.0100 s
16000
14000
12000
10000
8000
6000
1
100
10
22000
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration. Control
Of Conduction May Not Be Maintained
Initial T J = 125°C, @50Hz
No Voltage Reapplied
Rated V RRM Reapplied
20000
18000
16000
14000
12000
10000
8000
6000
0.01
0.1
Number of equal amplitude half cycle
current pulses (N)
1
Pulse train duration (S)
Instantaneous on-state current (A)
Fig.9 Maximum on-state voltage drop characteristcs
10000
T J = 25°C
5000
T J = 125°C
2000
1000
500
0.5
1
1.5
2
2.5
3
3.5
4.5
4
5
5.5
Instantaneous on-state voltage (V)
Transient thermal lmpedance Z th(J-hs) (K/W)
Fig.10 Thermal lmpedance Z th(J-hs) characteristics
0.1
Steady State Value
R th(J-hs) = 0.040 K/W
(Single Side Cooled)
R th(J-hs) = 0.020 K/W
(Double Side Cooled)
(DC Operation)
0.01
0.001
0.001
0.01
0.1
1
Square wave pulse duration (s)
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Page 5 of 8
10
100
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.11 Gate characteristics - Trigger limits
Fig.12 Gate characteristics - Power curves
6
20
Gate trigger voltage - V GT (V)
5
Max V G
4
l GT, V GT
1
0
-40°C
10°C
25°C
3
2
l GD, V GD
0
T J = 25°C
18
125°C
Gate trigger voltage, V GT (V)
T J = 25°C
Min V G
0.25
0.5
0.75
16
14
Max V G
12
10
8
P GM = 30W
6
4
P GM = 5W
2
0
1
Min V G
0
6
4
8
10
Gate trigger current, l GT (A)
Gate trigger current, l GT (A)
Fig.13 Total recovered charge, Q rr
Fig.14 Recovered charge, Q ra (50% chord)
10000
10000
T J = 125°C
Total recovered charge, Q rr (µC)
T J = 125°C
Recovered charge, Q ra ( µC )
2000A
1500A
1000A
500A
1000
2
10
100
2000A
1500A
1000A
500A
1000
1000
10
100
1000
Commutation rate-di/dt (A/µs)
Commutation rate-di/dt (A/µs)
Fig.15 Peak reverse recovery current, l rm
Fig.16 Maximum recovery time, t rr (50% chord)
100
2000A
1500A
T J = 125°C
T J = 125°C
Reverse recovery time, t rr (µs)
Reverse recovery current, l rm (A)
10000
1000A
500A
1000
10
100
Commutation rate, di/dt (A/µs)
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10
1
10
1000
2000A
1500A
1000A
500A
100
Commutation rate, di/dt (A/µs)
Page 6 of 8
1000
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.17 Reverse recovery energy per pulse
Fig.18 Sine wave energy per pulse
10 3
10
T J = 125°C
2000A
1500A
1000A
10 2
Energy per pulse (J)
Energy per pulse, E r (J)
Snubber
0.5µs, 6.8 Ohms
T J = 125°C
V rm = 67% V RRM
500A
10
5kA
3kA
1
2kA
1kA
10 -1
500A
1
10
100
10 -2
10 -5
1000
250A
Commutation rate, di/dt (A/µs)
10 -4
10 -3
Pulse width, (s)
ORDERING INFORMATION TABLE
Device code
1460 PTG
1
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2
30
D
0
3
4
5
1
-
Maximum average on-state current IT(AV), 1460 for 1460A
2
-
PTG = Distribute gate thyristor
3
-
Voltage code, cold × 100 = VRRM/VRRM
4
-
D = PUK case TO-200AC (K-PUK), Nell’s D-type Capsule
5
-
Terminal type, “0” for eyelet
Page 7 of 8
10 -2
1460PTG Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
TO-200AC (K-PUK)
Creepage distance: 28.88(1.137) minimum
Strike distance: 18.0(0.708) minimum
6.2(0.24) Min.
Ø74.0(2.91) MAX.
4.7 (0.18)
20°±5°
43.2 (1.70)
Ø3.5 (0.14) x 2.5 (0.1) deep, both ends
0.7(0.03) MIN.
Ø47.0±0.1(1.85)
2 places
Pin receptacle
AMP. 60598-1
27.6(1.09) MAX.
0.7(0.03) MIN.
Ø66(2.60) MAX.
K
G
All dimensions in millimeters (inches)
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Page 8 of 8
A