NKT500/NKH500 Series

RoHS
NKT500/NKH500 Series RoHS
SEMICONDUCTOR
Nell High Power Products
Thyristor/Diode and Thyristor/Thyristor, 500A
(SUPER MAGN-A-PAK Power Modules)
48
50
38
48
66+1
36+1
4-Ø6.5
14
SUPER MAGN-A-PAK
112+1
128+1
FEATURES
150+3
• High voltage
3-M10 SCREWS
• Electrically isolated by DBC ceramic (AI 2O3)
2.8x0.8+0.1
• 3500 V RMS isolating voltage
50
• Glass passivated chips
60
• High surge capability
53
22
• Industrial standard package
• Modules uses high voltage power thyristor/diodes in two
basic configurations
• Simple mounting
All dimensions in millimeters
• UL approved file E320098
• Compliant to RoHS
• Designed and qualified for multiple level
APPLICATIONS
• DC motor control and drives
K2
G2
• Battery charges
~
+
-
• Welders
G1
K1
• Power converters
NKT
• Lighting control
• Heat and temperature control
• Ups
~
+
G1
K1
NKH
PRODUCT SUMMARY
IT(AV)
500 A
MAJOR RATINGS AND CHARACTERISTICS
VALUE
UNITS
IT(AV)
85 °C
500
A
IT(RMS)
85 °C
785
50 Hz
16000
60 Hz
16800
50 Hz
1280
60 Hz
1167
SYMBOL
ITSM
I2t
CHARACTERISTICS
I2√t
A
kA2s
12800
kA2√s
VDRM / VRRM
Range
400 to 1600
V
TJ
Range
-40 to 125
°C
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Page 1 of 4
RoHS
NKT500/NKH500 Series RoHS
SEMICONDUCTOR
Nell High Power Products
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE
NUMBER
VOLTAGE
CODE
VRRM /V DRM , MAXIMUM REPETITIVE
PEAK REVERSE VOLTAGE
V
VRSM /V DSM , MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
04
400
500
08
800
900
10
1000
1100
12
1200
1300
14
1400
1500
16
1600
1700
NKT500
NKH500
IRRM /I DRM
AT 125 °C
mA
40
FORWARD CONDUCTION
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum average on-state current
at case temperature
IT(AV)
180° conduction, half sine wave ,50Hz
Maximum RMS on-state current
lT(RMS)
180° conduction, half sine wave ,50Hz ,TC = 85°C
Maximum peak, one-cycle, on-state
non-repetitive surge current
ITSM
I 2t
A
85
°C
785
16000
t = 8.3 ms
16800
No voltage
reapplied
t = 8.3 ms
t = 10 ms
t = 8.3 ms
Sine half wave,
initial TJ =
TJ maximum
100%V RRM
reapplied
UNITS
500
t = 10 ms
t = 10 ms
Maximum I 2t for fusing
VALUES
A
1280
1167
kA2s
896
818
Maximum I 2√t for fusing
2√
I t
t = 0.1 ms to 10 ms, no voltage reapplied
12800
Maximum on-state voltage drop
VTM
lTM = 1500A, TJ = 25 °C, 180° conduction
1.7
Maximum forward voltage drop
VFM
IFM = 1500A, TJ = 25 °C, 180° conduction
1.4
kA2√s
V
Maximum holding current
IH
Anode supply = 12 V initial I T = 30 A, TJ = 25 °C
300
Maximum latching current
IL
Anode supply = 12 V resistive load = 1 Ω
Gate pulse: 10 V, 100 μs, TJ = 25 °C
500
mA
SWITCHING
PARAMETER
SYMBOL
Typical delay time
td
Typical rise time
tr
TEST CONDITIONS
VALUES
TJ = 25 °C ,gate current = 1A, dlg/dt = 1 A/µs
2
V d = 0.67 % V DRM
4
UNITS
μs
Typical tum-off time
tq
ITM = 750A ; dl/dt = -60 A/µs ; TJ = TJ maximum,
VR = 50V ; dV/dt = 20V/µs ; gate 0V ,100Ω
200
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
40
mA
50 Hz, circuit to base,
all terminals shorted, 25°C, 1s
3500
V
T J = T J maximum,
linear to V D = 80% V DRM
1000
V/μs
Maximum peak reverse and
off-state leakage current
l RRM ,
l DRM
T J = 125°C
RMS isolation Voltage
V ISO
Critical rate of rise of
off-state voltage
dV/dt
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Page 2 of 4
RoHS
NKT500/NKH500 Series RoHS
SEMICONDUCTOR
Nell High Power Products
TRIGGERING
PARAMETER
SYMBOL
Maximum peak gate power
Maximum average gate power
TEST CONDITIONS
VALUES
PGM
t p ≤ 5 ms, TJ = TJ maximum
10
PG(AV)
f = 50 Hz, TJ = TJ maximum
3
IGM
Maximum peak gate current
Maximum peak positive
gate voltage
+VGM
Maximum peak negative
gate voltage
- VGM
Maximum required DC
gate voltage to trigger
5.0
VGD
Maximum gate current
that will not trigger
I GD
Maximum rate of rise of
turned-on current
dI/dt
V
2
Anode supply = 12 V,
resistive load; Ra = 1 Ω
I GT
Maximum gate voltage
that will not trigger
A
20
t p ≤ 5 ms, TJ = TJ maximum
TJ = 25 °C
gate current to trigger
W
3
VGT
Maximum required DC
UNITS
200
mA
0.25
V
10
mA
1000
A/μs
VALUES
UNITS
- 40 to 125
°C
TJ = TJ maximum, 67% V DRM applied
T J = T J maximum, I TM = 400A
rated V DRM applied
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
junction operating and storage
temperature range
TJ, Tstg
Maximum thermal resistance,
junction to case per junction
RthJC
DC operation
Typical thermal resistance,
case to heatsink per module
RthCS
Mounting surface, smooth , flat and greased
0.01
A mounting compound is recommended and the
torque should be rechecked after a period of
about 3 hours to allow for the
spread of the compound.
6 to 8
Mounting
torque
± 10 %
0.065
°C/W
SMAP to heatsink , M6
busbar to SMAP , M10
Approximate weight
Case style
N.m
12 to 15
1800
g
63.5
oz.
SUPER MAGN-A-PAK
ORDERING INFORMATION TABLE
Device code
www.nellsemi.com
NKT
500
1
2
/
16
3
1
-
Module type: NKT for (Thyristor + Thyristor) module
NKH for (Thyristor + Diode) module
2
-
Current rating: IT(AV)
3
-
Voltage code x 100 = V RRM
Page 3 of 4
RoHS
NKT500/NKH500 Series RoHS
SEMICONDUCTOR
Nell High Power Products
Fig.1 On-state current vs. voltage characteristics
Fig.2 Transient thermal impedance(junction-case)
3.6
On-state peak voltage (V)
3.2
Transient thermal impedance (°C/W)
0.07
T J = 125°C
2.8
2.4
2
1.6
1.2
0.8
100
1000
0.06
0.05
0.04
0.03
0.02
0.01
0
0.001
10000
0.01
0.1
On-state current (A)
Time (s)
Fig.4 Case temperature vs. on-state average current
Fig.3 Power consumption vs. average current
140
180°
0
600
ase temperature (°C)
Maximum power consumption (W)
800
120°
180
90°
Conduction Angle
60°
30°
400
200
120
180
0
100
Conduction Angle
80
60
40
20
30°
60°
90°
120° 180°
0
0
0
100
200
300
400
500
0
600
On-state average current (A)
200
400
600
800
1000
On-state average current (A)
2
Fig.5 On-state surge current vs cycles
Fig.6 I t characteristics
1500
18
16
1300
14
A S (1000A S)
1100
2
12
10
2
On-state surge current (KA)
10
1
8
900
700
500
6
4
300
1
10
100
Cycles @50Hz
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Page 4 of 4
10
1
Time (ms)