PYA28C64(X) 8K X 8 EEPROM FEATURES Access Times of 150, 200, 250 and 350ns Single 5V±10% Power Supply Fast Byte Write (200µs or 1 ms) Low Power CMOS: - 60 mA Active Current - 150 µA Standby Current Fast Write Cycle Time CMOS & TTL Compatible Inputs and Outputs Endurance: - 10,000 Write Cycles - 100,000 Write Cycles (optional) Data Retention: 10 Years Available in the following package: – 28-Pin 600 mil Ceramic DIP – 32-Pin Ceramic LCC (450x550 mils) RDY/BUSY pin is not connected for the PYA28C64X DESCRIPTION PIN CONFIGURATIONS The PYA28C64 is a 5 Volt 8Kx8 EEPROM. The PYA28C64 features DATA and RDY/BUSY (PYA28C64 only) to indicate early completion of a Write Cycle. Data Retention is 10 Years. The device is available in a 28-Pin 600 mil wide Ceramic DIP and 32-Pin LCC. DIP (C5-1) FUNCTIONAL BLOCK DIAGRAM LCC (L6) NOTE: The RDY/BUSY pin is not connected for the PYA28C64X. Document # EEPROM105 REV B Revised June 2012 PYA28C64 - 8K x 8 EEPROM OPERATION READ Read operations are initiated by both OE and CE LOW. The read operation is terminated by either CE or OE returning HIGH. This two line control architecture eliminates bus contention in a system environment. The data bus will be in a high impedance state when either OE or CE is HIGH. BYTE WRITE Write operations are initiated when both CE and WE are LOW and OE is HIGH. The PYA28C64 supports both a CE and WE controlled write cycle. That is, the address is latched by the falling edge of either CE or WE, whichever occurs last. Similarly, the data is latched internally by the rising edge of either CE or WE, whichever occurs first. A byte write operation, once initiated, will automatically continue to completion. CHIP CLEAR The contents of the entire memory of the PYA28C64 may be set to the high state by the CHIP CLEAR operation. By setting CE low and OE to 12 volts, the chip is cleared when a 10 msec low pulse is applied to WE. DEVICE IDENTIFICATION An extra 32 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12 ± 0.5V and using address locations 1FE0H to 1FFFH the additional bytes may be written to or read from in the same manner as the regular memory array. MAXIMUM RATINGS(1) Sym Parameter Value Unit VCC Power Supply Pin with Respect to GND -0.3 to +6.25 V VTERM Terminal Voltage with Respect to GND (up to 6.25V) -0.5 to +6.25 V TA Operating Temperature -55 to +125 °C TBIAS Temperature Under Bias -55 to +125 °C TSTG Storage Temperature -65 to +150 °C PT Power Dissipation 1.0 W IOUT DC Output Current 50 mA RECOMMENDED OPERATING CONDITIONS Grade(2) Ambient Temp GND VCC Military -55°C to +125°C 0V 5.0V ± 10% CAPACITANCES(4) (VCC = 5.0V, TA = 25°C, f = 1.0MHz) Sym Parameter CIN Input Capacitance COUT Output Capacitance Conditions Typ Unit VIN = 0V 10 pF VOUT = 0V 10 pF DATA POLLING The PYA28C64 features DATA Polling as a method to indicate to the host system that the byte write cycle has completed. DATA Polling allows a simple bit test operation to determine the status of the PYA28C64, eliminating additional interrupts or external hardware. During the internal programming cycle, any attempt to read the last byte written will produce the complement of that data on I/O7 (i.e., write data=0xxx xxxx, read data=1xxx xxxx). Once the programming cycle is complete, I/O7 will reflect true data. READY/BUSY Pin 1 is an open drain RDY/BUSY output that can be used to detect the end of a write cycle. RDY/BUSY is actively pulled low during the write cycle and is released at the completion of the write. The open drain connection allows for OR-tying of several devices to the same RDY/BUSY line. The RDY/BUSY pin is not connected for the PYA28C64X. Document # EEPROM105 REV B Page 2 PYA28C64 - 8K x 8 EEPROM DC ELECTRICAL CHARACTERISTICS (Over Recommended Operating Temperature & Supply Voltage)(2) Sym Parameter Test Conditions PYA28C64 Min Max Unit VIH Input High Voltage 2.0 VCC + 0.3 V VIL Input Low Voltage -0.5(3) 0.8 V VHC CMOS Input High Voltage VCC - 0.2 VCC + 0.5 V VLC CMOS Input Low Voltage -0.5(3) 0.2 V VOL Output Low Voltage (TTL Load) IOL = +2.1 mA, VCC = Min 0.45 V VOH Output High Voltage (TTL Load) IOH = -0.4 mA, VCC = Min ILI Input Leakage Current ILO Output Leakage Current VCC = Max VIN = GND to VCC VCC = Max, CE = VIH, VOUT = GND to VCC 2.4 V -10 +10 µA -10 +10 µA — 5 mA — 150 µA — 60 mA CE ≥ VIH, OE = VIL, ISB Standby Power Supply Current (TTL Input Levels) VCC = Max, f = Max, Outputs Open CE ≥ VHC, ISB1 Standby Power Supply Current (CMOS Input Levels) VCC = Max, f = 0, Outputs Open, VIN ≤ VLC or VIN ≥ VHC CE = OE = VIL, ICC Supply Current WE = VIH, All I/O's = Open, Inputs = VCC = 5.5V Notes: 1.Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to MAXIMUM rating conditions for extended periods may affect reliability. Document # EEPROM105 REV B 2.Extended temperature operation guaranteed with 400 linear feet per minute of air flow. 3. Transient inputs with VIL and IIL not more negative than -3.0V and -100mA, respectively, are permissible for pulse widths up to 20ns. 4. This parameter is sampled and not 100% tested. Page 3 PYA28C64 - 8K x 8 EEPROM AC ELECTRICAL CHARACTERISTICS—READ CYCLE (VCC = 5V ± 10%, All Temperature Ranges)(2) -150 -200 -250 -350 Sym Parameter tAVAV Read Cycle Time tAVQV Address Access Time 150 200 250 350 ns tELQV Chip Enable Access Time 150 200 250 350 ns tOLQV Output Enable Access Time 80 100 100 100 ns tELQX Chip Enable to Output in Low Z tEHQZ Chip Disable to to Output in High Z tOLQX Output Enable to Output in Low Z tOHQZ Output Disable to Output in High Z tAVQX Output Hold from Address Change Min Max 150 Min 200 0 0 Min 0 0 ns 0 ns ns 70 0 Unit ns 70 65 0 Max 0 65 60 0 Min 350 0 60 55 Max 250 0 55 0 Max ns ns TIMING WAVEFORM OF READ CYCLE Document # EEPROM105 REV B Page 4 PYA28C64 - 8K x 8 EEPROM AC CHARACTERISTICS—WRITE CYCLE (VCC = 5V ± 10%, All Temperature Ranges)(2) 150 / 200 / 250 / 350 Symbol Parameter tELRH tWLRH Write Cycle Time tAVEL tAVWL Address Setup Time 10 ns tELAX tWLAX Address Hold Time 50 ns tWLEL Write Setup Time 0 ns tWHEH Write Hold Time 0 ns tOHEL tOHWL OE Setup Time 10 ns tWHOL tEHOL2 OE Hold Time 10 ns tELEH tWLWH WE Pulse Width 100 tDVEH tDVWH Data Setup Time 50 ns tEHDX tWHDX Data Hold Time 10 ns tELWL CE Setup Time 0 ns tEHWH CE Hold Time 0 ns tEHRL tWHRL Time to device busy Document # EEPROM105 REV B Min Max 1 1000 50 Unit ms ns ns Page 5 PYA28C64 - 8K x 8 EEPROM TIMING WAVEFORM OF BYTE WRITE CYCLE (CE CONTROLLED) TIMING WAVEFORM OF BYTE WRITE CYCLE (WE CONTROLLED) Document # EEPROM105 REV B Page 6 PYA28C64 - 8K x 8 EEPROM AC TEST CONDITIONS Input Pulse Levels TRUTH TABLE GND to 3.0V Input Rise and Fall Times 10ns Input Timing Reference Level 1.5V Output Timing Reference Level 1.5V Output Load See Figure 1 Mode CE OE WE I/O Read L L H DOUT Write L H L DIN Write Inhibit X L X — Write Inhibit X X H — Standby H X X High Z Output Disable X H X High Z Figure 1. Output Load Document # EEPROM105 REV B Page 7 PYA28C64 - 8K x 8 EEPROM ORDERING INFORMATION Document # EEPROM105 REV B Page 8 PYA28C64 - 8K x 8 EEPROM SIDE BRAZED DUAL IN-LINE PACKAGE (600 mils) C5-1 Pkg # # Pins 28 (600 mil) Symbol Min Max A - 0.232 b 0.014 0.026 b2 0.045 0.065 C 0.008 0.018 D - 1.490 E 0.500 0.610 eA 0.600 BSC e 0.100 BSC L 0.125 0.200 Q 0.015 0.060 S1 0.005 - S2 0.005 - Pkg # L6 # Pins 32 RECTANGULAR LEADLESS CHIP CARRIER Symbol Min Max A 0.060 0.075 A1 0.050 0.065 B1 0.022 0.028 D 0.442 0.458 D1 0.300 BSC D2 0.150 BSC D3 - 0.458 E 0.540 0.560 E1 0.400 BSC E2 0.200 BSC E3 - 0.558 e 0.050 BSC h 0.040 REF j 0.020 REF L 0.045 0.055 L1 0.045 0.055 L2 0.075 0.095 ND 7 NE 9 Document # EEPROM105 REV B Page 9 PYA28C64 - 8K x 8 EEPROM REVISIONS DOCUMENT NUMBER EEPROM105 DOCUMENT TITLE PYA28C64(X) - 8K x 8 EEPROM REV ISSUE DATE ORIGINATOR OR Jul 2010 JDB New Data Sheet A Nov 2011 JDB Updated Ordering Info B Jun 2012 JDB Updated Ordering Info; Changed "Simple Byte Write" to " Fast Byte Write (200µs or 1 ms)" on p.1 Document # EEPROM105 REV B DESCRIPTION OF CHANGE Page 10