Product Specification Series: SMP 50Ω SMP Jacks / Plugs Adaptor SMP – Jack, Straight Orientation, Cable Terminated SMP – Full detent Plug, Straight Orientation, PCB Terminated Bullet Adaptor Other configurations available for: Plug Interface: Limited detent, Smooth bore, Catcher’s mitt Bullets, Through-hole, surface mount, edge mount, panel mount and mixed technology Termination to various cable types See www.samtec.com for more information. Revision: A Date: November 18, 2014 Page 1 © 2012 Samtec, Inc. Product Specification Series: SMP 50Ω SMP Jacks / Plugs Adaptor 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec SMP Series. These connectors are available in vertical, edge mount and right angle. All information contained in this specification is for a straight jack cable assembly to a straight full detent plug cable connector unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at http://www.samtec.com/rf/50-ohm/smp.aspx. 3.0 TESTING 3.1 ITEM Withstanding voltage Operating temperature IP66-IP68 testing RF405 RF25M RF25S BE25M BE25S 500 500 500 500 500 -40 to 125 -65 to 165 -65 to 165 -65 to 165 -65 to 165 N/A N/A N/A N/A N/A Note: IP66-IP68 testing at the panel interface only. 3.2 Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) See Section 3.1 Pass Insulation Resistance EIA-364-21 (5000 MΩ minimum) 15,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass 3.3 Mechanical: ITEM TEST CONDITION REQUIREMENT 100 cycles (w/Env.) 1000 cycles (w/o Env) STATUS Durability EIA-364-09C Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, half sine, 12.3 ft/s, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Event Detection: No interruption > 1.0 microsecond Pass Normal Force EIA-364-04 30 grams minimum for gold interface Pass Revision: A Date: November 18, 2014 Page 2 Pass © 2012 Samtec, Inc. Product Specification Series: SMP 50Ω SMP Jacks / Plugs Adaptor 3.4 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 825 VAC IR: >15,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 HIGH SPEED PERFORMANCE 4.1 Frequency Range: RF405 Cable type SMP Orientation Frequency Range RF25M RF25S BE25M BE25S RA ST RA ST RA ST RA ST RA ST 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 0-20GHz 4.2 Impedance: 50 ohm 4.3 Rating: up to 40 GHz 5.0 PROCESSING RECOMMENDATIONS FOR REFLOW SOLDERED PARTS 5.1 5.2 5.3 5.4 Maximum Reflow Passes: The parts can withstand 3 reflow passes at a maximum oven temperature of 260°C. Stencil Thickness: The recommended stencil thickness is .006” (.15 mm). Placement: Manual placement of the parts is recommended. Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type, component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering results. 5.5 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. Revision: A Date: November 18, 2014 Page 3 © 2012 Samtec, Inc. Product Specification Series: SMP 50Ω SMP Jacks / Plugs Adaptor 5.6 Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 5.7 Misalignment information: Bullet Length Radial Misalignment Axial Misalignment Mated Height -0645 +/-0.50mm +/-0.25mm 9.55mm -1450 +/-0.50mm +/-0.25mm 17.60mm Revision: A Date: November 18, 2014 Page 4 © 2012 Samtec, Inc. Product Specification Series: SMP 50Ω SMP Jacks / Plugs Adaptor 6.0 APPLICATION INFORMATION 6.1 Min Cable Bend Radius: .125 in 6.2 Cable Retention: 15 LBS (Typical) 6.3 Engagement Force: -PF: 15 lbs. max; -PL: 10 lbs. max; -PS & -PC: 2 lbs. max Disengagement Force: -PF: 2 lbs. max; -PL: 2 lbs. max; -PS & -PC: 0.5 lbs. max 7.0 ADDITIONAL RESOURCES 7.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 7.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 7.3 For additional processing information, contact our Interconnect Processing Group at [email protected] 7.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] Revision: A Date: November 18, 2014 Page 5 © 2012 Samtec, Inc.