STG8810 Gr Pr S a mHop Microelectronics C orp. Ver 2.0 Dual N-Channel Enhancement Mode Field Effect Transistor PRODUCT SUMMARY V DSS ID R DS(ON) (m Ω) Max FEATURES Super high dense cell design for low R DS(ON). Rugged and reliable. 18.5 @ VGS=4.5V Suface Mount Package. 19.5 @ VGS=4.0V 20V 7A ESD HBM > 2KV. 20.0 @ VGS=3.7V 23.0 @ VGS=3.1V 28.5 @ VGS=2.5V D 1/D 2 S1 S1 G1 8 7 6 5 1 2 3 4 D2 D1 T S S OP D 1/D 2 S2 S2 G2 G1 (T OP V IE W) G2 S1 S2 ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted ) Symbol VDS VGS Parameter Drain-Source Voltage Gate-Source Voltage ID Drain Current-Continuous IDM PD TJ, TSTG -Pulsed TA=25°C TA=70°C a b Maximum Power Dissipation a Limit 20 ±12 Units V V 7.0 A 5.6 A 28 A TA=25°C 1.5 W TA=70°C 1 W -55 to 150 °C 85 °C/W Operating Junction and Storage Temperature Range THERMAL CHARACTERISTICS R JA Thermal Resistance, Junction-to-Ambient a Details are subject to change without notice. May,20,2011 1 www.samhop.com.tw STG8810 Ver 2.0 ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted ) Symbol Parameter Conditions OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS Gate-Body Leakage Current IGSS ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) Drain-Source On-State Resistance VGS=0V , ID=250uA Forward Transconductance Typ 1 ±10 VGS= ±12V , VDS=0V VDS=VGS , ID=1mA VGS=4.5V , ID=3.5A VGS=4.0V , ID=3.5A VGS=3.7V , ID=3.5A VDS=5V , ID=3.5A Max 20 VDS=16V , VGS=0V VGS=3.1V , ID=3.5A VGS=2.5V , ID=3.5A gFS Min 0.5 0.9 14.0 14.5 15.0 16.0 16.5 17.0 18.0 17.5 19.5 23.5 19 Units V uA uA 1.5 V 18.5 m ohm 19.5 m ohm 20.0 m ohm 23.0 m ohm 28.5 m ohm S c DYNAMIC CHARACTERISTICS Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg VDS=10V,VGS=0V f=1.0MHz Gate-Source Charge Qgd Gate-Drain Charge pF pF pF 61 ns 295 ns 821 ns c VDD=16V ID=3.5A VGS=4.5V RGEN= 6 ohm Total Gate Charge Qgs 300 151 71 VDS=16V,ID=7A, VGS=4.5V DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Diode Forward Voltage VSD VGS=0V,IS=1.0A 580 ns 9 nC 1.5 nC 5 nC 0.78 1.2 V Notes _ 10sec. a.Surface Mounted on FR4 Board,t < _ 1%. _ 10us, Duty Cycle < b.Pulse Test:Pulse Width < c.Guaranteed by design, not subject to production testing. May,20,2011 2 www.samhop.com.tw STG8810 Ver 2.0 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 3 PT - Total Power Dissipation - W dT - Percentage of rated Power - % 120 100 80 60 40 20 2.5 2 Mounted on FR-4 board of 1 inch2 , 2oz 1.5 1 0.5 0 0 0 25 50 75 100 125 150 0 175 25 50 75 100 125 150 175 TA - Ambient Temperature - °C TA - Ambient Temperature - °C FORWARD BIAS SAFE OPERATING AREA 10 R (O N) it Lim DS 10us 100us 1ms 1 10ms 100ms 1s 0.1 VGS=4.5V Single Pulse TA=25 C 0.01 0.1 DC 1 10 VDS - Drain to Source Voltage - V TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1000 rth(ch-A) - Transient Thermal Resistance - °C/W ID - Drain Current - A 100 Mounted on FR-4 board of 1 inch2 , 2oz 100 10 1 Single Pulse 0.1 0.001 0.01 0.1 1 10 100 1000 PW - Pulse Width - s May,20,2011 3 www.samhop.com.tw STG8810 Ver 2.0 FORWARD TRANSFER CHARACTERISTICS DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 100 30 4.0 V ID - Drain Current - A ID - Drain Current - A 3.7 V VGS = 4.5 V 3.1 V 20 2.5 V 10 10 125°C 1 TA = -25°C 25°C 0.1 75°C 0.01 0 0 0.2 0.4 0.6 0.8 0.5 0 1 ЮyfsЮ- Forward Transfer Admittance - S VGS(off) - Gate to Source Cut-off Voltage - V 1.1 ID = 1.0mA 1.0 0.9 0.8 0.7 0.6 50 100 150 RDS(on) - Drain to Source On-state Resistance - mΩ RDS(on) - Drain to Source On-state Resistance - mΩ VGS = 2.5 V 3.1 V 3.7 V 4.0 V 4.5 V 20 10 0 0.1 1 10 3 TA = -25°C 10 25°C 1 75°C 125°C 0.1 0.01 0.01 0.1 1 10 100 ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT 50 30 2.5 100 Tch - Channel Temperature - °C 40 2 FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT GATEBTO SOURE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE 0 1.5 VGS - Gate to Source Voltage - V VDS - Drain to Source Voltage - V 0.5 -50 1 100 ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 40 ID = 3.5 A 30 20 10 0 0 2 4 6 8 10 12 VGS - Gate to Source Voltage - V May,20,2011 4 www.samhop.com.tw STG8810 CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 40 30 Ciss, Coss, Crss - Capacitance - pF VGS = 2.5 V 3.1 V 3.7 V 4.0 V 4.5 V 1000 ID = 3.5 A 20 10 0 -50 0 50 100 Coss Ciss 100 Crss 10 0.1 150 1 10 100 Tch - Channel Temperature - °C VDS - Drain to Source Voltage - V SWITCHING CHARACTERISTICS DYNAMIC INPUT CHARACTERISTICS VDD = 16.0 V VGS = 4.5 V RG = 6 Ω 1000 VGS - Gate to Drain Voltage - V td(on), tr, td(off), tf - Switching Time - ns RDS(on) - Drain to Source On-state Resistance - mΩ Ver 2.0 td(off) tf tr 100 td(on) 4 VDD = 4.0 V 10 V 16 V 3 2 1 ID = 7 A 10 0 0.1 1 10 0 2 4 6 8 10 QG - Gate Charge -nC ID - Drain Current - A SOURCE TO DRAIN DIODE FORWARD VOLTAGE IF - Diode Forward Current - A 100 10 1 0.1 VGS = 0 V 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 VF(S-D) - Source to Drain Voltage - V May,20,2011 5 www.samhop.com.tw STG8810 Ver 2.0 PACKAGE OUTLINE DIMENSIONS DETAIL A T S S OP -8 DETAIL A MIN 0.85 0.80 0.19 MAX MIN 0.033 0.031 0.007 0.30 MAX 0.012 2 2 3 3 Notes: 1. This drawing is for general information only.Refer to JEDEC Drawing MO-153,Variation AA,for proper dimensions,tolerances,datums,etc. 2. Dimension D does not include mold Flash,protrusions or gate burrs.Mold Flash,protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E does not include inter-lead Flash or protrusions.Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion.Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition.Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E to be determined at Datum Plane H. May,20,2011 6 www.samhop.com.tw STG8810 Ver 2.0 TSSOP-8 Tape and Reel Data TSSOP-8 Carrier Tape UNIT : р PACKAGE TSSOP 8 A0 6.08 B0 4.40 K0 D0 D1 E E1 E2 P0 P1 P2 T 1.60 ӿ1.50 + 0.1 - 0.0 ӿ1.50 + 0.1 - 0.0 12.00 ² 0.3 1.75 5.50 ² 0.05 8.00 4.00 2.00 ²0.05 0.30 ²0.05 W W1 H K S G R 16.0 ӿ13.0 + 0.5 - 0.2 10.6 2.0 ²0.5 TSSOP-8 Reel UNIT : р TAPE SIZE 12 р REEL SIZE ӿ330 M 330 N 100 12.5 V May,20,2011 7 www.samhop.com.tw